JP2009100003A - プリント回路基板用の優先的接地及びビア延出構造 - Google Patents
プリント回路基板用の優先的接地及びビア延出構造 Download PDFInfo
- Publication number
- JP2009100003A JP2009100003A JP2008327816A JP2008327816A JP2009100003A JP 2009100003 A JP2009100003 A JP 2009100003A JP 2008327816 A JP2008327816 A JP 2008327816A JP 2008327816 A JP2008327816 A JP 2008327816A JP 2009100003 A JP2009100003 A JP 2009100003A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- vias
- differential signal
- pair
- trace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1903—Structure including wave guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09636—Details of adjacent, not connected vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09718—Clearance holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
【解決手段】ビア配置では、差動信号ペアのビア及び関連する接地は、繰返しパターンで互いに隣接して配設される。各ペアの差動信号ビアは、隣接した差動信号ペアの関連する接地よりも関連する接地ビアに近付いて一定間隔で配設され、差異信号ビアはそれらの関連する接地ビアに、好ましくは、電気的に連結される。回路トレース延出構造は差動信号ビアの回路トレースの延出部を含み、トレースが導電トレースの伝送部に接触し結合する通路を辿(たど)る。
【選択図】図10A
Description
図6は、本明細書において「5ダイ(5-die )」ビアパターンと呼ぶものが形成された他の回路基板200を示す。このパターンは、単一の介在接地ビア205の両側に配設された2対の差動信号ビア202、204を有する。そのような差動信号ビアの各ペアは、2個の別個のビア202a、202bと、204a、204bとを有する。そのような各差動ペアの2個のビアは、通常、(図7で左下から右上に延在するように示された)第1の軸L1の方向に位置合せされている。このパターンは、第1の軸L1と交わる方向に沿って繰返される。差動信号ビア202a−b、204a−bは、通常、これらのビアから回路基板200の他の箇所に至る導電トレースを有し、接地ビア205は、通常、回路基板205内の内側面に配設され、図6には示されていない接地面層に接続されている。
また、トレースがビアから出て回路基板上の伝送経路を構成する領域内の伝送線路のインピーダンスを制御することが望ましい。それらの延出部で問題が起こる。従来、導電トレースペアの間隔を差動信号ビアのペア間に延在する中心線に対して対称的な構成で維持しようとすることは知られていた。これを図14に示す。ここで、一対の差動信号ビアの2個のビア501、502が距離Dだけ互いに離されている。一対の導電トレース503が、ビア501、502に接続されそこから出ている。それらの延出経路は、最初、トレースが均一な間隔DDだけ離れるまで、トレースの延出部504に沿って2個のビア501を分ける中心線Cの方に斜めに延在する。これらの延出部503は、長さが短いため、その延在範囲では互いに交差することはなく、中心線Cの両側に互いに平行に延在する対応する細長い部分505につながっている。2個のビア501、502とその関連したトレース503は、それらを支持する回路基板500の信号伝送線路を画定する。単一ペアの差動信号ビアの場合は、2本のトレースの必要な間隔、形状及び長さが対称的に維持され、それにより、延出部の変動が絶対的最小に維持される。回路トレースの形状と対称性を維持することによって、この領域のインピーダンスを制御することができる。しかしながら、特に、差動信号ビア対が高密度で又は接近して設けられている回路基板の領域では、ビアから対称パターンでトレースを引出すことができるとは限らない。
Claims (3)
- 差動信号用途に使用される回路基板であって、回路基板が、前記回路基板を通して差動信号を伝えるために使用される一対のめっきされたビアを含み、前記回路基板が、さらに、前記ビアから出て前記ビアから離れた前記回路基板の位置まで延在する一対の導電トレースを有し、改良点が、
トレースが、延出部及び伝送部を備え、トレース延出部が、前記ビアから外方に延在し、第1の軸に沿って互いに近付く方向に延在する拡大領域を含み、前記トレース延出部が、さらに、第1の軸と交差する第2の軸に沿って拡大領域から延在する脚部を含み、脚部が伝送部につながっていることである回路基板。 - 前記トレース伝送部が、前記第2の軸と交差する第3の軸に沿って延在する、請求項1に記載の回路基板。
- 前記拡大領域が、旗の形状を備える、請求項1に記載の回路基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US54452204P | 2004-02-13 | 2004-02-13 | |
US60/544,522 | 2004-02-13 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006553286A Division JP4350132B2 (ja) | 2004-02-13 | 2005-02-14 | 回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009100003A true JP2009100003A (ja) | 2009-05-07 |
JP4772856B2 JP4772856B2 (ja) | 2011-09-14 |
Family
ID=34886044
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006553286A Expired - Fee Related JP4350132B2 (ja) | 2004-02-13 | 2005-02-14 | 回路基板 |
JP2008327816A Expired - Fee Related JP4772856B2 (ja) | 2004-02-13 | 2008-12-24 | 回路基板 |
JP2008327793A Expired - Fee Related JP4880666B2 (ja) | 2004-02-13 | 2008-12-24 | 回路基板 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006553286A Expired - Fee Related JP4350132B2 (ja) | 2004-02-13 | 2005-02-14 | 回路基板 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008327793A Expired - Fee Related JP4880666B2 (ja) | 2004-02-13 | 2008-12-24 | 回路基板 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20050201065A1 (ja) |
EP (1) | EP1714531A2 (ja) |
JP (3) | JP4350132B2 (ja) |
KR (1) | KR100839307B1 (ja) |
CN (4) | CN101553085B (ja) |
SG (1) | SG135185A1 (ja) |
WO (1) | WO2005081595A2 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011138845A (ja) * | 2009-12-27 | 2011-07-14 | Kyocer Slc Technologies Corp | 配線基板 |
JP2013511137A (ja) * | 2009-11-12 | 2013-03-28 | エーティーアイ・テクノロジーズ・ユーエルシー | オフセットされたビアを伴う回路板 |
JP2013511849A (ja) * | 2009-11-18 | 2013-04-04 | モレックス インコーポレイテド | 空気孔を備えた回路基板 |
JP2015099890A (ja) * | 2013-11-20 | 2015-05-28 | 株式会社東芝 | 半導体装置、及び半導体パッケージ |
JP2017212411A (ja) * | 2016-05-27 | 2017-11-30 | 京セラ株式会社 | 印刷配線板 |
WO2021006037A1 (ja) * | 2019-07-05 | 2021-01-14 | 株式会社村田製作所 | 伝送線路、および電子機器 |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7157987B2 (en) | 2003-12-24 | 2007-01-02 | Molex Incorporated | Transmission line having a transforming impedance |
US7151420B2 (en) * | 2003-12-24 | 2006-12-19 | Molex Incorporated | Electromagnetically shielded slot transmission line |
US7116190B2 (en) * | 2003-12-24 | 2006-10-03 | Molex Incorporated | Slot transmission line patch connector |
US20070188261A1 (en) * | 2003-12-24 | 2007-08-16 | Brunker David L | Transmission line with a transforming impedance and solder lands |
US20050151604A1 (en) * | 2003-12-24 | 2005-07-14 | Brunker David L. | Triangular conforming transmission structure |
US7154355B2 (en) * | 2003-12-24 | 2006-12-26 | Molex Incorporated | Transmission line with a transforming impedance and solder lands |
WO2005081596A2 (en) | 2004-02-13 | 2005-09-01 | Molex Incorporated | Preferential ground and via exit structures for printed circuit boards |
WO2006047425A2 (en) * | 2004-10-25 | 2006-05-04 | Intrado, Inc. | System and method for unilateral verification of caller location information |
EP1810552A1 (en) | 2004-10-29 | 2007-07-25 | Molex Incorporated | Printed circuit board for high-speed electrical connectors |
US7709747B2 (en) | 2004-11-29 | 2010-05-04 | Fci | Matched-impedance surface-mount technology footprints |
US7284221B2 (en) | 2004-11-29 | 2007-10-16 | Fci Americas Technology, Inc. | High-frequency, high-signal-density, surface-mount technology footprint definitions |
EP1851833B1 (en) | 2005-02-22 | 2012-09-12 | Molex Incorporated | Differential signal connector with wafer-style construction |
JP2007180292A (ja) | 2005-12-28 | 2007-07-12 | Fujitsu Ltd | 回路基板 |
US8044305B2 (en) * | 2006-05-31 | 2011-10-25 | Intel Corporation | Circuit board including hybrid via structures |
US7450396B2 (en) * | 2006-09-28 | 2008-11-11 | Intel Corporation | Skew compensation by changing ground parasitic for traces |
CN100454669C (zh) * | 2007-07-26 | 2009-01-21 | 友达光电股份有限公司 | 电性连接装置、包含该电性连接装置的电子装置及电子产品 |
CN101384129B (zh) * | 2007-09-06 | 2010-06-09 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板 |
CN101389184B (zh) * | 2007-09-10 | 2010-08-25 | 英业达股份有限公司 | 印刷电路板的组合式贯孔结构 |
KR20100037387A (ko) * | 2008-10-01 | 2010-04-09 | 삼성전자주식회사 | 메모리 모듈 및 회로 기판의 토폴로지 |
CN102265708B (zh) * | 2009-03-25 | 2015-02-11 | 莫列斯公司 | 高数据率连接器系统 |
JP2012142226A (ja) * | 2011-01-05 | 2012-07-26 | Fujitsu Component Ltd | 伝送コネクタ用の中継基板 |
DE112012003721T5 (de) | 2011-09-07 | 2014-06-18 | Samtec, Inc. | Durchgangslochstruktur zum Übertragen differentieller Signale |
GB2503407B (en) * | 2011-10-10 | 2015-12-09 | Control Tech Ltd | Barrier device |
TWI449475B (zh) | 2012-01-09 | 2014-08-11 | Novatek Microelectronics Corp | 電路板 |
CN103209539B (zh) * | 2012-01-13 | 2016-01-13 | 联咏科技股份有限公司 | 电路板 |
US8748753B2 (en) * | 2012-03-02 | 2014-06-10 | Sae Magnetics (H.K.) Ltd. | Printed circuit board |
US8715006B2 (en) * | 2012-06-11 | 2014-05-06 | Tyco Electronics Corporation | Circuit board having plated thru-holes and ground columns |
JP5955124B2 (ja) * | 2012-06-22 | 2016-07-20 | 京セラ株式会社 | 配線基板 |
CN103857179A (zh) * | 2012-12-03 | 2014-06-11 | 泰科电子日本合同会社 | Pwb占用区、具有pwb占用区的pwb、pwb与板对板连接器组件 |
US9544992B2 (en) * | 2013-01-29 | 2017-01-10 | Fci Americas Technology Llc | PCB having offset differential signal routing |
JP6098285B2 (ja) | 2013-03-28 | 2017-03-22 | 富士通株式会社 | 配線基板及び電子装置 |
CN104167618B (zh) * | 2013-05-16 | 2017-07-25 | 美国惠智科技(香港)有限公司 | 差分布线结构 |
CN107535044B (zh) | 2014-11-21 | 2019-12-10 | 安费诺公司 | 用于高速、高密度电连接器的配套背板 |
CN105764232A (zh) * | 2014-12-17 | 2016-07-13 | 鸿富锦精密工业(武汉)有限公司 | 印刷电路板及应用该印刷电路板的电子装置 |
CN105188266A (zh) * | 2015-08-27 | 2015-12-23 | 浪潮电子信息产业股份有限公司 | 一种dual模式高速信号线立体布线的方法 |
US10187972B2 (en) | 2016-03-08 | 2019-01-22 | Amphenol Corporation | Backplane footprint for high speed, high density electrical connectors |
US10201074B2 (en) * | 2016-03-08 | 2019-02-05 | Amphenol Corporation | Backplane footprint for high speed, high density electrical connectors |
US10154581B2 (en) | 2017-02-09 | 2018-12-11 | Cray Inc. | Method for impedance compensation in printed circuit boards |
CN108575044B (zh) * | 2017-03-13 | 2023-01-24 | 富士康(昆山)电脑接插件有限公司 | 印刷电路板及其组件 |
CN108631094B (zh) * | 2017-03-16 | 2020-02-04 | 莫列斯有限公司 | 电连接器及电连接器组合 |
JP2018160492A (ja) * | 2017-03-22 | 2018-10-11 | 日立金属株式会社 | 多層配線基板及び差動伝送モジュール |
TWI640230B (zh) * | 2017-05-16 | 2018-11-01 | 中華精測科技股份有限公司 | 高速傳輸結構的負載板 |
CN107204325B (zh) * | 2017-05-25 | 2023-06-02 | 成都线易科技有限责任公司 | 电容器阵列及制造方法 |
JP6844035B2 (ja) | 2017-12-13 | 2021-03-17 | 株式会社日立製作所 | 配線基板及び電子機器 |
US10342131B1 (en) | 2018-04-05 | 2019-07-02 | Lg Electronics Inc. | PCB laminated structure and mobile terminal having the same |
KR102269852B1 (ko) * | 2018-04-05 | 2021-06-28 | 엘지전자 주식회사 | Pcb 적층 구조체와 이를 포함하는 이동 단말기 |
CN108565256B (zh) * | 2018-04-11 | 2019-10-18 | 杭州电子科技大学 | 差分硅通孔阵列中的噪声抑制方法及其差分信号传输结构 |
TWI830739B (zh) | 2018-06-11 | 2024-02-01 | 美商安芬諾股份有限公司 | 包含用於高速且高密度之電連接器的連接器佔位面積之印刷電路板和互連系統以及其製造方法 |
JP7134803B2 (ja) * | 2018-09-19 | 2022-09-12 | 株式会社東芝 | プリント基板 |
US20220039250A1 (en) * | 2018-09-25 | 2022-02-03 | Molex, Llc | Connector and printed circuit board with surface ground plane |
CN109195317A (zh) * | 2018-10-15 | 2019-01-11 | 武汉精立电子技术有限公司 | 可优化阻抗方案的pcb板 |
CN109451651A (zh) * | 2018-10-23 | 2019-03-08 | 惠科股份有限公司 | 一种电路板的差分走线及电路板 |
FR3090264B1 (fr) * | 2018-12-13 | 2022-01-07 | St Microelectronics Grenoble 2 | Procédé de montage de composant |
EP3973597A4 (en) | 2019-05-20 | 2023-06-28 | Amphenol Corporation | High density, high speed electrical connector |
US10912199B1 (en) * | 2019-10-03 | 2021-02-02 | Kioxia Corporation | Resistive PCB traces for improved stability |
CN115298912A (zh) | 2020-01-27 | 2022-11-04 | 安费诺有限公司 | 具有高速安装接口的电连接器 |
EP4097800A4 (en) | 2020-01-27 | 2024-02-14 | Amphenol Corp | ELECTRICAL CONNECTOR WITH QUICK MOUNTING INTERFACE |
JP7066772B2 (ja) * | 2020-03-26 | 2022-05-13 | 株式会社日立製作所 | 信号伝送回路およびプリント基板 |
CN114521047A (zh) * | 2020-11-19 | 2022-05-20 | 中兴通讯股份有限公司 | 一种印制电路板 |
CN113573472B (zh) * | 2021-09-23 | 2022-02-01 | 中兴通讯股份有限公司 | 印制电路板及信号传输系统 |
JP7473258B1 (ja) | 2023-03-17 | 2024-04-23 | Necプラットフォームズ株式会社 | 配線基板切り替え装置および切り替え方法 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3499215A (en) * | 1964-09-03 | 1970-03-10 | Gen Electric | Capacitive fixed memory system |
US3871728A (en) * | 1973-11-30 | 1975-03-18 | Itt | Matched impedance printed circuit board connector |
US5157477A (en) * | 1990-01-10 | 1992-10-20 | International Business Machines Corporation | Matched impedance vertical conductors in multilevel dielectric laminated wiring |
US5757252A (en) | 1995-08-31 | 1998-05-26 | Itt Industries, Inc. | Wide frequency band transition between via RF transmission lines and planar transmission lines |
US5993259A (en) * | 1997-02-07 | 1999-11-30 | Teradyne, Inc. | High speed, high density electrical connector |
US5949030A (en) * | 1997-11-14 | 1999-09-07 | International Business Machines Corporation | Vias and method for making the same in organic board and chip carriers |
US6181219B1 (en) * | 1998-12-02 | 2001-01-30 | Teradyne, Inc. | Printed circuit board and method for fabricating such board |
US6388208B1 (en) * | 1999-06-11 | 2002-05-14 | Teradyne, Inc. | Multi-connection via with electrically isolated segments |
JP3420126B2 (ja) | 1999-08-09 | 2003-06-23 | 株式会社エヌイーシー情報システムズ | 両面プリント配線板 |
JP2001203300A (ja) * | 2000-01-18 | 2001-07-27 | Matsushita Electric Ind Co Ltd | 配線用基板と半導体装置および配線用基板の製造方法 |
JP2001313504A (ja) * | 2000-04-14 | 2001-11-09 | Internatl Business Mach Corp <Ibm> | 信号伝送線路接続用コネクタ、信号伝送線路、及び基板 |
US6350134B1 (en) * | 2000-07-25 | 2002-02-26 | Tyco Electronics Corporation | Electrical connector having triad contact groups arranged in an alternating inverted sequence |
US6528737B1 (en) * | 2000-08-16 | 2003-03-04 | Nortel Networks Limited | Midplane configuration featuring surface contact connectors |
JP3564555B2 (ja) * | 2001-03-05 | 2004-09-15 | 日本航空電子工業株式会社 | 高速ディファレンシャル信号伝送用コネクタ |
US6384341B1 (en) | 2001-04-30 | 2002-05-07 | Tyco Electronics Corporation | Differential connector footprint for a multi-layer circuit board |
JP2002353588A (ja) * | 2001-05-29 | 2002-12-06 | Mitsubishi Electric Corp | 配線基板及び配線基板の製造方法 |
EP1470744A2 (en) * | 2001-10-10 | 2004-10-27 | Molex Incorporated | High speed differential signal edge card connector circuit board layouts |
US6534854B1 (en) * | 2001-11-08 | 2003-03-18 | Conexant Systems, Inc. | Pin grid array package with controlled impedance pins |
JP4197234B2 (ja) * | 2001-12-28 | 2008-12-17 | 三菱電機株式会社 | 光通信器 |
US20040039859A1 (en) * | 2002-08-21 | 2004-02-26 | Intel Corporation | Via configuration for differential signaling through power or ground planes |
US7047628B2 (en) * | 2003-01-31 | 2006-05-23 | Brocade Communications Systems, Inc. | Impedance matching of differential pair signal traces on printed wiring boards |
US7141742B2 (en) * | 2003-07-17 | 2006-11-28 | Hewlett-Packard Development Company, L.P. | Alternating voided areas of anti-pads |
US7154355B2 (en) * | 2003-12-24 | 2006-12-26 | Molex Incorporated | Transmission line with a transforming impedance and solder lands |
US7157987B2 (en) * | 2003-12-24 | 2007-01-02 | Molex Incorporated | Transmission line having a transforming impedance |
US7116190B2 (en) * | 2003-12-24 | 2006-10-03 | Molex Incorporated | Slot transmission line patch connector |
US20050151604A1 (en) * | 2003-12-24 | 2005-07-14 | Brunker David L. | Triangular conforming transmission structure |
US7151420B2 (en) * | 2003-12-24 | 2006-12-19 | Molex Incorporated | Electromagnetically shielded slot transmission line |
WO2005081596A2 (en) * | 2004-02-13 | 2005-09-01 | Molex Incorporated | Preferential ground and via exit structures for printed circuit boards |
EP1810552A1 (en) * | 2004-10-29 | 2007-07-25 | Molex Incorporated | Printed circuit board for high-speed electrical connectors |
US20060139117A1 (en) * | 2004-12-23 | 2006-06-29 | Brunker David L | Multi-channel waveguide structure |
-
2005
- 2005-02-11 US US11/056,831 patent/US20050201065A1/en not_active Abandoned
- 2005-02-14 KR KR1020067018637A patent/KR100839307B1/ko not_active IP Right Cessation
- 2005-02-14 CN CN2009101342857A patent/CN101553085B/zh not_active Expired - Fee Related
- 2005-02-14 CN CNB2005800048175A patent/CN100512594C/zh not_active Expired - Fee Related
- 2005-02-14 CN CN2009101605015A patent/CN101626659B/zh not_active Expired - Fee Related
- 2005-02-14 JP JP2006553286A patent/JP4350132B2/ja not_active Expired - Fee Related
- 2005-02-14 CN CN2005800111592A patent/CN1943286B/zh not_active Expired - Fee Related
- 2005-02-14 EP EP05713419A patent/EP1714531A2/en not_active Withdrawn
- 2005-02-14 WO PCT/US2005/004468 patent/WO2005081595A2/en active Application Filing
- 2005-02-14 SG SG200705927-2A patent/SG135185A1/en unknown
-
2008
- 2008-12-24 JP JP2008327816A patent/JP4772856B2/ja not_active Expired - Fee Related
- 2008-12-24 JP JP2008327793A patent/JP4880666B2/ja not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013511137A (ja) * | 2009-11-12 | 2013-03-28 | エーティーアイ・テクノロジーズ・ユーエルシー | オフセットされたビアを伴う回路板 |
JP2013511849A (ja) * | 2009-11-18 | 2013-04-04 | モレックス インコーポレイテド | 空気孔を備えた回路基板 |
JP2011138845A (ja) * | 2009-12-27 | 2011-07-14 | Kyocer Slc Technologies Corp | 配線基板 |
JP2015099890A (ja) * | 2013-11-20 | 2015-05-28 | 株式会社東芝 | 半導体装置、及び半導体パッケージ |
JP2017212411A (ja) * | 2016-05-27 | 2017-11-30 | 京セラ株式会社 | 印刷配線板 |
WO2021006037A1 (ja) * | 2019-07-05 | 2021-01-14 | 株式会社村田製作所 | 伝送線路、および電子機器 |
JPWO2021006037A1 (ja) * | 2019-07-05 | 2021-01-14 | ||
JP7276455B2 (ja) | 2019-07-05 | 2023-05-18 | 株式会社村田製作所 | 伝送線路、および電子機器 |
US11984637B2 (en) | 2019-07-05 | 2024-05-14 | Murata Manufacturing Co., Ltd. | Transmission line and electronic device |
Also Published As
Publication number | Publication date |
---|---|
JP2007522678A (ja) | 2007-08-09 |
CN101626659B (zh) | 2011-04-20 |
KR20060118605A (ko) | 2006-11-23 |
JP2009147349A (ja) | 2009-07-02 |
JP4880666B2 (ja) | 2012-02-22 |
CN101626659A (zh) | 2010-01-13 |
CN101553085A (zh) | 2009-10-07 |
WO2005081595A3 (en) | 2005-12-15 |
CN1918952A (zh) | 2007-02-21 |
CN100512594C (zh) | 2009-07-08 |
CN1943286A (zh) | 2007-04-04 |
SG135185A1 (en) | 2007-09-28 |
KR100839307B1 (ko) | 2008-06-17 |
WO2005081595A2 (en) | 2005-09-01 |
CN1943286B (zh) | 2012-01-04 |
JP4350132B2 (ja) | 2009-10-21 |
US20050201065A1 (en) | 2005-09-15 |
CN101553085B (zh) | 2011-04-20 |
EP1714531A2 (en) | 2006-10-25 |
JP4772856B2 (ja) | 2011-09-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4880666B2 (ja) | 回路基板 | |
JP4354489B2 (ja) | 回路基板及び高速ビアシステム | |
US10849218B2 (en) | Mating backplane for high speed, high density electrical connector | |
US11805595B2 (en) | Backplane footprint for high speed, high density electrical connectors | |
US11765813B2 (en) | Backplane footprint for high speed, high density electrical connectors | |
KR100904143B1 (ko) | 고속 전기 커넥터용 인쇄 회로 기판 | |
US7601919B2 (en) | Printed circuit boards for high-speed communication | |
JP2008525972A (ja) | 直交型アーキテクチャ電子システムに特に適用可能な中立面 | |
JP2008526034A (ja) | 直交型アーキテクチャ電子システムに特に適用可能な中立面 | |
US6750403B2 (en) | Reconfigurable multilayer printed circuit board | |
EP1841298A2 (en) | Plated vias exit structure for printed circuit board | |
CN111602472B (zh) | 用于高速、高密度电连接器的背板占板区 | |
US20240196518A1 (en) | Mating backplane for high speed, high density electrical connector | |
CN211702518U (zh) | 电路板结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110125 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110422 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110427 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110523 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110621 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110622 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140701 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |