JP2011171739A5 - - Google Patents
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- Publication number
- JP2011171739A5 JP2011171739A5 JP2011033514A JP2011033514A JP2011171739A5 JP 2011171739 A5 JP2011171739 A5 JP 2011171739A5 JP 2011033514 A JP2011033514 A JP 2011033514A JP 2011033514 A JP2011033514 A JP 2011033514A JP 2011171739 A5 JP2011171739 A5 JP 2011171739A5
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- substrate
- emitting device
- semiconductor layer
- type semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 24
- 238000002955 isolation Methods 0.000 claims 2
- 238000000926 separation method Methods 0.000 claims 2
- 239000000843 powder Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100015422A KR101601624B1 (ko) | 2010-02-19 | 2010-02-19 | 멀티셀 어레이를 갖는 반도체 발광장치, 발광모듈 및 조명장치 |
| KR10-2010-0015422 | 2010-02-19 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011171739A JP2011171739A (ja) | 2011-09-01 |
| JP2011171739A5 true JP2011171739A5 (https=) | 2014-04-10 |
| JP5683994B2 JP5683994B2 (ja) | 2015-03-11 |
Family
ID=44261711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011033514A Active JP5683994B2 (ja) | 2010-02-19 | 2011-02-18 | マルチセルアレイを有する半導体発光装置、発光モジュール及び照明装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8829540B2 (https=) |
| EP (1) | EP2365527B1 (https=) |
| JP (1) | JP5683994B2 (https=) |
| KR (1) | KR101601624B1 (https=) |
| CN (1) | CN102169933B (https=) |
| TW (1) | TWI437702B (https=) |
Families Citing this family (56)
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| KR101211733B1 (ko) * | 2010-10-28 | 2012-12-12 | 엘지이노텍 주식회사 | 광소자 패키지용 기판 |
| US8193015B2 (en) * | 2010-11-17 | 2012-06-05 | Pinecone Energies, Inc. | Method of forming a light-emitting-diode array with polymer between light emitting devices |
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| EP2745289A1 (en) * | 2011-09-06 | 2014-06-25 | Koninklijke Philips N.V. | Topology of distributing and connecting leds in a large area matrix |
| KR20130035658A (ko) | 2011-09-30 | 2013-04-09 | 서울옵토디바이스주식회사 | 발광 다이오드 소자용 기판 제조 방법 |
| KR101895359B1 (ko) | 2011-10-14 | 2018-09-07 | 엘지이노텍 주식회사 | 씨오비 패키지를 이용한 조명 모듈 구현 방법 및 그 조명 모듈 |
| CN102324460A (zh) * | 2011-10-24 | 2012-01-18 | 佛山市国星光电股份有限公司 | 基于图形化封装基板的led封装装置 |
| TW201318147A (zh) * | 2011-10-26 | 2013-05-01 | 華夏光股份有限公司 | 發光二極體陣列 |
| CN102403331A (zh) * | 2011-10-26 | 2012-04-04 | 华夏光股份有限公司 | 发光二极管阵列 |
| CN102497691B (zh) * | 2011-11-25 | 2013-12-25 | 俞国宏 | 一种可直接与交流电连接的led灯泡 |
| KR101412011B1 (ko) * | 2011-12-06 | 2014-06-27 | 엘이디라이텍(주) | 발광소자 어레이 및 이를 포함하는 조명장치 |
| TWI438895B (zh) * | 2012-02-09 | 2014-05-21 | 隆達電子股份有限公司 | 發光二極體陣列 |
| JP5992695B2 (ja) | 2012-02-29 | 2016-09-14 | スタンレー電気株式会社 | 半導体発光素子アレイ及び車両用灯具 |
| KR20130109319A (ko) | 2012-03-27 | 2013-10-08 | 삼성전자주식회사 | 반도체 발광장치, 발광모듈 및 조명장치 |
| TW201347223A (zh) * | 2012-05-08 | 2013-11-16 | Chi Mei Lighting Tech Corp | 高壓發光二極體及其製造方法 |
| KR20140006485A (ko) | 2012-07-05 | 2014-01-16 | 삼성전자주식회사 | 멀티셀 어레이를 갖는 반도체 발광장치 및 그 제조 방법 |
| TWI484673B (zh) * | 2012-08-22 | 2015-05-11 | 華夏光股份有限公司 | 半導體發光裝置 |
| CN104813489B (zh) * | 2012-11-23 | 2018-01-02 | 首尔伟傲世有限公司 | 发光二极管及其制造方法 |
| US9356212B2 (en) | 2012-12-21 | 2016-05-31 | Seoul Viosys Co., Ltd. | Light emitting diode and method of fabricating the same |
| WO2014098510A1 (en) | 2012-12-21 | 2014-06-26 | Seoul Viosys Co., Ltd. | Light emitting diode and method of fabricating the same |
| KR102087935B1 (ko) * | 2012-12-27 | 2020-03-11 | 엘지이노텍 주식회사 | 발광 소자 |
| JP6176032B2 (ja) * | 2013-01-30 | 2017-08-09 | 日亜化学工業株式会社 | 半導体発光素子 |
| CN110635009B (zh) * | 2013-07-18 | 2023-03-31 | 亮锐控股有限公司 | 高度反射倒装芯片led管芯 |
| KR102194805B1 (ko) * | 2013-07-22 | 2020-12-28 | 엘지이노텍 주식회사 | 발광소자 |
| US9673254B2 (en) * | 2013-07-22 | 2017-06-06 | Lg Innotek Co., Ltd. | Light emitting device |
| KR102099436B1 (ko) * | 2013-10-01 | 2020-04-09 | 엘지이노텍 주식회사 | 발광 소자 |
| US9780276B2 (en) * | 2014-01-23 | 2017-10-03 | Suzhou Institute of Nano-tech and Nano-bionics, Chinese Academy of Sciences | Wafer-level semiconductor device and manufacturing method thereof |
| CN113035851B (zh) * | 2014-06-18 | 2022-03-29 | 艾克斯展示公司技术有限公司 | 微组装led显示器 |
| KR20160031938A (ko) * | 2014-09-15 | 2016-03-23 | 서울바이오시스 주식회사 | 발광 다이오드 |
| CN105865668B (zh) * | 2015-01-20 | 2019-12-10 | 北京纳米能源与系统研究所 | 压力传感成像阵列、设备及其制作方法 |
| CN104752586A (zh) * | 2015-03-27 | 2015-07-01 | 华南理工大学 | 一种led图形优化封装基板、led封装体及其制备方法 |
| EP4235823A3 (en) * | 2015-10-16 | 2023-10-25 | Seoul Viosys Co., Ltd. | Compact light emitting diode chip |
| TWI565095B (zh) * | 2015-11-09 | 2017-01-01 | 錼創科技股份有限公司 | 發光模組 |
| JP6354799B2 (ja) * | 2015-12-25 | 2018-07-11 | 日亜化学工業株式会社 | 発光素子 |
| US9929316B2 (en) | 2015-12-25 | 2018-03-27 | Nichia Corporation | Light emitting element |
| KR20180091700A (ko) * | 2016-01-05 | 2018-08-16 | 엘지이노텍 주식회사 | 발광 소자 |
| KR102263041B1 (ko) | 2016-02-26 | 2021-06-09 | 삼성전자주식회사 | 멀티 컬러를 구현할 수 있는 발광 소자 |
| US10153256B2 (en) | 2016-03-03 | 2018-12-11 | X-Celeprint Limited | Micro-transfer printable electronic component |
| KR102480220B1 (ko) | 2016-04-08 | 2022-12-26 | 삼성전자주식회사 | 발광 다이오드 모듈 및 이를 구비한 디스플레이 패널 |
| KR101852436B1 (ko) * | 2016-06-22 | 2018-04-26 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 차량용 램프 |
| WO2019093533A1 (ko) | 2017-11-08 | 2019-05-16 | 서울바이오시스주식회사 | 복수의 픽셀들을 포함하는 디스플레이용 발광 다이오드 유닛 및 그것을 갖는 디스플레이 장치 |
| US11402075B2 (en) | 2018-01-03 | 2022-08-02 | Lg Electronics Inc. | Vehicle lamp using semiconductor light-emitting device |
| JP6822429B2 (ja) * | 2018-02-19 | 2021-01-27 | 日亜化学工業株式会社 | 発光素子 |
| CN208014703U (zh) * | 2018-03-29 | 2018-10-26 | 昆山工研院新型平板显示技术中心有限公司 | 驱动背板、微发光二极管显示面板及显示器 |
| KR102556280B1 (ko) * | 2018-07-05 | 2023-07-17 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 램프 |
| US11282984B2 (en) * | 2018-10-05 | 2022-03-22 | Seoul Viosys Co., Ltd. | Light emitting device |
| US11482650B2 (en) * | 2018-11-07 | 2022-10-25 | Seoul Viosys Co., Ltd. | Light emitting device including light shielding layer |
| JP7348520B2 (ja) * | 2018-12-25 | 2023-09-21 | 日亜化学工業株式会社 | 発光装置及び表示装置 |
| KR102659254B1 (ko) * | 2018-12-26 | 2024-04-22 | 엘지전자 주식회사 | 반도체 발광소자를 이용한 램프 |
| TWI801648B (zh) * | 2019-03-21 | 2023-05-11 | 范文昌 | 顯示裝置的導電基板 |
| US20200302858A1 (en) * | 2019-03-21 | 2020-09-24 | Xinchen Technology Co., Ltd. | Conductive substrate of a display device |
| TWI886736B (zh) * | 2019-07-31 | 2025-06-11 | 晶元光電股份有限公司 | 發光二極體元件及其製造方法 |
| TWI830759B (zh) * | 2019-07-31 | 2024-02-01 | 晶元光電股份有限公司 | 發光二極體元件及其製造方法 |
| CN114582247A (zh) * | 2020-11-30 | 2022-06-03 | 范文正 | 一种发光显示装置及其制造方法 |
| CN113437203A (zh) * | 2021-06-28 | 2021-09-24 | 上海天马微电子有限公司 | 一种显示面板及显示装置 |
| JP7549808B2 (ja) * | 2021-07-05 | 2024-09-12 | ウシオ電機株式会社 | 紫外線照射装置及び露光装置 |
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| KR101448153B1 (ko) | 2008-06-25 | 2014-10-08 | 삼성전자주식회사 | 발광 다이오드용 멀티칩 패키지 및 멀티칩 패키지 방식의발광 다이오드 소자 |
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-
2010
- 2010-02-19 KR KR1020100015422A patent/KR101601624B1/ko active Active
-
2011
- 2011-01-27 TW TW100103014A patent/TWI437702B/zh active
- 2011-02-17 US US13/029,739 patent/US8829540B2/en active Active
- 2011-02-18 JP JP2011033514A patent/JP5683994B2/ja active Active
- 2011-02-18 EP EP11155000.0A patent/EP2365527B1/en active Active
- 2011-02-21 CN CN201110048129.6A patent/CN102169933B/zh active Active