KR20140131974A - 기판상에 주조된 캡슐로 싸인 오목부를 지닌 반도체 레이저 칩 패키지 및 그것의 형성방법 - Google Patents

기판상에 주조된 캡슐로 싸인 오목부를 지닌 반도체 레이저 칩 패키지 및 그것의 형성방법 Download PDF

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Publication number
KR20140131974A
KR20140131974A KR1020147026633A KR20147026633A KR20140131974A KR 20140131974 A KR20140131974 A KR 20140131974A KR 1020147026633 A KR1020147026633 A KR 1020147026633A KR 20147026633 A KR20147026633 A KR 20147026633A KR 20140131974 A KR20140131974 A KR 20140131974A
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KR
South Korea
Prior art keywords
substrate
semiconductor laser
conductive layer
chip
laser chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020147026633A
Other languages
English (en)
Korean (ko)
Inventor
진 한 주
로버트 버만
제리 데레온
Original Assignee
엑셀리타스 캐나다, 인코퍼레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/411,275 external-priority patent/US8791492B2/en
Application filed by 엑셀리타스 캐나다, 인코퍼레이티드 filed Critical 엑셀리타스 캐나다, 인코퍼레이티드
Publication of KR20140131974A publication Critical patent/KR20140131974A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020147026633A 2012-03-02 2013-02-27 기판상에 주조된 캡슐로 싸인 오목부를 지닌 반도체 레이저 칩 패키지 및 그것의 형성방법 Ceased KR20140131974A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/411,275 2012-03-02
US13/411,275 US8791492B2 (en) 2009-10-01 2012-03-02 Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same
PCT/US2013/027987 WO2013130580A2 (en) 2012-03-02 2013-02-27 Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same

Publications (1)

Publication Number Publication Date
KR20140131974A true KR20140131974A (ko) 2014-11-14

Family

ID=47846203

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147026633A Ceased KR20140131974A (ko) 2012-03-02 2013-02-27 기판상에 주조된 캡슐로 싸인 오목부를 지닌 반도체 레이저 칩 패키지 및 그것의 형성방법

Country Status (6)

Country Link
EP (1) EP2820726B1 (https=)
JP (1) JP2015510277A (https=)
KR (1) KR20140131974A (https=)
HK (1) HK1204158A1 (https=)
TW (1) TW201344994A (https=)
WO (1) WO2013130580A2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015114292A1 (de) * 2015-08-27 2017-03-02 Osram Opto Semiconductors Gmbh Laserbauelement und Verfahren zu seiner Herstellung
DE102016101942B4 (de) 2016-02-04 2022-07-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung
WO2019190676A1 (en) * 2018-03-30 2019-10-03 Applied Materials, Inc. Integrating 3d printing into multi-process fabrication schemes
CN113972554A (zh) * 2020-07-24 2022-01-25 上海禾赛科技有限公司 激光器封装结构、激光器芯片的封装方法及激光雷达
WO2022102411A1 (ja) 2020-11-13 2022-05-19 ローム株式会社 半導体発光装置
JP2024122659A (ja) * 2023-02-28 2024-09-09 京セラ株式会社 レーザ素子、レーザモジュール、およびレーザ素子の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59193083A (ja) * 1983-04-15 1984-11-01 Hitachi Ltd フアイバ装着用半導体レ−ザ装置
JPS61272987A (ja) * 1985-05-29 1986-12-03 Hitachi Ltd 半導体レ−ザ素子
JPS62120372U (https=) * 1986-01-23 1987-07-30
US5852696A (en) * 1994-06-29 1998-12-22 British Telecommunications Public Limited Company Packaged optical device
US5627851A (en) * 1995-02-10 1997-05-06 Ricoh Company, Ltd. Semiconductor light emitting device
JP2002042365A (ja) * 2000-07-21 2002-02-08 Sankyo Seiki Mfg Co Ltd 光ヘッド装置の光源装置
JP2002217479A (ja) * 2001-01-17 2002-08-02 Sankyo Seiki Mfg Co Ltd レーザ光源装置、レーザ光源装置の製造方法、および光ヘッド装置
WO2002103866A1 (en) * 2001-06-15 2002-12-27 Nichia Corporation Semiconductor laser element, and its manufacturing method
US8431951B2 (en) * 2009-10-01 2013-04-30 Excelitas Canada, Inc. Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation
US8791492B2 (en) * 2009-10-01 2014-07-29 Excelitas Canada, Inc. Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same

Also Published As

Publication number Publication date
WO2013130580A2 (en) 2013-09-06
EP2820726B1 (en) 2018-05-02
WO2013130580A3 (en) 2013-11-14
WO2013130580A8 (en) 2014-01-03
HK1204158A1 (en) 2015-11-06
TW201344994A (zh) 2013-11-01
EP2820726A2 (en) 2015-01-07
JP2015510277A (ja) 2015-04-02

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