JP2009182236A - 半導体装置の配線基板、半導体装置、電子装置及びマザーボード - Google Patents
半導体装置の配線基板、半導体装置、電子装置及びマザーボード Download PDFInfo
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- JP2009182236A JP2009182236A JP2008021376A JP2008021376A JP2009182236A JP 2009182236 A JP2009182236 A JP 2009182236A JP 2008021376 A JP2008021376 A JP 2008021376A JP 2008021376 A JP2008021376 A JP 2008021376A JP 2009182236 A JP2009182236 A JP 2009182236A
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
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- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
【解決手段】配線基板1は、基材、基材に設けられたソルダーレジスト、ランド9、配線25、配線25とランド9を接続する接続部26を有している。接続部26の幅は配線25の幅より大きく、かつランド9の幅(直径)より小さく、配線25からランド9に向かって幅広になるように構成されているため、メカニカル衝撃や熱衝撃などによる接続部26の切断を防ぐ事が可能となる。また、接続部26には非平坦部としての凹部が設けられている。ランド9にハンダボールが搭載されると、ハンダボールは接続部26とも接触し、凹部にハンダが入り込む。これにより、接続部26と、ハンダボールとの接続面積が広くなり、接続部26とハンダボールの接続強度が向上する。
【選択図】図3
Description
3…………半導体装置
5…………半導体チップ
7…………封止部
9…………ランド
11………ハンダボール
13………基材
15………接続パッド
17………ワイヤ
19………電極パッド
21a……ソルダーレジスト
21b……ソルダーレジスト
23………接着剤
25………配線
26………接続部
31………凹部
35………配線母基板
37………製品形成領域
39………枠部
41………ダイシングライン
43………位置決め孔
45………銅層
47………フォトレジスト
53………マウントツール
65………マザーボード
67a……ソルダーレジスト
69………ランド
71………基材
101……電子装置
Claims (20)
- 基材と、
前記基材上に設けられ、コンタクト部材を搭載するランドと、
前記基材上に設けられ、前記ランドに接続される配線と、
前記基材上の、前記配線と前記ランドの間に設けられ、前記ランドと前記配線を接続すると共に、前記コンタクト部材と接触する接続部と、
前記基材の表面を覆うように設けられ、かつ前記ランドと前記接続部とは接触しないように設けられたソルダーレジストと、
を有し、
前記接続部は、
前記配線の幅以上、前記ランドの幅以下の幅を有し、さらに前記配線から前記ランドに向かって幅広がりな構造を有し、
前記コンタクト部材と接触する部分の表面には非平坦部が設けられていることを特徴とする半導体装置の配線基板。 - 前記接続部は、前記ランドの中心と前記基材の中心を結ぶ直線方向以外の方向で前記ランドと前記配線を接続するように設けられていること、もしくは半導体チップを設けた際に、前記半導体チップの外周の辺のなす方向に対して傾斜した方向で前記ランドと前記配線を接続するように設けられていること、を特徴とする請求項1記載の半導体装置の配線基板。
- 前記非平坦部は、前記接続部から前記ランドへ向けて延在して設けられていることを特徴とする請求項1記載の半導体装置の配線基板。
- 前記非平坦部は、平面形状が多角形であり、
前記多角形を構成する角部の角度が90°以上であることを特徴とする請求項1記載の半導体装置の配線基板。 - 前記非平坦部は、貫通孔、凹部、凸部のいずれかであることを特徴とする請求項1記載の半導体装置の配線基板。
- 前記非平坦部は、複数設けられていることを特徴とする請求項5記載の半導体装置の配線基板。
- 基材と、前記基材の一方の面に設けられた接続パッドと、前記基材の他の面に設けられ、前記接続パッドと電気的に接続された配線と、前記基材の他の面に設けられ、前記配線と電気的に接続されたランドと、前記ランドと前記配線の一部が露出するように前記基材の他の面に設けられたソルダーレジストと、からなる配線基板と、
前記配線基板の一面に搭載され、前記接続パッドと電気的に接続された半導体チップと、少なくとも前記配線基板の一面と半導体チップの一部や全面を覆う封止体とを有する半導体装置において、
前記配線基板は、請求項1〜請求項6のいずれかに記載の半導体装置の配線基板であることを特徴とする半導体装置。 - 前記半導体チップは、平面形状が矩形であり、
前記接続部および前記配線は、前記ランドへの接続方向が、前記基材の外周の辺のなす方向に対して傾斜した方向となるように設けられていることを特徴とする請求項7記載の半導体装置。 - 請求項1〜請求項6のいずれかに記載の半導体装置の配線基板の特徴を有するマザーボード。
- 請求項7または8記載の半導体装置を実装したマザーボードを備えていること、または請求項9記載のマザーボードを備えていることを特徴とする電子装置。
- 基材上に金属薄膜を形成した後に、前記金属薄膜を選択的にエッチングすることにより、
ランドと、
前記ランドに接続される配線と、
前記配線と前記ランドの間に設けられ、前記ランドと前記配線を接続すると共に、コンタクト部材と接触する接続部と、
を配置する工程を有し、
前記工程は、前記接続部の幅を、前記配線の幅よりも大きく、前記ランドの幅よりも小さい形状に形成し、さらに前記配線から前記ランドに向かって幅広がりな形状となるように形成し、かつ前記接続部の前記コンタクト部材と接触する部分の表面に非平坦部を設ける工程を有することを特徴とする半導体装置の配線基板の製造方法。 - 前記接続部は、前記ランドの中心と前記基材の中心を結ぶ直線方向以外の方向で前記ランドと前記配線を接続するように設けられていることを特徴とする請求項11記載の半導体装置の配線基板の製造方法。
- 前記工程は、
前記非平坦部を、前記接続部から前記ランドへ向けて延在して設ける工程を有することを特徴とする請求項11記載の半導体装置の配線基板の製造方法。 - 前記工程は、
前記非平坦部を、平面形状が多角形であり、前記多角形を構成する角部の角度が90°以上となるような形状に形成する工程を有することを特徴とする請求項11記載の半導体装置の配線基板の製造方法。 - 前記工程は、
前記非平坦部を、貫通孔、凹部、凸部のいずれかの形状として形成する工程を有することを特徴とする請求項11記載の半導体装置の配線基板の製造方法。 - 前記工程は、
前記非平坦部を、複数設ける工程を有することを特徴とする請求項11記載の半導体装置の配線基板の製造方法。 - 基材の表面を部分的に覆うようにソルダーレジストを設ける工程をさらに有し、
前記工程は、前記基材上に、前記ランドと接触しないように、前記ソルダーレジストを設ける工程であることを特徴とする請求項11〜請求項16のいずれかに記載の半導体装置の配線基板の製造方法。 - 前記ランドおよび前記接続部の一部にコンタクト部材を設ける工程をさらに有することを特徴とする請求項17記載の半導体装置の配線基板の製造方法。
- 請求項1〜請求項6のいずれかに記載の半導体装置の配線基板上に半導体チップを搭載し、少なくとも前記半導体装置の配線基板の一面と半導体チップの一部や全面を封止体で覆い、前記ランド上にコンタクト部材を配置して前記ランドと前記半導体チップを電気的に接続し、半導体装置を製造する工程と、
前記半導体装置をマザーボード上に実装する工程と、
を有することを特徴とする電子装置の製造方法。 - 請求項1〜請求項6のいずれかに記載の半導体装置の配線基板の特徴を有するマザーボードの製造工程と、
前記マザーボード上に半導体装置や電子部品を実装する工程と、
を有することを特徴とする電子装置の製造方法。
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JP2017022149A (ja) * | 2015-07-07 | 2017-01-26 | 日立オートモティブシステムズ株式会社 | 配線基板 |
KR20200028209A (ko) * | 2018-09-06 | 2020-03-16 | 주식회사 지로이아이 | Psr 적용 쓰루홀 타입 단면 인쇄회로기판 및 그 제조방법 |
KR20200031816A (ko) * | 2018-09-17 | 2020-03-25 | 주식회사 지로이아이 | 쓰루홀 타입 단면형 인쇄회로기판 및 그 제조방법 |
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