HK1204158A1 - Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same - Google Patents

Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same Download PDF

Info

Publication number
HK1204158A1
HK1204158A1 HK15104312.6A HK15104312A HK1204158A1 HK 1204158 A1 HK1204158 A1 HK 1204158A1 HK 15104312 A HK15104312 A HK 15104312A HK 1204158 A1 HK1204158 A1 HK 1204158A1
Authority
HK
Hong Kong
Prior art keywords
substrate
laser chip
semiconductor laser
chip package
forming same
Prior art date
Application number
HK15104312.6A
Other languages
English (en)
Chinese (zh)
Inventor
Jin Han JU
Robert Burman
Jerry Deleon
Original Assignee
Excelitas Canada Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/411,275 external-priority patent/US8791492B2/en
Application filed by Excelitas Canada Inc. filed Critical Excelitas Canada Inc.
Publication of HK1204158A1 publication Critical patent/HK1204158A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
HK15104312.6A 2012-03-02 2013-02-27 Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same HK1204158A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/411,275 2012-03-02
US13/411,275 US8791492B2 (en) 2009-10-01 2012-03-02 Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same
PCT/US2013/027987 WO2013130580A2 (en) 2012-03-02 2013-02-27 Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same

Publications (1)

Publication Number Publication Date
HK1204158A1 true HK1204158A1 (en) 2015-11-06

Family

ID=47846203

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15104312.6A HK1204158A1 (en) 2012-03-02 2013-02-27 Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same

Country Status (6)

Country Link
EP (1) EP2820726B1 (https=)
JP (1) JP2015510277A (https=)
KR (1) KR20140131974A (https=)
HK (1) HK1204158A1 (https=)
TW (1) TW201344994A (https=)
WO (1) WO2013130580A2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015114292A1 (de) * 2015-08-27 2017-03-02 Osram Opto Semiconductors Gmbh Laserbauelement und Verfahren zu seiner Herstellung
DE102016101942B4 (de) 2016-02-04 2022-07-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung
WO2019190676A1 (en) * 2018-03-30 2019-10-03 Applied Materials, Inc. Integrating 3d printing into multi-process fabrication schemes
CN113972554A (zh) * 2020-07-24 2022-01-25 上海禾赛科技有限公司 激光器封装结构、激光器芯片的封装方法及激光雷达
WO2022102411A1 (ja) 2020-11-13 2022-05-19 ローム株式会社 半導体発光装置
JP2024122659A (ja) * 2023-02-28 2024-09-09 京セラ株式会社 レーザ素子、レーザモジュール、およびレーザ素子の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59193083A (ja) * 1983-04-15 1984-11-01 Hitachi Ltd フアイバ装着用半導体レ−ザ装置
JPS61272987A (ja) * 1985-05-29 1986-12-03 Hitachi Ltd 半導体レ−ザ素子
JPS62120372U (https=) * 1986-01-23 1987-07-30
US5852696A (en) * 1994-06-29 1998-12-22 British Telecommunications Public Limited Company Packaged optical device
US5627851A (en) * 1995-02-10 1997-05-06 Ricoh Company, Ltd. Semiconductor light emitting device
JP2002042365A (ja) * 2000-07-21 2002-02-08 Sankyo Seiki Mfg Co Ltd 光ヘッド装置の光源装置
JP2002217479A (ja) * 2001-01-17 2002-08-02 Sankyo Seiki Mfg Co Ltd レーザ光源装置、レーザ光源装置の製造方法、および光ヘッド装置
WO2002103866A1 (en) * 2001-06-15 2002-12-27 Nichia Corporation Semiconductor laser element, and its manufacturing method
US8431951B2 (en) * 2009-10-01 2013-04-30 Excelitas Canada, Inc. Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation
US8791492B2 (en) * 2009-10-01 2014-07-29 Excelitas Canada, Inc. Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same

Also Published As

Publication number Publication date
WO2013130580A2 (en) 2013-09-06
EP2820726B1 (en) 2018-05-02
WO2013130580A3 (en) 2013-11-14
WO2013130580A8 (en) 2014-01-03
TW201344994A (zh) 2013-11-01
EP2820726A2 (en) 2015-01-07
KR20140131974A (ko) 2014-11-14
JP2015510277A (ja) 2015-04-02

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