JP2008544283A - マルチ基板プローブ構造を調節する方法および装置 - Google Patents

マルチ基板プローブ構造を調節する方法および装置 Download PDF

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Publication number
JP2008544283A
JP2008544283A JP2008518368A JP2008518368A JP2008544283A JP 2008544283 A JP2008544283 A JP 2008544283A JP 2008518368 A JP2008518368 A JP 2008518368A JP 2008518368 A JP2008518368 A JP 2008518368A JP 2008544283 A JP2008544283 A JP 2008544283A
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JP
Japan
Prior art keywords
probe
card assembly
probe card
assembly
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008518368A
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English (en)
Japanese (ja)
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JP2008544283A5 (enExample
Inventor
ホッブス，エリック，ディー．
エルドリッジ，ベンジャミン，エヌ．
マ，ルンユ
マシュー，ガエタン，エル．
マーフィー，スティーブン，ティー．
シンデ，メイカーランド，エス．
スロカム，アレキサンダー，エイチ．
Original Assignee
フォームファクター， インコーポレイテッド
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Publication of JP2008544283A publication Critical patent/JP2008544283A/ja
Publication of JP2008544283A5 publication Critical patent/JP2008544283A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2008518368A 2005-06-24 2006-06-21 マルチ基板プローブ構造を調節する方法および装置 Pending JP2008544283A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/165,833 US7471094B2 (en) 2005-06-24 2005-06-24 Method and apparatus for adjusting a multi-substrate probe structure
PCT/US2006/024238 WO2007002249A2 (en) 2005-06-24 2006-06-21 Method and apparatus for adjusting a multi-substrate probe structure

Publications (2)

Publication Number Publication Date
JP2008544283A true JP2008544283A (ja) 2008-12-04
JP2008544283A5 JP2008544283A5 (enExample) 2009-08-27

Family

ID=37566570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008518368A Pending JP2008544283A (ja) 2005-06-24 2006-06-21 マルチ基板プローブ構造を調節する方法および装置

Country Status (7)

Country Link
US (2) US7471094B2 (enExample)
EP (1) EP1902324A4 (enExample)
JP (1) JP2008544283A (enExample)
KR (1) KR20080032110A (enExample)
CN (1) CN101203767A (enExample)
TW (1) TW200716986A (enExample)
WO (1) WO2007002249A2 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
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JP2011137801A (ja) * 2009-12-30 2011-07-14 Samsung Electro-Mechanics Co Ltd プローブカード
JP2011141263A (ja) * 2010-01-08 2011-07-21 Samsung Electro-Mechanics Co Ltd プローブカード
JP2011154017A (ja) * 2010-01-26 2011-08-11 Samsung Electro-Mechanics Co Ltd 水平度調節部材及びそれを備えたプローブカード
KR101689478B1 (ko) * 2015-08-24 2016-12-23 김재수 인쇄회로기판 검사지그
WO2018221234A1 (ja) * 2017-05-30 2018-12-06 株式会社日本マイクロニクス 電気的接続装置
WO2026018739A1 (ja) * 2024-07-19 2026-01-22 東京エレクトロン株式会社 検査装置、および検査用治具

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US7471094B2 (en) * 2005-06-24 2008-12-30 Formfactor, Inc. Method and apparatus for adjusting a multi-substrate probe structure
US7180316B1 (en) * 2006-02-03 2007-02-20 Touchdown Technologies, Inc. Probe head with machined mounting pads and method of forming same
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US7471078B2 (en) * 2006-12-29 2008-12-30 Formfactor, Inc. Stiffener assembly for use with testing devices
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US7764076B2 (en) * 2007-02-20 2010-07-27 Centipede Systems, Inc. Method and apparatus for aligning and/or leveling a test head
US7474531B2 (en) * 2007-02-22 2009-01-06 Inventec Corporation Circuit board testing jig
US20080231258A1 (en) * 2007-03-23 2008-09-25 Formfactor, Inc. Stiffening connector and probe card assembly incorporating same
US20080252330A1 (en) * 2007-04-16 2008-10-16 Verigy Corporation Method and apparatus for singulated die testing
JP4903624B2 (ja) * 2007-04-17 2012-03-28 株式会社日本マイクロニクス プローブユニット及び検査装置
US7808259B2 (en) * 2007-09-26 2010-10-05 Formfactor, Inc. Component assembly and alignment
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KR102038102B1 (ko) * 2013-03-07 2019-10-30 삼성디스플레이 주식회사 압착 품질 검사용 저항 측정 장치 및 이를 이용한 측정 방법
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CN111806764B (zh) * 2020-07-13 2022-08-05 博众精工科技股份有限公司 一种覆膜装置
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Cited By (9)

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Publication number Priority date Publication date Assignee Title
JP2011137801A (ja) * 2009-12-30 2011-07-14 Samsung Electro-Mechanics Co Ltd プローブカード
JP2011141263A (ja) * 2010-01-08 2011-07-21 Samsung Electro-Mechanics Co Ltd プローブカード
JP2011154017A (ja) * 2010-01-26 2011-08-11 Samsung Electro-Mechanics Co Ltd 水平度調節部材及びそれを備えたプローブカード
KR101689478B1 (ko) * 2015-08-24 2016-12-23 김재수 인쇄회로기판 검사지그
WO2018221234A1 (ja) * 2017-05-30 2018-12-06 株式会社日本マイクロニクス 電気的接続装置
JP2018200289A (ja) * 2017-05-30 2018-12-20 株式会社日本マイクロニクス 電気的接続装置
US11150268B2 (en) 2017-05-30 2021-10-19 Kabushiki Kaisha Nihon Micronics Electric connection device
JP7075725B2 (ja) 2017-05-30 2022-05-26 株式会社日本マイクロニクス 電気的接続装置
WO2026018739A1 (ja) * 2024-07-19 2026-01-22 東京エレクトロン株式会社 検査装置、および検査用治具

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WO2007002249A3 (en) 2007-11-22
KR20080032110A (ko) 2008-04-14
US20060290367A1 (en) 2006-12-28
EP1902324A2 (en) 2008-03-26
US7845072B2 (en) 2010-12-07
WO2007002249A2 (en) 2007-01-04
US20090158586A1 (en) 2009-06-25
EP1902324A4 (en) 2012-05-09
US7471094B2 (en) 2008-12-30
CN101203767A (zh) 2008-06-18

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