TW201344994A - 鑄於基材上具有密封凹槽的半導體雷射晶片封裝及其形成方法 - Google Patents

鑄於基材上具有密封凹槽的半導體雷射晶片封裝及其形成方法 Download PDF

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Publication number
TW201344994A
TW201344994A TW102107283A TW102107283A TW201344994A TW 201344994 A TW201344994 A TW 201344994A TW 102107283 A TW102107283 A TW 102107283A TW 102107283 A TW102107283 A TW 102107283A TW 201344994 A TW201344994 A TW 201344994A
Authority
TW
Taiwan
Prior art keywords
substrate
semiconductor laser
package
wafer
conductive
Prior art date
Application number
TW102107283A
Other languages
English (en)
Chinese (zh)
Inventor
朱錦韓
布爾曼羅伯特
迪里昂傑瑞
Original Assignee
艾索勒塔什加拿大公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/411,275 external-priority patent/US8791492B2/en
Application filed by 艾索勒塔什加拿大公司 filed Critical 艾索勒塔什加拿大公司
Publication of TW201344994A publication Critical patent/TW201344994A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW102107283A 2012-03-02 2013-03-01 鑄於基材上具有密封凹槽的半導體雷射晶片封裝及其形成方法 TW201344994A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/411,275 US8791492B2 (en) 2009-10-01 2012-03-02 Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same

Publications (1)

Publication Number Publication Date
TW201344994A true TW201344994A (zh) 2013-11-01

Family

ID=47846203

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102107283A TW201344994A (zh) 2012-03-02 2013-03-01 鑄於基材上具有密封凹槽的半導體雷射晶片封裝及其形成方法

Country Status (6)

Country Link
EP (1) EP2820726B1 (https=)
JP (1) JP2015510277A (https=)
KR (1) KR20140131974A (https=)
HK (1) HK1204158A1 (https=)
TW (1) TW201344994A (https=)
WO (1) WO2013130580A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI791808B (zh) * 2018-03-30 2023-02-11 美商應用材料股份有限公司 形成再分配層之方法、及電腦可讀媒體

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015114292A1 (de) * 2015-08-27 2017-03-02 Osram Opto Semiconductors Gmbh Laserbauelement und Verfahren zu seiner Herstellung
DE102016101942B4 (de) 2016-02-04 2022-07-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung
CN113972554A (zh) * 2020-07-24 2022-01-25 上海禾赛科技有限公司 激光器封装结构、激光器芯片的封装方法及激光雷达
WO2022102411A1 (ja) 2020-11-13 2022-05-19 ローム株式会社 半導体発光装置
JP2024122659A (ja) * 2023-02-28 2024-09-09 京セラ株式会社 レーザ素子、レーザモジュール、およびレーザ素子の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59193083A (ja) * 1983-04-15 1984-11-01 Hitachi Ltd フアイバ装着用半導体レ−ザ装置
JPS61272987A (ja) * 1985-05-29 1986-12-03 Hitachi Ltd 半導体レ−ザ素子
JPS62120372U (https=) * 1986-01-23 1987-07-30
US5852696A (en) * 1994-06-29 1998-12-22 British Telecommunications Public Limited Company Packaged optical device
US5627851A (en) * 1995-02-10 1997-05-06 Ricoh Company, Ltd. Semiconductor light emitting device
JP2002042365A (ja) * 2000-07-21 2002-02-08 Sankyo Seiki Mfg Co Ltd 光ヘッド装置の光源装置
JP2002217479A (ja) * 2001-01-17 2002-08-02 Sankyo Seiki Mfg Co Ltd レーザ光源装置、レーザ光源装置の製造方法、および光ヘッド装置
WO2002103866A1 (en) * 2001-06-15 2002-12-27 Nichia Corporation Semiconductor laser element, and its manufacturing method
US8431951B2 (en) * 2009-10-01 2013-04-30 Excelitas Canada, Inc. Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation
US8791492B2 (en) * 2009-10-01 2014-07-29 Excelitas Canada, Inc. Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI791808B (zh) * 2018-03-30 2023-02-11 美商應用材料股份有限公司 形成再分配層之方法、及電腦可讀媒體

Also Published As

Publication number Publication date
WO2013130580A2 (en) 2013-09-06
EP2820726B1 (en) 2018-05-02
WO2013130580A3 (en) 2013-11-14
WO2013130580A8 (en) 2014-01-03
HK1204158A1 (en) 2015-11-06
EP2820726A2 (en) 2015-01-07
KR20140131974A (ko) 2014-11-14
JP2015510277A (ja) 2015-04-02

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