JP5178648B2 - パッケージの製造方法、及び半導体装置 - Google Patents
パッケージの製造方法、及び半導体装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 49
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000011347 resin Substances 0.000 claims description 138
- 229920005989 resin Polymers 0.000 claims description 138
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 238000005520 cutting process Methods 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 238000004080 punching Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 4
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- 239000000853 adhesive Substances 0.000 description 3
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- 238000003384 imaging method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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Description
図1(C)、(I)の工程(第2の工程)では、樹脂パターンRPを成型する。具体的には、第1の樹脂部6、第2の樹脂部7i、及び樹脂体5を含む樹脂パターンRPを樹脂で成型する。樹脂は、例えば、熱硬化性プラスチックである。
図1(D)、(J)の工程(第3の工程)では、樹脂パターンRPにより各リード部LPにおける周辺部分2bが保持された状態を維持しながら、各リード部LPにおける除去すべき部分2aを除去する。これにより、複数のリード部LPを複数の第1のリード部8と複数の第2のリード部9とへ切断する。具体的には、第3の領域2における除去すべき部分2aに上側から打ち抜き加工を施して、各リード部LPにおける除去すべき部分2aを除去する。これにより、除去された領域CRと溝7aとを含む貫通孔が形成されるとともに、各リード部LPは第1のリード部8と第2のリード部9とへ切断される。第1のリード部8は、第1の被ボンディング部8aと第1のランド部8bとを有する。第1の被ボンディング部8aは、ボンディングワイヤが接合されるべき部分である。第1のランド部8bは、パッケージにおけるランド電極となるべき部分である。第2のリード部9は、第2の被ボンディング部9aと第2のランド部9bとを有する。第2の被ボンディング部9aは、ボンディングワイヤが接合されるべき部分である。第2のランド部9bは、パッケージにおけるランド電極となるべき部分である。
Claims (8)
- 枠部と、前記枠部から内側へ延び、前記枠部の側に配された第1領域、前記第1領域の内側に配された第2領域、並びに、前記第1領域と前記第2領域との間の前記第1領域および前記第2領域よりも高い位置に設けられた第3領域を有する複数のリード部とを含む金属パターンを形成する工程と、
前記金属パターンを形成する工程の後に、前記複数のリード部を内側から保持する第1の樹脂部と、前記複数のリード部を前記第3領域の下側から保持するように、前記複数のリード部の前記第3領域における除去すべき部分の下面を露出させる溝を有し前記複数のリード部の前記第3領域における前記除去すべき部分に対する周辺部分の下面を覆う第2の樹脂部とを含む樹脂パターンを形成する工程と、
前記樹脂パターンを形成する工程の後に、前記樹脂パターンにより前記複数のリード部における前記周辺部分が保持された状態を維持しながら、前記複数のリード部の前記第3領域における前記除去すべき部分を除去することにより、前記複数のリード部を複数の第1のリード部と複数の第2のリード部とへ切断する工程と、
前記切断する工程の後に、前記切断する工程により前記除去すべき部分が除去された領域と、前記第2の樹脂部における前記溝とに樹脂を埋め込む工程と、
前記樹脂パターンを形成する工程の後に、前記枠部を除去する工程と、
を含むことを特徴とするパッケージの製造方法。 - 前記第1の樹脂部と前記第2の樹脂部とは、一体に形成されている
ことを特徴とする請求項1に記載のパッケージの製造方法。 - 前記枠部を除去する工程の後に、前記樹脂パターンにおける前記第1の樹脂部の上面に半導体チップを搭載する工程をさらに含む
ことを特徴とする請求項1又は2に記載のパッケージの製造方法。 - 前記複数のリード部は、前記第2領域の内側の、前記第1領域および前記第2領域よりも高い位置に設けられた第4領域をさらに有しており、
前記樹脂パターンは、前記複数のリード部を上側から保持するように、前記複数のリード部の前記第2領域における第2の除去すべき部分の上面を露出させる第2の溝を有し前記複数のリード部の前記第2領域における前記第2の除去すべき部分に対する周辺部分の上面を覆う第3の樹脂部をさらに含み、
前記切断する工程では、さらに、前記樹脂パターンにより前記複数のリード部における前記周辺部分が保持された状態を維持しながら前記複数のリード部の前記第2領域における前記第2の除去すべき部分を除去することにより、前記複数のリード部を前記複数の第1のリード部と複数の第3のリード部とへ切断し、
前記樹脂を埋め込む工程では、さらに、前記切断する工程により前記第2の除去すべき部分が除去された領域と、前記第2の樹脂部における前記第2の溝とに樹脂を埋め込む
ことを特徴とする請求項1乃至3のいずれか1項に記載のパッケージの製造方法。 - 半導体チップと、パッケージと、を備え、
前記パッケージは、
上面に前記半導体チップが搭載された第1の樹脂部と、
前記第1の樹脂部の外側に隣接して配され、第1のランド部と、前記第1のランド部より外側の前記第1のランド部より高い位置に配された第1の被ボンディング部とをそれぞれ有する複数の第1のリード部と、
前記複数の第1のリード部の外側に配され、第2の被ボンディング部と、前記第2の被ボンディング部より外側の前記第2の被ボンディング部より低い位置に配された第2のランド部とをそれぞれ有する複数の第2のリード部と、
前記第1のランド部と前記第2のランド部との間に配され、複数の前記第1の被ボンディング部と複数の前記第2の被ボンディング部との間が露出するように溝を有しつつ、複数の前記第1の被ボンディング部と複数の前記第2の被ボンディング部とを下側から覆っている第2の樹脂部と、
複数の前記第1の被ボンディング部と複数の前記第2の被ボンディング部との間に、複数の前記第1の被ボンディング部と複数の前記第2の被ボンディング部とを絶縁しつつ前記第2の樹脂部の前記溝を埋めるように配された第4の樹脂部と、を含む
ことを特徴とする半導体装置。 - 前記第1の樹脂部と前記第2の樹脂部とは、一体に成形されている
ことを特徴とする請求項5に記載の半導体装置。 - 前記半導体チップとの間に空間を有する透明カバーをさらに含む
ことを特徴とする請求項5又は6に記載の半導体装置。 - 前記半導体チップは、撮像センサを含む
ことを特徴とする請求項5乃至7のいずれか1項に記載の半導体装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009156325A JP5178648B2 (ja) | 2009-06-30 | 2009-06-30 | パッケージの製造方法、及び半導体装置 |
US12/793,751 US8450153B2 (en) | 2009-06-30 | 2010-06-04 | Package manufacturing method and semiconductor device |
CN2010102151737A CN101937850B (zh) | 2009-06-30 | 2010-06-25 | 封装制造方法和半导体装置 |
US13/799,803 US8847379B2 (en) | 2009-06-30 | 2013-03-13 | Package manufacturing method and semiconductor device |
Applications Claiming Priority (1)
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CN106686888A (zh) * | 2015-11-11 | 2017-05-17 | 旭景科技股份有限公司 | 形成增强型生物传感模块的印刷电路板元件及其制造方法 |
US9978675B2 (en) * | 2015-11-20 | 2018-05-22 | Canon Kabushiki Kaisha | Package, electronic component, and electronic apparatus |
CN106024823B (zh) * | 2016-07-29 | 2020-04-21 | 格科微电子(上海)有限公司 | Cmos图像传感器的封装方法 |
KR20200130550A (ko) * | 2019-05-08 | 2020-11-19 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
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JP3921880B2 (ja) | 1999-07-09 | 2007-05-30 | 松下電器産業株式会社 | 樹脂封止型半導体装置の製造方法 |
JP3500361B2 (ja) | 2001-02-14 | 2004-02-23 | 松下電器産業株式会社 | リードフレーム及びその製造方法 |
US6720207B2 (en) | 2001-02-14 | 2004-04-13 | Matsushita Electric Industrial Co., Ltd. | Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device |
JP2003234425A (ja) * | 2002-02-07 | 2003-08-22 | Mitsui Chemicals Inc | 半導体素子装着用中空パッケージ |
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JP4779614B2 (ja) * | 2005-12-08 | 2011-09-28 | ヤマハ株式会社 | 半導体装置 |
EP1795496A2 (en) * | 2005-12-08 | 2007-06-13 | Yamaha Corporation | Semiconductor device for detecting pressure variations |
JP2008098478A (ja) * | 2006-10-13 | 2008-04-24 | Renesas Technology Corp | 半導体装置及びその製造方法 |
EP2084744A2 (en) * | 2006-10-27 | 2009-08-05 | Unisem (Mauritius) Holdings Limited | Partially patterned lead frames and methods of making and using the same in semiconductor packaging |
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CN101937850A (zh) | 2011-01-05 |
JP2011014661A (ja) | 2011-01-20 |
US8450153B2 (en) | 2013-05-28 |
US8847379B2 (en) | 2014-09-30 |
US20130200505A1 (en) | 2013-08-08 |
CN101937850B (zh) | 2012-08-22 |
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