KR20080032110A - 다중 기판 프로브 구조체를 조정하기 위한 방법 및 장치 - Google Patents

다중 기판 프로브 구조체를 조정하기 위한 방법 및 장치 Download PDF

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Publication number
KR20080032110A
KR20080032110A KR1020087001629A KR20087001629A KR20080032110A KR 20080032110 A KR20080032110 A KR 20080032110A KR 1020087001629 A KR1020087001629 A KR 1020087001629A KR 20087001629 A KR20087001629 A KR 20087001629A KR 20080032110 A KR20080032110 A KR 20080032110A
Authority
KR
South Korea
Prior art keywords
probe
assembly
card assembly
substrate
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020087001629A
Other languages
English (en)
Korean (ko)
Inventor
에릭 디 홉스
벤자민 엔 엘드리지
룬유 마
게탄 엘 마티에유
스티븐 티 머피
마카란드 에스 쉰드
알렉산더 에이취 슬로컴
Original Assignee
폼팩터, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 폼팩터, 인코포레이티드 filed Critical 폼팩터, 인코포레이티드
Publication of KR20080032110A publication Critical patent/KR20080032110A/ko
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020087001629A 2005-06-24 2006-06-21 다중 기판 프로브 구조체를 조정하기 위한 방법 및 장치 Ceased KR20080032110A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/165,833 2005-06-24
US11/165,833 US7471094B2 (en) 2005-06-24 2005-06-24 Method and apparatus for adjusting a multi-substrate probe structure

Publications (1)

Publication Number Publication Date
KR20080032110A true KR20080032110A (ko) 2008-04-14

Family

ID=37566570

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087001629A Ceased KR20080032110A (ko) 2005-06-24 2006-06-21 다중 기판 프로브 구조체를 조정하기 위한 방법 및 장치

Country Status (7)

Country Link
US (2) US7471094B2 (enExample)
EP (1) EP1902324A4 (enExample)
JP (1) JP2008544283A (enExample)
KR (1) KR20080032110A (enExample)
CN (1) CN101203767A (enExample)
TW (1) TW200716986A (enExample)
WO (1) WO2007002249A2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101223584B1 (ko) * 2011-06-01 2013-01-17 에이엘티 세미콘(주) 프로브 카드의 정렬 장치
KR20190106708A (ko) * 2018-03-09 2019-09-18 도쿄엘렉트론가부시키가이샤 위치 보정 방법, 검사 장치 및 프로브 카드
KR20200068002A (ko) * 2017-10-18 2020-06-15 헤르메스 에피텍 코포레이션 웨이퍼 레벨 다중 사이트 테스트 구조
KR20240073534A (ko) * 2022-11-18 2024-05-27 삼성전자주식회사 프로브 카드

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7262611B2 (en) 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
WO2006060467A2 (en) * 2004-12-02 2006-06-08 Sv Probe Pte Ltd. Probe card with segmented substrate
US7471094B2 (en) * 2005-06-24 2008-12-30 Formfactor, Inc. Method and apparatus for adjusting a multi-substrate probe structure
US7180316B1 (en) * 2006-02-03 2007-02-20 Touchdown Technologies, Inc. Probe head with machined mounting pads and method of forming same
US7471078B2 (en) * 2006-12-29 2008-12-30 Formfactor, Inc. Stiffener assembly for use with testing devices
US7884627B2 (en) * 2006-12-29 2011-02-08 Formfactor, Inc. Stiffener assembly for use with testing devices
US7764079B1 (en) * 2007-01-31 2010-07-27 SemiProbe LLC Modular probe system
US7764076B2 (en) * 2007-02-20 2010-07-27 Centipede Systems, Inc. Method and apparatus for aligning and/or leveling a test head
US7474531B2 (en) * 2007-02-22 2009-01-06 Inventec Corporation Circuit board testing jig
US20080231258A1 (en) * 2007-03-23 2008-09-25 Formfactor, Inc. Stiffening connector and probe card assembly incorporating same
US20080252330A1 (en) * 2007-04-16 2008-10-16 Verigy Corporation Method and apparatus for singulated die testing
JP4903624B2 (ja) * 2007-04-17 2012-03-28 株式会社日本マイクロニクス プローブユニット及び検査装置
US7808259B2 (en) * 2007-09-26 2010-10-05 Formfactor, Inc. Component assembly and alignment
KR100932990B1 (ko) 2007-11-15 2009-12-21 (주)엠투엔 프로브 카드 조립체
JP5136024B2 (ja) * 2007-11-28 2013-02-06 日本電気株式会社 位置調整装置及び位置調整方法
US20100039133A1 (en) * 2008-08-13 2010-02-18 Formfactor, Inc. Probe head controlling mechanism for probe card assemblies
US8004296B2 (en) * 2008-08-19 2011-08-23 Centipede Systems, Inc. Probe head apparatus for testing semiconductors
US8884639B2 (en) * 2008-08-27 2014-11-11 Advantest (Singapore) Pte Ltd Methods, apparatus and articles of manufacture for testing a plurality of singulated die
US7960989B2 (en) * 2008-12-03 2011-06-14 Formfactor, Inc. Mechanical decoupling of a probe card assembly to improve thermal response
US7772863B2 (en) * 2008-12-03 2010-08-10 Formfactor, Inc. Mechanical decoupling of a probe card assembly to improve thermal response
US8760187B2 (en) * 2008-12-03 2014-06-24 L-3 Communications Corp. Thermocentric alignment of elements on parts of an apparatus
KR20100069300A (ko) * 2008-12-16 2010-06-24 삼성전자주식회사 프로브 카드와, 이를 이용한 반도체 디바이스 테스트 장치 및 방법
CN102576049A (zh) * 2009-09-25 2012-07-11 爱德万测试株式会社 探针装置及测试装置
KR101141380B1 (ko) * 2009-12-30 2012-05-03 삼성전기주식회사 프로브 카드
KR101122479B1 (ko) * 2010-01-08 2012-02-29 삼성전기주식회사 프로브 카드
KR101108726B1 (ko) * 2010-01-26 2012-02-29 삼성전기주식회사 수평도 조절부재
US20120038383A1 (en) * 2010-08-13 2012-02-16 Chien-Chou Wu Direct-docking probing device
JP2012047674A (ja) * 2010-08-30 2012-03-08 Advantest Corp 試験用個片基板、プローブ、及び半導体ウェハ試験装置
US8618827B2 (en) * 2010-10-13 2013-12-31 Taiwan Semiconductor Manufacturing Company, Ltd. Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device
US8736294B2 (en) * 2010-12-14 2014-05-27 Formfactor, Inc. Probe card stiffener with decoupling
KR101191343B1 (ko) * 2010-12-30 2012-10-16 주식회사 탑 엔지니어링 어레이 테스트 장치
TWI454710B (zh) * 2012-09-19 2014-10-01 Mpi Corp Probe card and its manufacturing method
KR102038102B1 (ko) * 2013-03-07 2019-10-30 삼성디스플레이 주식회사 압착 품질 검사용 저항 측정 장치 및 이를 이용한 측정 방법
KR20140110443A (ko) * 2013-03-08 2014-09-17 삼성전자주식회사 프로브 카드
CN104183515A (zh) * 2013-05-24 2014-12-03 标准科技股份有限公司 晶圆测试机台
US10101367B2 (en) * 2015-04-10 2018-10-16 Intel Corporation Microelectronic test device including a probe card having an interposer
KR101689478B1 (ko) * 2015-08-24 2016-12-23 김재수 인쇄회로기판 검사지그
CN106597037B (zh) * 2015-10-20 2019-07-16 创意电子股份有限公司 探针卡与测试方法
CN106935524B (zh) 2015-12-24 2020-04-21 台湾积体电路制造股份有限公司 探针卡和晶圆测试系统及晶圆测试方法
CN107037345B (zh) * 2016-02-02 2019-09-17 上海和辉光电有限公司 晶圆测试时自我检测的方法及其晶圆测试制具
CN107422241B (zh) * 2016-03-23 2019-10-15 创意电子股份有限公司 使用探针卡的方法及系统
US11207685B2 (en) * 2017-02-13 2021-12-28 Bio-Rad Laboratories, Inc. System, method, and device for forming an array of emulsions
JP7075725B2 (ja) * 2017-05-30 2022-05-26 株式会社日本マイクロニクス 電気的接続装置
CN107368100A (zh) * 2017-06-26 2017-11-21 上海华岭集成电路技术股份有限公司 调整悬臂探针卡针迹的方法
US10345136B2 (en) 2017-07-14 2019-07-09 International Business Machines Corporation Adjustable load transmitter
US10527649B2 (en) 2017-07-14 2020-01-07 International Business Machines Corporation Probe card alignment
CN107389983B (zh) * 2017-07-31 2020-05-12 京东方科技集团股份有限公司 定位装置及显示模组的电学检测系统
CN111806764B (zh) * 2020-07-13 2022-08-05 博众精工科技股份有限公司 一种覆膜装置
CN113655194B (zh) * 2021-01-12 2024-03-22 杭州申昊科技股份有限公司 一种旋转调节机构及具有旋转调节机构的探头架检测台
CN116559625A (zh) * 2023-05-30 2023-08-08 强一半导体(苏州)股份有限公司 一种探针头对位装置及其使用方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3730016A (en) 1971-06-14 1973-05-01 Continental Can Co Friction drive differential screw
JPH0421973U (enExample) * 1990-06-14 1992-02-24
US5550482A (en) * 1993-07-20 1996-08-27 Tokyo Electron Kabushiki Kaisha Probe device
US5974662A (en) * 1993-11-16 1999-11-02 Formfactor, Inc. Method of planarizing tips of probe elements of a probe card assembly
US5806181A (en) * 1993-11-16 1998-09-15 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US5642056A (en) * 1993-12-22 1997-06-24 Tokyo Electron Limited Probe apparatus for correcting the probe card posture before testing
US5994152A (en) * 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US6690185B1 (en) * 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
US7063541B2 (en) 1997-03-17 2006-06-20 Formfactor, Inc. Composite microelectronic spring structure and method for making same
WO1999000844A2 (en) * 1997-06-30 1999-01-07 Formfactor, Inc. Sockets for semiconductor devices with spring contact elements
US6096567A (en) * 1997-12-01 2000-08-01 Electroglas, Inc. Method and apparatus for direct probe sensing
JP2000147063A (ja) * 1998-11-10 2000-05-26 Oki Micro Design Co Ltd プローブカード
US6255126B1 (en) * 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements
US7215131B1 (en) * 1999-06-07 2007-05-08 Formfactor, Inc. Segmented contactor
US6330744B1 (en) * 1999-07-12 2001-12-18 Pjc Technologies, Inc. Customized electrical test probe head using uniform probe assemblies
EP1200843A1 (en) * 1999-07-28 2002-05-02 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US6939474B2 (en) * 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
DE19952943C2 (de) * 1999-11-03 2003-07-03 Infineon Technologies Ag Nadelkarten-Justageeinrichtung zur Planarisierung von Nadelsätzen einer Nadelkarte
US6496026B1 (en) 2000-02-25 2002-12-17 Microconnect, Inc. Method of manufacturing and testing an electronic device using a contact device having fingers and a mechanical ground
AU2001250876A1 (en) * 2000-03-17 2001-10-03 Formfactor, Inc. Method and apparatus for planarizing a semiconductor contactor
US6509751B1 (en) * 2000-03-17 2003-01-21 Formfactor, Inc. Planarizer for a semiconductor contactor
US7262611B2 (en) 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
DE10039336C2 (de) * 2000-08-04 2003-12-11 Infineon Technologies Ag Verfahren zum Testen von Halbleiterschaltungen und Testvorrichtung zur Durchführung des Verfahrens
JP4123408B2 (ja) * 2001-12-13 2008-07-23 東京エレクトロン株式会社 プローブカード交換装置
DE10392404T5 (de) * 2002-03-22 2005-04-14 Electro Scientific Industries, Inc., Portland Messkopfausrichtungsvorrichtung
US7084650B2 (en) * 2002-12-16 2006-08-01 Formfactor, Inc. Apparatus and method for limiting over travel in a probe card assembly
US7202682B2 (en) * 2002-12-20 2007-04-10 Formfactor, Inc. Composite motion probing
US6974662B2 (en) * 2003-08-04 2005-12-13 Eastman Kodak Company Thermal base precursors
EP1742073A1 (en) * 2004-04-27 2007-01-10 Kabushiki Kaisha Nihon Micronics Electric connecting device
US7285968B2 (en) * 2005-04-19 2007-10-23 Formfactor, Inc. Apparatus and method for managing thermally induced motion of a probe card assembly
US7471094B2 (en) 2005-06-24 2008-12-30 Formfactor, Inc. Method and apparatus for adjusting a multi-substrate probe structure
JP4625387B2 (ja) * 2005-09-16 2011-02-02 東京エレクトロン株式会社 プローブカードのクランプ機構及びプローブ装置
US7622935B2 (en) * 2005-12-02 2009-11-24 Formfactor, Inc. Probe card assembly with a mechanically decoupled wiring substrate
US7671614B2 (en) * 2005-12-02 2010-03-02 Formfactor, Inc. Apparatus and method for adjusting an orientation of probes
US7365553B2 (en) * 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
US7368930B2 (en) * 2006-08-04 2008-05-06 Formfactor, Inc. Adjustment mechanism

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101223584B1 (ko) * 2011-06-01 2013-01-17 에이엘티 세미콘(주) 프로브 카드의 정렬 장치
KR20200068002A (ko) * 2017-10-18 2020-06-15 헤르메스 에피텍 코포레이션 웨이퍼 레벨 다중 사이트 테스트 구조
KR20190106708A (ko) * 2018-03-09 2019-09-18 도쿄엘렉트론가부시키가이샤 위치 보정 방법, 검사 장치 및 프로브 카드
US11119122B2 (en) 2018-03-09 2021-09-14 Tokyo Electron Limited Position correction method, inspection apparatus, and probe card
KR20240073534A (ko) * 2022-11-18 2024-05-27 삼성전자주식회사 프로브 카드

Also Published As

Publication number Publication date
JP2008544283A (ja) 2008-12-04
TW200716986A (en) 2007-05-01
EP1902324A4 (en) 2012-05-09
US7471094B2 (en) 2008-12-30
US7845072B2 (en) 2010-12-07
US20090158586A1 (en) 2009-06-25
CN101203767A (zh) 2008-06-18
EP1902324A2 (en) 2008-03-26
WO2007002249A2 (en) 2007-01-04
US20060290367A1 (en) 2006-12-28
WO2007002249A3 (en) 2007-11-22

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