JP2009016843A - リードフレーム構造体及びそれを備えた半導体パッケージ - Google Patents
リードフレーム構造体及びそれを備えた半導体パッケージ Download PDFInfo
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Abstract
【解決手段】本発明に係るリードフレーム構造体100は、複数個の第1リード121を有する第1リードフレーム120と、複数個の第2リード131を有する第2リードフレーム130と、その一方の面に第1リード121が結合され、他方の面に第2リード131が結合される結合部材140とを備えることを特徴とする。第1リード121と第2リード131とは、互いに重ならないように配置される。
【選択図】図2
Description
110 ダイパッド
111 パッド支持部
120 第1リードフレーム
121 第1リード
122 第1ダムバー
130 第2リードフレーム
131 第2リード
132 第2ダムバー
140 結合部材
141 ベースフィルム
142 接着層
200 半導体パッケージ
210 半導体チップ
211 入出力部
221 第1導電性ワイヤー
222 第2導電性ワイヤー
230 モールド樹脂
300 外部回路基板
Claims (12)
- 複数個の第1リードを有する第1リードフレームと、
複数個の第2リードを有する第2リードフレームと、
その一方の面に前記第1リードが結合され、他方の面に前記第2リードが結合される結合部材とを備えることを特徴とするリードフレーム構造体。 - 請求項1に記載のリードフレーム構造体であって、
ダイパッドをさらに備えることを特徴とするリードフレーム構造体。 - 請求項2に記載のリードフレーム構造体であって、
前記ダイパッドが、前記第1リードフレームに連結されたことを特徴とするリードフレーム構造体。 - 請求項2に記載のリードフレーム構造体であって、
前記ダイパッドが、前記第2リードフレームに連結されたことを特徴とするリードフレーム構造体。 - 請求項1に記載のリードフレーム構造体であって、
前記複数個の第1リードが、その各々の間に設けられた第1ダムバーによって互いに連結されたことを特徴とするリードフレーム構造体。 - 請求項1に記載のリードフレーム構造体であって、
前記結合部材が、ベースフィルムと、前記ベースフィルムの両面に形成された接着層とから構成されたことを特徴とするリードフレーム構造体。 - 請求項1に記載のリードフレーム構造体であって、
前記複数個の第2リードが、その各々の間に設けられた第2ダムバーによって互いに連結されたことを特徴とするリードフレーム構造体。 - 複数個の入出力部を有する半導体チップと、
前記半導体チップが装着されるダイパッドと、
前記ダイパッドと離間して配置された複数個の第1リードと、
前記ダイパッドと離間して配置された複数個の第2リードと、
その一方の面に前記第1リードが結合され、他方の面に前記第2リードが結合された結合部材と、
前記入出力部及び前記第1リードを電気的に連結する第1導電性ワイヤーと、
前記入出力部及び前記第2リードを電気的に連結する第2導電性ワイヤーと、
前記半導体チップを封止するモールド樹脂とを備えることを特徴とする半導体パッケージ。 - 請求項8に記載の半導体パッケージであって、
前記第1リードの少なくとも一部が、前記半導体パッケージの外部に露出されたことを特徴とする半導体パッケージ。 - 請求項8に記載の半導体パッケージであって、
前記第2リードの少なくとも一部が、前記半導体パッケージの外部に露出されたことを特徴とする半導体パッケージ。 - 請求項8に記載の半導体パッケージであって、
前記結合部材が、ベースフィルムと、前記ベースフィルムの両面に形成された接着層とから構成されたことを特徴とする半導体パッケージ。 - 請求項8に記載の半導体パッケージであって、
前記モールド樹脂が、エポキシ樹脂であることを特徴とする半導体パッケージ。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020070068776A KR101187903B1 (ko) | 2007-07-09 | 2007-07-09 | 리드 프레임 및 이를 구비한 반도체 패키지 |
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JP2009016843A true JP2009016843A (ja) | 2009-01-22 |
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JP2008175363A Pending JP2009016843A (ja) | 2007-07-09 | 2008-07-04 | リードフレーム構造体及びそれを備えた半導体パッケージ |
Country Status (4)
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US (1) | US7952175B2 (ja) |
JP (1) | JP2009016843A (ja) |
KR (1) | KR101187903B1 (ja) |
CN (1) | CN101345227A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010283246A (ja) * | 2009-06-08 | 2010-12-16 | Mitsui High Tec Inc | リードフレーム及び半導体装置 |
Families Citing this family (11)
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US9711343B1 (en) | 2006-12-14 | 2017-07-18 | Utac Thai Limited | Molded leadframe substrate semiconductor package |
JP5178648B2 (ja) * | 2009-06-30 | 2013-04-10 | キヤノン株式会社 | パッケージの製造方法、及び半導体装置 |
US9355940B1 (en) * | 2009-12-04 | 2016-05-31 | Utac Thai Limited | Auxiliary leadframe member for stabilizing the bond wire process |
US9717146B2 (en) | 2012-05-22 | 2017-07-25 | Intersil Americas LLC | Circuit module such as a high-density lead frame array (HDA) power module, and method of making same |
KR101491258B1 (ko) * | 2013-05-31 | 2015-02-06 | 에스티에스반도체통신 주식회사 | 리드 프레임의 제조방법 |
DE102014203385A1 (de) * | 2014-02-25 | 2015-08-27 | Robert Bosch Gmbh | Elektronisches System sowie Herstellungsverfahren und Vorrichtung zum Herstellen eines elektronischen Systems |
CN105336631B (zh) * | 2014-06-04 | 2019-03-01 | 恩智浦美国有限公司 | 使用两个引线框架组装的半导体装置 |
US9922904B2 (en) * | 2015-05-26 | 2018-03-20 | Infineon Technologies Ag | Semiconductor device including lead frames with downset |
JP6577373B2 (ja) * | 2016-01-18 | 2019-09-18 | 新光電気工業株式会社 | リードフレーム及びその製造方法、半導体装置 |
KR102336512B1 (ko) * | 2019-05-14 | 2021-12-07 | 국방과학연구소 | 내부 정합형 반도체 패키지 |
KR20230046097A (ko) * | 2021-09-29 | 2023-04-05 | 해성디에스 주식회사 | 리드 프레임 |
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JPH01137660A (ja) * | 1987-11-25 | 1989-05-30 | Hitachi Ltd | 半導体装置 |
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KR100668932B1 (ko) | 2001-05-19 | 2007-01-12 | 앰코 테크놀로지 코리아 주식회사 | 리드프레임 및 이를 이용한 반도체패키지 |
US7245007B1 (en) * | 2003-09-18 | 2007-07-17 | Amkor Technology, Inc. | Exposed lead interposer leadframe package |
WO2006054339A1 (ja) * | 2004-11-17 | 2006-05-26 | Fujitsu Limited | 半導体装置 |
TWM269568U (en) * | 2004-12-16 | 2005-07-01 | Domintech Co Ltd | Chip package capable of reducing characteristic resistance |
JP4916745B2 (ja) * | 2006-03-28 | 2012-04-18 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
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2008
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- 2008-07-04 JP JP2008175363A patent/JP2009016843A/ja active Pending
- 2008-07-08 CN CNA2008101376596A patent/CN101345227A/zh active Pending
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JPH01137660A (ja) * | 1987-11-25 | 1989-05-30 | Hitachi Ltd | 半導体装置 |
Cited By (1)
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JP2010283246A (ja) * | 2009-06-08 | 2010-12-16 | Mitsui High Tec Inc | リードフレーム及び半導体装置 |
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US7952175B2 (en) | 2011-05-31 |
CN101345227A (zh) | 2009-01-14 |
US20090014854A1 (en) | 2009-01-15 |
KR20090005599A (ko) | 2009-01-14 |
KR101187903B1 (ko) | 2012-10-05 |
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