JP2008545553A5 - - Google Patents
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- JP2008545553A5 JP2008545553A5 JP2008513464A JP2008513464A JP2008545553A5 JP 2008545553 A5 JP2008545553 A5 JP 2008545553A5 JP 2008513464 A JP2008513464 A JP 2008513464A JP 2008513464 A JP2008513464 A JP 2008513464A JP 2008545553 A5 JP2008545553 A5 JP 2008545553A5
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- 239000000203 mixture Substances 0.000 claims description 117
- 229920001296 polysiloxane Polymers 0.000 claims description 68
- 238000000034 method Methods 0.000 claims description 54
- -1 polysiloxane Polymers 0.000 claims description 38
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 24
- 239000003795 chemical substances by application Substances 0.000 claims description 17
- 125000003342 alkenyl group Chemical group 0.000 claims description 16
- 238000002347 injection Methods 0.000 claims description 14
- 239000007924 injection Substances 0.000 claims description 14
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 12
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000007259 addition reaction Methods 0.000 claims description 4
- 239000004793 Polystyrene Substances 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 230000003197 catalytic effect Effects 0.000 claims description 3
- 238000001641 gel filtration chromatography Methods 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 239000007809 chemical reaction catalyst Substances 0.000 claims description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 40
- 239000011342 resin composition Substances 0.000 description 27
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 25
- 238000000465 moulding Methods 0.000 description 20
- 230000003287 optical effect Effects 0.000 description 19
- 239000004590 silicone sealant Substances 0.000 description 19
- 239000007788 liquid Substances 0.000 description 14
- 239000003054 catalyst Substances 0.000 description 13
- 238000001746 injection moulding Methods 0.000 description 11
- 229910052697 platinum Inorganic materials 0.000 description 11
- 238000007792 addition Methods 0.000 description 10
- 239000003112 inhibitor Substances 0.000 description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000006082 mold release agent Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000004615 ingredient Substances 0.000 description 5
- 230000014759 maintenance of location Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- 229920006362 Teflon® Polymers 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- PQPVPZTVJLXQAS-UHFFFAOYSA-N hydroxy-methyl-phenylsilicon Chemical class C[Si](O)C1=CC=CC=C1 PQPVPZTVJLXQAS-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- VEJOYRPGKZZTJW-FDGPNNRMSA-N (z)-4-hydroxypent-3-en-2-one;platinum Chemical compound [Pt].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O VEJOYRPGKZZTJW-FDGPNNRMSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- LRLQQERNMXHASR-UHFFFAOYSA-N 2-diphenylphosphanylpropan-2-yl(diphenyl)phosphane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)C(C)(C)P(C=1C=CC=CC=1)C1=CC=CC=C1 LRLQQERNMXHASR-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 101100460719 Mus musculus Noto gene Proteins 0.000 description 1
- 229910018557 Si O Inorganic materials 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 101100187345 Xenopus laevis noto gene Proteins 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003060 catalysis inhibitor Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000003493 decenyl group Chemical group [H]C([*])=C([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 229940093858 ethyl acetoacetate Drugs 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000001188 haloalkyl group Chemical group 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US68493205P | 2005-05-26 | 2005-05-26 | |
| US60/684,932 | 2005-05-26 | ||
| PCT/US2006/010001 WO2006127100A1 (en) | 2005-05-26 | 2006-03-16 | Process and silicone encapsulant composition for molding small shapes |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008545553A JP2008545553A (ja) | 2008-12-18 |
| JP2008545553A5 true JP2008545553A5 (https=) | 2011-08-18 |
| JP4800383B2 JP4800383B2 (ja) | 2011-10-26 |
Family
ID=36691852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008513464A Expired - Fee Related JP4800383B2 (ja) | 2005-05-26 | 2006-03-16 | 小さい形状を成形するための方法およびシリコーン封止剤組成物 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US8071697B2 (https=) |
| EP (1) | EP1883678B1 (https=) |
| JP (1) | JP4800383B2 (https=) |
| KR (1) | KR101289633B1 (https=) |
| CN (1) | CN101163748B (https=) |
| AT (1) | ATE410483T1 (https=) |
| DE (1) | DE602006003095D1 (https=) |
| MY (1) | MY141866A (https=) |
| TW (1) | TWI382915B (https=) |
| WO (1) | WO2006127100A1 (https=) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007086987A1 (en) * | 2006-01-17 | 2007-08-02 | Dow Corning Corporation | Thermally stable transparent silicone resin compositions and methods for their preparation and use |
| CN101336383B (zh) | 2006-02-01 | 2012-05-09 | 陶氏康宁公司 | 抗冲击的光波导管及其制造方法 |
| US8258502B2 (en) | 2006-02-24 | 2012-09-04 | Dow Corning Corporation | Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones |
| RU2401846C2 (ru) * | 2006-04-25 | 2010-10-20 | Учреждение Российской академии наук Институт синтетических полимерных материалов им. Н.С. Ениколопова РАН (ИСПМ РАН) | Функциональные полиорганосилоксаны и композиция, способная к отверждению на их основе |
| WO2008027280A2 (en) * | 2006-08-28 | 2008-03-06 | Dow Corning Corporation | Optical devices and silicone compositions and processes fabricating the optical devices |
| US7873257B2 (en) | 2007-05-01 | 2011-01-18 | Morgan Solar Inc. | Light-guide solar panel and method of fabrication thereof |
| JP5369672B2 (ja) * | 2008-01-31 | 2013-12-18 | Ｊｓｒ株式会社 | 成形体の製造方法および光学射出成形体 |
| WO2010014722A1 (en) | 2008-07-30 | 2010-02-04 | Bluestar Silicones Usa Corp. | Method for producing molded silicone rubber products using liquid silicone rubber |
| WO2011125753A1 (ja) | 2010-04-02 | 2011-10-13 | 株式会社カネカ | 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード |
| JP5170471B2 (ja) * | 2010-09-02 | 2013-03-27 | 信越化学工業株式会社 | 低ガス透過性シリコーン樹脂組成物及び光半導体装置 |
| JP5287935B2 (ja) * | 2011-06-16 | 2013-09-11 | 東レ株式会社 | 蛍光体含有シート、それを用いたｌｅｄ発光装置およびその製造方法 |
| JP5992666B2 (ja) * | 2011-06-16 | 2016-09-14 | 東レ・ダウコーニング株式会社 | 架橋性シリコーン組成物及びその架橋物 |
| JP5827834B2 (ja) | 2011-07-22 | 2015-12-02 | 日東電工株式会社 | シリコーン樹脂組成物、シリコーン樹脂シート、シリコーン樹脂シートの製造方法および光半導体装置 |
| US9139699B2 (en) | 2012-10-04 | 2015-09-22 | Dow Corning Corporation | Metal containing condensation reaction catalysts, methods for preparing the catalysts, and compositions containing the catalysts |
| JP6171263B2 (ja) * | 2012-03-19 | 2017-08-02 | 株式会社リコー | 遠隔会議システム及び遠隔会議端末 |
| JP6084808B2 (ja) | 2012-10-24 | 2017-02-22 | 東レ・ダウコーニング株式会社 | オルガノポリシロキサン、硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| JP6157085B2 (ja) | 2012-10-24 | 2017-07-05 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| JP6081774B2 (ja) * | 2012-10-30 | 2017-02-15 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| JP6363618B2 (ja) | 2012-12-27 | 2018-07-25 | ダウ シリコーンズ コーポレーション | 優れた反射率及び難燃性を有する物品を形成するための組成物、並びにそれらから形成された物品 |
| TW201431959A (zh) * | 2012-12-28 | 2014-08-16 | Dow Corning | 用於轉換器之可固化有機聚矽氧烷組合物及該可固化聚矽氧組合物於轉換器之應用 |
| FR3001874B1 (fr) * | 2013-02-12 | 2016-07-22 | Oreal | Procede de fabrication d'au moins un bloc de produit cosmetique, installation et tetine associees |
| US9470395B2 (en) | 2013-03-15 | 2016-10-18 | Abl Ip Holding Llc | Optic for a light source |
| CN103232707B (zh) * | 2013-04-19 | 2015-12-09 | 深圳新宙邦科技股份有限公司 | 可固化硅橡胶组合物及其固化产品与涂覆固化方法 |
| CA2911523C (en) | 2013-05-10 | 2018-10-02 | Abl Ip Holding Llc | Silicone optics |
| WO2015005221A1 (ja) * | 2013-07-08 | 2015-01-15 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 光半導体封止用シリコーン組成物及び光半導体装置 |
| EP3486286B1 (en) | 2013-12-26 | 2020-05-13 | Daicel Corporation | Curable composition for lens, lens and optical device |
| US9671085B2 (en) | 2014-04-22 | 2017-06-06 | Dow Corning Corporation | Reflector for an LED light source |
| JP6707369B2 (ja) * | 2015-03-30 | 2020-06-10 | ダウ・東レ株式会社 | シリコーン材料、硬化性シリコーン組成物、および光デバイス |
| JP6204420B2 (ja) | 2015-08-07 | 2017-09-27 | 株式会社ダイセル | 硬化性組成物、及びそれを用いた光学素子 |
| WO2019022861A1 (en) * | 2017-07-27 | 2019-01-31 | Dow Silicones Corporation | HYDROSILYLATION-CURABLE POLYSILOXANE |
| EP3688111A4 (en) | 2017-09-29 | 2021-07-28 | Dow Silicones Corporation | THERMAL CONDUCTIVE COMPOSITION |
| JP7754950B2 (ja) | 2022-01-04 | 2025-10-15 | 三井化学株式会社 | レンズ用樹脂組成物、レンズ用硬化物及びレンズ |
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2006
- 2006-03-16 AT AT06748465T patent/ATE410483T1/de not_active IP Right Cessation
- 2006-03-16 CN CN200680013785XA patent/CN101163748B/zh not_active Expired - Fee Related
- 2006-03-16 WO PCT/US2006/010001 patent/WO2006127100A1/en not_active Ceased
- 2006-03-16 KR KR1020077027556A patent/KR101289633B1/ko not_active Expired - Fee Related
- 2006-03-16 DE DE602006003095T patent/DE602006003095D1/de not_active Expired - Lifetime
- 2006-03-16 EP EP06748465A patent/EP1883678B1/en not_active Expired - Lifetime
- 2006-03-16 US US11/885,295 patent/US8071697B2/en not_active Expired - Fee Related
- 2006-03-16 JP JP2008513464A patent/JP4800383B2/ja not_active Expired - Fee Related
- 2006-04-13 TW TW095113172A patent/TWI382915B/zh not_active IP Right Cessation
- 2006-05-19 MY MYPI20062340A patent/MY141866A/en unknown
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