JP2009109610A - 露光用マスク、及び薄膜トランジスタの製造方法 - Google Patents
露光用マスク、及び薄膜トランジスタの製造方法 Download PDFInfo
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- JP2009109610A JP2009109610A JP2007279959A JP2007279959A JP2009109610A JP 2009109610 A JP2009109610 A JP 2009109610A JP 2007279959 A JP2007279959 A JP 2007279959A JP 2007279959 A JP2007279959 A JP 2007279959A JP 2009109610 A JP2009109610 A JP 2009109610A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 239000010409 thin film Substances 0.000 title claims abstract description 22
- 239000010408 film Substances 0.000 claims abstract description 228
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims description 31
- 239000004065 semiconductor Substances 0.000 claims description 22
- 239000012535 impurity Substances 0.000 claims description 13
- 150000002500 ions Chemical class 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 7
- 238000002834 transmittance Methods 0.000 abstract description 30
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 8
- 229910052804 chromium Inorganic materials 0.000 description 8
- 239000011651 chromium Substances 0.000 description 8
- 238000000206 photolithography Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 3
- 229910000423 chromium oxide Inorganic materials 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- CXOWYMLTGOFURZ-UHFFFAOYSA-N azanylidynechromium Chemical compound [Cr]#N CXOWYMLTGOFURZ-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
- H01L29/78621—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
Abstract
【解決手段】露光用マスクは、透明基板(100)と、この透明基板上に所定の繰り返しパターンである第1パターンで形成された第1パターン部分(110b)を有する遮光膜(110)と、透明基板上における第1パターン部分が形成された第1パターン領域(R2)を含む領域に形成され、露光光を透過する透過率が遮光膜より高い半透明膜(120)とを備える。
【選択図】図2
Description
<第1実施形態>
第1実施形態に係るフォトマスクについて、図1から図3を参照して説明する。
Claims (6)
- 透明基板と、
該透明基板上に所定の繰り返しパターンである第1パターンで形成された第1パターン部分を有する遮光膜と、
前記透明基板上における前記第1パターン部分が形成された第1パターン領域を含む領域に形成され、露光光を透過する透過率が前記遮光膜より高い半透明膜と
を備えたことを特徴とする露光用マスク。 - 前記半透明膜は、前記透明基板上における前記遮光膜が形成された領域に重なる部分と、該重なる部分から前記透明基板上における前記遮光膜が形成されていない領域の少なくとも一部に延在する延在部分とを有することを特徴とする請求項1に記載の露光用マスク。
- 前記遮光膜は、前記透明基板上における前記第1パターン領域とは異なる第2パターン領域に前記第1パターンと互いに異なる第2パターンで形成された第2パターン部分を有することを特徴とする請求項1又は2に記載の露光用マスク。
- 前記第1パターンは、ストライプ状又ドット状のパターンであることを特徴とする請求項1から3のいずれか一項に記載の露光用マスク。
- 請求項1から4のいずれか一項に記載の露光用マスクを用いて、前記露光光を半導体膜上に形成されたレジスト膜に対して露光することで、階調付きレジスト膜を形成する工程と、
該階調付きレジスト膜を介して前記半導体膜に不純物イオンを注入する工程と
を含むことを特徴とする薄膜トランジスタの製造方法。 - 前記階調付きレジスト膜を介して前記半導体膜にエッチング処理を施す工程を含むことを特徴とする請求項5に記載の薄膜トランジスタの製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007279959A JP4930324B2 (ja) | 2007-10-29 | 2007-10-29 | 薄膜トランジスタの製造方法 |
US12/206,592 US7858272B2 (en) | 2007-10-29 | 2008-09-08 | Exposure mask and method for fabricating thin-film transistor |
KR1020080100711A KR20090043440A (ko) | 2007-10-29 | 2008-10-14 | 노광용 마스크 및, 박막 트랜지스터의 제조 방법 |
CNA2008101712154A CN101424874A (zh) | 2007-10-29 | 2008-10-27 | 曝光用掩模、以及薄膜晶体管的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007279959A JP4930324B2 (ja) | 2007-10-29 | 2007-10-29 | 薄膜トランジスタの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009109610A true JP2009109610A (ja) | 2009-05-21 |
JP4930324B2 JP4930324B2 (ja) | 2012-05-16 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007279959A Expired - Fee Related JP4930324B2 (ja) | 2007-10-29 | 2007-10-29 | 薄膜トランジスタの製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7858272B2 (ja) |
JP (1) | JP4930324B2 (ja) |
KR (1) | KR20090043440A (ja) |
CN (1) | CN101424874A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012527639A (ja) * | 2009-05-21 | 2012-11-08 | エルジー イノテック カンパニー リミテッド | ハーフトーンマスク及びその製造方法 |
JP2014060399A (ja) * | 2012-09-17 | 2014-04-03 | In-Cha Hsieh | 薄膜トランジスタデバイスを作成する方法 |
JP2014072523A (ja) * | 2012-09-28 | 2014-04-21 | Boe Technology Group Co Ltd | 活性層のイオン注入方法及び薄膜トランジスタの活性層のイオン注入方法 |
JP2018157017A (ja) * | 2017-03-16 | 2018-10-04 | 富士電機株式会社 | 半導体装置の製造方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4968011B2 (ja) * | 2007-11-19 | 2012-07-04 | セイコーエプソン株式会社 | 半導体装置 |
CN103035568B (zh) * | 2012-12-21 | 2014-12-31 | 北京京东方光电科技有限公司 | 一种tft阵列基板及制作方法、显示装置 |
CN104733323B (zh) * | 2014-12-16 | 2018-04-13 | 深圳市华星光电技术有限公司 | 一种低温多晶硅薄膜晶体管的制造方法 |
CN104779168B (zh) * | 2015-04-13 | 2018-01-12 | 武汉华星光电技术有限公司 | 用于制作薄膜晶体管的方法 |
CN106024633A (zh) * | 2016-06-23 | 2016-10-12 | 京东方科技集团股份有限公司 | 薄膜晶体管及阵列基板的制备方法、阵列基板及显示装置 |
CN111367142A (zh) * | 2018-12-26 | 2020-07-03 | 聚灿光电科技(宿迁)有限公司 | 一种包含不同透光性的新型光学掩膜版 |
TWI798771B (zh) * | 2021-07-28 | 2023-04-11 | 力晶積成電子製造股份有限公司 | 光罩以及內連線結構的製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH08250446A (ja) * | 1995-02-16 | 1996-09-27 | Samsung Electron Co Ltd | グレートーンマスク、これを用いたパターンの形成方法およびイオン注入方法 |
JP2005257712A (ja) * | 2004-03-09 | 2005-09-22 | Hoya Corp | グレートーンマスク及びその製造方法 |
JP2006018001A (ja) * | 2004-07-01 | 2006-01-19 | Dainippon Printing Co Ltd | 階調フォトマスクおよびその製造方法 |
JP2008046623A (ja) * | 2006-07-21 | 2008-02-28 | Dainippon Printing Co Ltd | 階調マスク |
Family Cites Families (8)
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JP4954401B2 (ja) | 2000-08-11 | 2012-06-13 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法 |
TW579604B (en) * | 2002-12-17 | 2004-03-11 | Ind Tech Res Inst | Method of forming a top-gate type thin film transistor device |
JP4321486B2 (ja) | 2004-07-12 | 2009-08-26 | セイコーエプソン株式会社 | 半導体装置及び半導体装置の製造方法 |
US7704646B2 (en) * | 2004-11-08 | 2010-04-27 | Lg Innotek Co., Ltd. | Half tone mask and method for fabricating the same |
US7914971B2 (en) * | 2005-08-12 | 2011-03-29 | Semiconductor Energy Laboratory Co., Ltd. | Light exposure mask and method for manufacturing semiconductor device using the same |
JP5110821B2 (ja) | 2005-08-12 | 2012-12-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP2007103418A (ja) | 2005-09-30 | 2007-04-19 | Seiko Epson Corp | 半導体装置、半導体装置の製造方法、並びに電気光学装置 |
JP4968011B2 (ja) * | 2007-11-19 | 2012-07-04 | セイコーエプソン株式会社 | 半導体装置 |
-
2007
- 2007-10-29 JP JP2007279959A patent/JP4930324B2/ja not_active Expired - Fee Related
-
2008
- 2008-09-08 US US12/206,592 patent/US7858272B2/en active Active
- 2008-10-14 KR KR1020080100711A patent/KR20090043440A/ko not_active Application Discontinuation
- 2008-10-27 CN CNA2008101712154A patent/CN101424874A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH08250446A (ja) * | 1995-02-16 | 1996-09-27 | Samsung Electron Co Ltd | グレートーンマスク、これを用いたパターンの形成方法およびイオン注入方法 |
JP2005257712A (ja) * | 2004-03-09 | 2005-09-22 | Hoya Corp | グレートーンマスク及びその製造方法 |
JP2006018001A (ja) * | 2004-07-01 | 2006-01-19 | Dainippon Printing Co Ltd | 階調フォトマスクおよびその製造方法 |
JP2008046623A (ja) * | 2006-07-21 | 2008-02-28 | Dainippon Printing Co Ltd | 階調マスク |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012527639A (ja) * | 2009-05-21 | 2012-11-08 | エルジー イノテック カンパニー リミテッド | ハーフトーンマスク及びその製造方法 |
JP2014060399A (ja) * | 2012-09-17 | 2014-04-03 | In-Cha Hsieh | 薄膜トランジスタデバイスを作成する方法 |
JP2014072523A (ja) * | 2012-09-28 | 2014-04-21 | Boe Technology Group Co Ltd | 活性層のイオン注入方法及び薄膜トランジスタの活性層のイオン注入方法 |
JP2018157017A (ja) * | 2017-03-16 | 2018-10-04 | 富士電機株式会社 | 半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4930324B2 (ja) | 2012-05-16 |
US20090111251A1 (en) | 2009-04-30 |
US7858272B2 (en) | 2010-12-28 |
KR20090043440A (ko) | 2009-05-06 |
CN101424874A (zh) | 2009-05-06 |
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