JP2015510277A5 - - Google Patents
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- Publication number
- JP2015510277A5 JP2015510277A5 JP2014559986A JP2014559986A JP2015510277A5 JP 2015510277 A5 JP2015510277 A5 JP 2015510277A5 JP 2014559986 A JP2014559986 A JP 2014559986A JP 2014559986 A JP2014559986 A JP 2014559986A JP 2015510277 A5 JP2015510277 A5 JP 2015510277A5
- Authority
- JP
- Japan
- Prior art keywords
- carrier package
- semiconductor laser
- substrate
- laser chip
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 10
- 238000007373 indentation Methods 0.000 claims 6
- 230000005693 optoelectronics Effects 0.000 claims 4
- 239000012778 molding material Substances 0.000 claims 3
- 238000005538 encapsulation Methods 0.000 claims 2
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/411,275 | 2012-03-02 | ||
| US13/411,275 US8791492B2 (en) | 2009-10-01 | 2012-03-02 | Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same |
| PCT/US2013/027987 WO2013130580A2 (en) | 2012-03-02 | 2013-02-27 | Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015510277A JP2015510277A (ja) | 2015-04-02 |
| JP2015510277A5 true JP2015510277A5 (https=) | 2015-06-11 |
Family
ID=47846203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014559986A Pending JP2015510277A (ja) | 2012-03-02 | 2013-02-27 | 基板上で成形されたカプセル化くぼみを有する半導体レーザチップパッケージ及びこれを形成するための方法 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP2820726B1 (https=) |
| JP (1) | JP2015510277A (https=) |
| KR (1) | KR20140131974A (https=) |
| HK (1) | HK1204158A1 (https=) |
| TW (1) | TW201344994A (https=) |
| WO (1) | WO2013130580A2 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015114292A1 (de) * | 2015-08-27 | 2017-03-02 | Osram Opto Semiconductors Gmbh | Laserbauelement und Verfahren zu seiner Herstellung |
| DE102016101942B4 (de) | 2016-02-04 | 2022-07-21 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung |
| WO2019190676A1 (en) * | 2018-03-30 | 2019-10-03 | Applied Materials, Inc. | Integrating 3d printing into multi-process fabrication schemes |
| CN113972554A (zh) * | 2020-07-24 | 2022-01-25 | 上海禾赛科技有限公司 | 激光器封装结构、激光器芯片的封装方法及激光雷达 |
| WO2022102411A1 (ja) | 2020-11-13 | 2022-05-19 | ローム株式会社 | 半導体発光装置 |
| JP2024122659A (ja) * | 2023-02-28 | 2024-09-09 | 京セラ株式会社 | レーザ素子、レーザモジュール、およびレーザ素子の製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59193083A (ja) * | 1983-04-15 | 1984-11-01 | Hitachi Ltd | フアイバ装着用半導体レ−ザ装置 |
| JPS61272987A (ja) * | 1985-05-29 | 1986-12-03 | Hitachi Ltd | 半導体レ−ザ素子 |
| JPS62120372U (https=) * | 1986-01-23 | 1987-07-30 | ||
| US5852696A (en) * | 1994-06-29 | 1998-12-22 | British Telecommunications Public Limited Company | Packaged optical device |
| US5627851A (en) * | 1995-02-10 | 1997-05-06 | Ricoh Company, Ltd. | Semiconductor light emitting device |
| JP2002042365A (ja) * | 2000-07-21 | 2002-02-08 | Sankyo Seiki Mfg Co Ltd | 光ヘッド装置の光源装置 |
| JP2002217479A (ja) * | 2001-01-17 | 2002-08-02 | Sankyo Seiki Mfg Co Ltd | レーザ光源装置、レーザ光源装置の製造方法、および光ヘッド装置 |
| WO2002103866A1 (en) * | 2001-06-15 | 2002-12-27 | Nichia Corporation | Semiconductor laser element, and its manufacturing method |
| US8431951B2 (en) * | 2009-10-01 | 2013-04-30 | Excelitas Canada, Inc. | Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation |
| US8791492B2 (en) * | 2009-10-01 | 2014-07-29 | Excelitas Canada, Inc. | Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same |
-
2013
- 2013-02-27 JP JP2014559986A patent/JP2015510277A/ja active Pending
- 2013-02-27 KR KR1020147026633A patent/KR20140131974A/ko not_active Ceased
- 2013-02-27 WO PCT/US2013/027987 patent/WO2013130580A2/en not_active Ceased
- 2013-02-27 EP EP13709016.3A patent/EP2820726B1/en active Active
- 2013-02-27 HK HK15104312.6A patent/HK1204158A1/xx unknown
- 2013-03-01 TW TW102107283A patent/TW201344994A/zh unknown
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