JP2009124099A5 - - Google Patents

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Publication number
JP2009124099A5
JP2009124099A5 JP2008150538A JP2008150538A JP2009124099A5 JP 2009124099 A5 JP2009124099 A5 JP 2009124099A5 JP 2008150538 A JP2008150538 A JP 2008150538A JP 2008150538 A JP2008150538 A JP 2008150538A JP 2009124099 A5 JP2009124099 A5 JP 2009124099A5
Authority
JP
Japan
Prior art keywords
metal
semiconductor chip
electrode structure
dummy
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008150538A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009124099A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008150538A priority Critical patent/JP2009124099A/ja
Priority claimed from JP2008150538A external-priority patent/JP2009124099A/ja
Priority to US12/239,119 priority patent/US8089156B2/en
Publication of JP2009124099A publication Critical patent/JP2009124099A/ja
Publication of JP2009124099A5 publication Critical patent/JP2009124099A5/ja
Pending legal-status Critical Current

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JP2008150538A 2007-10-24 2008-06-09 半導体チップの電極構造 Pending JP2009124099A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008150538A JP2009124099A (ja) 2007-10-24 2008-06-09 半導体チップの電極構造
US12/239,119 US8089156B2 (en) 2007-10-24 2008-09-26 Electrode structure for semiconductor chip with crack suppressing dummy metal patterns

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007276727 2007-10-24
JP2008150538A JP2009124099A (ja) 2007-10-24 2008-06-09 半導体チップの電極構造

Publications (2)

Publication Number Publication Date
JP2009124099A JP2009124099A (ja) 2009-06-04
JP2009124099A5 true JP2009124099A5 (https=) 2011-05-19

Family

ID=40815894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008150538A Pending JP2009124099A (ja) 2007-10-24 2008-06-09 半導体チップの電極構造

Country Status (1)

Country Link
JP (1) JP2009124099A (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5284125B2 (ja) * 2009-01-23 2013-09-11 株式会社東芝 半導体装置およびその製造方法
JP5357784B2 (ja) * 2010-01-05 2013-12-04 パナソニック株式会社 半導体装置及びその製造方法
US10597288B2 (en) * 2017-05-30 2020-03-24 Rohm Co., Ltd. MEMS-device manufacturing method, MEMS device, and MEMS module
JP7267683B2 (ja) 2018-04-25 2023-05-02 シャープ株式会社 発光素子モジュール
CN111341746A (zh) * 2020-03-13 2020-06-26 颀中科技（苏州）有限公司 植球结构及制备工艺

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853837A (ja) * 1981-09-25 1983-03-30 Sharp Corp 電子回路部品の接続方法
JPH01114055A (ja) * 1987-10-28 1989-05-02 Seiko Epson Corp 半田付バンプ型電極
JPH10233398A (ja) * 1997-02-20 1998-09-02 Ricoh Co Ltd 半導体装置
JP3961335B2 (ja) * 2002-04-19 2007-08-22 シャープ株式会社 半導体集積回路装置
JP2004214594A (ja) * 2002-11-15 2004-07-29 Sharp Corp 半導体装置およびその製造方法
JP2004207509A (ja) * 2002-12-25 2004-07-22 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP2005183641A (ja) * 2003-12-19 2005-07-07 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP3880600B2 (ja) * 2004-02-10 2007-02-14 松下電器産業株式会社 半導体装置およびその製造方法
JP4360293B2 (ja) * 2004-07-02 2009-11-11 株式会社村田製作所 半田バンプ電極構造
JP2007036021A (ja) * 2005-07-28 2007-02-08 Seiko Epson Corp 半導体装置

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