JP2008538257A5 - - Google Patents

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Publication number
JP2008538257A5
JP2008538257A5 JP2008504277A JP2008504277A JP2008538257A5 JP 2008538257 A5 JP2008538257 A5 JP 2008538257A5 JP 2008504277 A JP2008504277 A JP 2008504277A JP 2008504277 A JP2008504277 A JP 2008504277A JP 2008538257 A5 JP2008538257 A5 JP 2008538257A5
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JP
Japan
Prior art keywords
amorphous film
state
stressor material
densifying
forming
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Application number
JP2008504277A
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English (en)
Japanese (ja)
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JP4818352B2 (ja
JP2008538257A (ja
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Priority claimed from US10/907,454 external-priority patent/US7585704B2/en
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Publication of JP2008538257A publication Critical patent/JP2008538257A/ja
Publication of JP2008538257A5 publication Critical patent/JP2008538257A5/ja
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Publication of JP4818352B2 publication Critical patent/JP4818352B2/ja
Expired - Fee Related legal-status Critical Current
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JP2008504277A 2005-04-01 2006-03-29 堆積ストレッサ材料の応力レベルを上昇させる方法、及び半導体構造体を形成する方法 Expired - Fee Related JP4818352B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/907,454 US7585704B2 (en) 2005-04-01 2005-04-01 Method of producing highly strained PECVD silicon nitride thin films at low temperature
US10/907,454 2005-04-01
PCT/US2006/011391 WO2006107669A2 (en) 2005-04-01 2006-03-29 Method of producing highly strained pecvd silicon nitride thin films at low temperature

Publications (3)

Publication Number Publication Date
JP2008538257A JP2008538257A (ja) 2008-10-16
JP2008538257A5 true JP2008538257A5 (enExample) 2009-02-19
JP4818352B2 JP4818352B2 (ja) 2011-11-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008504277A Expired - Fee Related JP4818352B2 (ja) 2005-04-01 2006-03-29 堆積ストレッサ材料の応力レベルを上昇させる方法、及び半導体構造体を形成する方法

Country Status (6)

Country Link
US (1) US7585704B2 (enExample)
EP (1) EP1864319A4 (enExample)
JP (1) JP4818352B2 (enExample)
CN (1) CN101584025B (enExample)
TW (1) TWI391516B (enExample)
WO (1) WO2006107669A2 (enExample)

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