JP2009124099A - 半導体チップの電極構造 - Google Patents

半導体チップの電極構造 Download PDF

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Publication number
JP2009124099A
JP2009124099A JP2008150538A JP2008150538A JP2009124099A JP 2009124099 A JP2009124099 A JP 2009124099A JP 2008150538 A JP2008150538 A JP 2008150538A JP 2008150538 A JP2008150538 A JP 2008150538A JP 2009124099 A JP2009124099 A JP 2009124099A
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JP
Japan
Prior art keywords
metal
semiconductor chip
electrode structure
dummy
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008150538A
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English (en)
Japanese (ja)
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JP2009124099A5 (https=
Inventor
Noriyuki Nagai
紀行 永井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2008150538A priority Critical patent/JP2009124099A/ja
Priority to US12/239,119 priority patent/US8089156B2/en
Publication of JP2009124099A publication Critical patent/JP2009124099A/ja
Publication of JP2009124099A5 publication Critical patent/JP2009124099A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2008150538A 2007-10-24 2008-06-09 半導体チップの電極構造 Pending JP2009124099A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008150538A JP2009124099A (ja) 2007-10-24 2008-06-09 半導体チップの電極構造
US12/239,119 US8089156B2 (en) 2007-10-24 2008-09-26 Electrode structure for semiconductor chip with crack suppressing dummy metal patterns

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007276727 2007-10-24
JP2008150538A JP2009124099A (ja) 2007-10-24 2008-06-09 半導体チップの電極構造

Publications (2)

Publication Number Publication Date
JP2009124099A true JP2009124099A (ja) 2009-06-04
JP2009124099A5 JP2009124099A5 (https=) 2011-05-19

Family

ID=40815894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008150538A Pending JP2009124099A (ja) 2007-10-24 2008-06-09 半導体チップの電極構造

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Country Link
JP (1) JP2009124099A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171253A (ja) * 2009-01-23 2010-08-05 Toshiba Corp 半導体装置およびその製造方法
WO2011083524A1 (ja) * 2010-01-05 2011-07-14 パナソニック株式会社 半導体装置及びその製造方法
US10797032B2 (en) 2018-04-25 2020-10-06 Sharp Kabushiki Kaisha Light-emitting element module
JP2022537295A (ja) * 2020-03-13 2022-08-25 チップモア テクノロジー コーポレーション リミテッド ボール植え付け構造および製造プロセス
JP2023036718A (ja) * 2017-05-30 2023-03-14 ローム株式会社 Ｍｅｍｓ素子およびｍｅｍｓモジュール

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853837A (ja) * 1981-09-25 1983-03-30 Sharp Corp 電子回路部品の接続方法
JPH01114055A (ja) * 1987-10-28 1989-05-02 Seiko Epson Corp 半田付バンプ型電極
JPH10233398A (ja) * 1997-02-20 1998-09-02 Ricoh Co Ltd 半導体装置
JP2003318177A (ja) * 2002-04-19 2003-11-07 Sharp Corp 半導体集積回路装置
JP2004207509A (ja) * 2002-12-25 2004-07-22 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP2004214594A (ja) * 2002-11-15 2004-07-29 Sharp Corp 半導体装置およびその製造方法
JP2005183641A (ja) * 2003-12-19 2005-07-07 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2005260207A (ja) * 2004-02-10 2005-09-22 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2006019550A (ja) * 2004-07-02 2006-01-19 Murata Mfg Co Ltd 半田バンプ電極構造
JP2007036021A (ja) * 2005-07-28 2007-02-08 Seiko Epson Corp 半導体装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853837A (ja) * 1981-09-25 1983-03-30 Sharp Corp 電子回路部品の接続方法
JPH01114055A (ja) * 1987-10-28 1989-05-02 Seiko Epson Corp 半田付バンプ型電極
JPH10233398A (ja) * 1997-02-20 1998-09-02 Ricoh Co Ltd 半導体装置
JP2003318177A (ja) * 2002-04-19 2003-11-07 Sharp Corp 半導体集積回路装置
JP2004214594A (ja) * 2002-11-15 2004-07-29 Sharp Corp 半導体装置およびその製造方法
JP2004207509A (ja) * 2002-12-25 2004-07-22 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP2005183641A (ja) * 2003-12-19 2005-07-07 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2005260207A (ja) * 2004-02-10 2005-09-22 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2006019550A (ja) * 2004-07-02 2006-01-19 Murata Mfg Co Ltd 半田バンプ電極構造
JP2007036021A (ja) * 2005-07-28 2007-02-08 Seiko Epson Corp 半導体装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171253A (ja) * 2009-01-23 2010-08-05 Toshiba Corp 半導体装置およびその製造方法
WO2011083524A1 (ja) * 2010-01-05 2011-07-14 パナソニック株式会社 半導体装置及びその製造方法
JP2011142119A (ja) * 2010-01-05 2011-07-21 Panasonic Corp 半導体装置及びその製造方法
US8575749B2 (en) 2010-01-05 2013-11-05 Panasonic Corporation Semiconductor device and method for fabricating the same
JP2023036718A (ja) * 2017-05-30 2023-03-14 ローム株式会社 Ｍｅｍｓ素子およびｍｅｍｓモジュール
JP7408764B2 (ja) 2017-05-30 2024-01-05 ローム株式会社 Ｍｅｍｓ素子およびｍｅｍｓモジュール
US10797032B2 (en) 2018-04-25 2020-10-06 Sharp Kabushiki Kaisha Light-emitting element module
JP2022537295A (ja) * 2020-03-13 2022-08-25 チップモア テクノロジー コーポレーション リミテッド ボール植え付け構造および製造プロセス

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