CN101203767A - 用于调整多基片探针结构的方法和装置 - Google Patents

用于调整多基片探针结构的方法和装置 Download PDF

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Publication number
CN101203767A
CN101203767A CNA2006800226711A CN200680022671A CN101203767A CN 101203767 A CN101203767 A CN 101203767A CN A2006800226711 A CNA2006800226711 A CN A2006800226711A CN 200680022671 A CN200680022671 A CN 200680022671A CN 101203767 A CN101203767 A CN 101203767A
Authority
CN
China
Prior art keywords
probe
assembly
card assembly
substrate
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006800226711A
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English (en)
Chinese (zh)
Inventor
E·D·霍博斯
B·N·埃尔德瑞格
L·马
G·L·马修
S·T·墨菲
M·S·肖恩迪
A·H·斯洛克姆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of CN101203767A publication Critical patent/CN101203767A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
CNA2006800226711A 2005-06-24 2006-06-21 用于调整多基片探针结构的方法和装置 Pending CN101203767A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/165,833 2005-06-24
US11/165,833 US7471094B2 (en) 2005-06-24 2005-06-24 Method and apparatus for adjusting a multi-substrate probe structure

Publications (1)

Publication Number Publication Date
CN101203767A true CN101203767A (zh) 2008-06-18

Family

ID=37566570

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006800226711A Pending CN101203767A (zh) 2005-06-24 2006-06-21 用于调整多基片探针结构的方法和装置

Country Status (7)

Country Link
US (2) US7471094B2 (enExample)
EP (1) EP1902324A4 (enExample)
JP (1) JP2008544283A (enExample)
KR (1) KR20080032110A (enExample)
CN (1) CN101203767A (enExample)
TW (1) TW200716986A (enExample)
WO (1) WO2007002249A2 (enExample)

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CN102445649A (zh) * 2010-10-13 2012-05-09 台湾积体电路制造股份有限公司 半导体芯片的测试结构及应用于测量电介质特性的方法
CN102565564A (zh) * 2010-12-30 2012-07-11 塔工程有限公司 阵列测试装置
CN103675369A (zh) * 2012-09-19 2014-03-26 旺矽科技股份有限公司 探针卡及其制造方法
CN104034964A (zh) * 2013-03-07 2014-09-10 三星显示有限公司 检查压缩质量的电阻测量装置及使用该装置的测量方法
CN104183515A (zh) * 2013-05-24 2014-12-03 标准科技股份有限公司 晶圆测试机台
TWI476410B (zh) * 2008-12-03 2015-03-11 Formfactor Inc 用於改善熱回應的探針卡總成之機械式解耦技術
TWI499472B (zh) * 2008-12-03 2015-09-11 Formfactor Inc 裝置部件上之元件的熱中央式對準技術
CN106597037A (zh) * 2015-10-20 2017-04-26 创意电子股份有限公司 探针卡与测试方法
CN107037345A (zh) * 2016-02-02 2017-08-11 上海和辉光电有限公司 晶圆测试时自我检测的方法及其晶圆测试制具
CN107368100A (zh) * 2017-06-26 2017-11-21 上海华岭集成电路技术股份有限公司 调整悬臂探针卡针迹的方法
CN107389983A (zh) * 2017-07-31 2017-11-24 京东方科技集团股份有限公司 定位装置及显示模组的电学检测系统
CN110505918A (zh) * 2017-02-13 2019-11-26 生物辐射实验室股份有限公司 用于形成乳状液阵列的系统、方法以及装置
CN110678759A (zh) * 2017-05-30 2020-01-10 日本麦可罗尼克斯股份有限公司 电连接装置
CN111806764A (zh) * 2020-07-13 2020-10-23 博众精工科技股份有限公司 一种覆膜装置
CN116559625A (zh) * 2023-05-30 2023-08-08 强一半导体(苏州)股份有限公司 一种探针头对位装置及其使用方法

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CN107422241B (zh) * 2016-03-23 2019-10-15 创意电子股份有限公司 使用探针卡的方法及系统
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CN113655194B (zh) * 2021-01-12 2024-03-22 杭州申昊科技股份有限公司 一种旋转调节机构及具有旋转调节机构的探头架检测台
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TWI499472B (zh) * 2008-12-03 2015-09-11 Formfactor Inc 裝置部件上之元件的熱中央式對準技術
TWI476410B (zh) * 2008-12-03 2015-03-11 Formfactor Inc 用於改善熱回應的探針卡總成之機械式解耦技術
CN102445649B (zh) * 2010-10-13 2015-08-12 台湾积体电路制造股份有限公司 半导体芯片的测试结构及应用于测量电介质特性的方法
CN102445649A (zh) * 2010-10-13 2012-05-09 台湾积体电路制造股份有限公司 半导体芯片的测试结构及应用于测量电介质特性的方法
CN102565564A (zh) * 2010-12-30 2012-07-11 塔工程有限公司 阵列测试装置
CN103675369A (zh) * 2012-09-19 2014-03-26 旺矽科技股份有限公司 探针卡及其制造方法
CN104034964A (zh) * 2013-03-07 2014-09-10 三星显示有限公司 检查压缩质量的电阻测量装置及使用该装置的测量方法
CN104034964B (zh) * 2013-03-07 2019-02-05 三星显示有限公司 检查压缩质量的电阻测量装置及使用该装置的测量方法
CN104183515A (zh) * 2013-05-24 2014-12-03 标准科技股份有限公司 晶圆测试机台
CN106597037A (zh) * 2015-10-20 2017-04-26 创意电子股份有限公司 探针卡与测试方法
CN106597037B (zh) * 2015-10-20 2019-07-16 创意电子股份有限公司 探针卡与测试方法
CN107037345A (zh) * 2016-02-02 2017-08-11 上海和辉光电有限公司 晶圆测试时自我检测的方法及其晶圆测试制具
CN107037345B (zh) * 2016-02-02 2019-09-17 上海和辉光电有限公司 晶圆测试时自我检测的方法及其晶圆测试制具
CN110505918A (zh) * 2017-02-13 2019-11-26 生物辐射实验室股份有限公司 用于形成乳状液阵列的系统、方法以及装置
CN110678759A (zh) * 2017-05-30 2020-01-10 日本麦可罗尼克斯股份有限公司 电连接装置
CN110678759B (zh) * 2017-05-30 2022-11-08 日本麦可罗尼克斯股份有限公司 电连接装置
CN107368100A (zh) * 2017-06-26 2017-11-21 上海华岭集成电路技术股份有限公司 调整悬臂探针卡针迹的方法
CN107389983A (zh) * 2017-07-31 2017-11-24 京东方科技集团股份有限公司 定位装置及显示模组的电学检测系统
CN111806764A (zh) * 2020-07-13 2020-10-23 博众精工科技股份有限公司 一种覆膜装置
CN116559625A (zh) * 2023-05-30 2023-08-08 强一半导体(苏州)股份有限公司 一种探针头对位装置及其使用方法

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US7845072B2 (en) 2010-12-07
US20090158586A1 (en) 2009-06-25
KR20080032110A (ko) 2008-04-14
EP1902324A2 (en) 2008-03-26
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US20060290367A1 (en) 2006-12-28
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