JP2006332606A5 - - Google Patents

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Publication number
JP2006332606A5
JP2006332606A5 JP2006105193A JP2006105193A JP2006332606A5 JP 2006332606 A5 JP2006332606 A5 JP 2006332606A5 JP 2006105193 A JP2006105193 A JP 2006105193A JP 2006105193 A JP2006105193 A JP 2006105193A JP 2006332606 A5 JP2006332606 A5 JP 2006332606A5
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JP
Japan
Prior art keywords
plasma
glass substrate
insulating film
respect
strain point
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Application number
JP2006105193A
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English (en)
Japanese (ja)
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JP2006332606A (ja
JP4993938B2 (ja
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Priority to JP2006105193A priority Critical patent/JP4993938B2/ja
Priority claimed from JP2006105193A external-priority patent/JP4993938B2/ja
Publication of JP2006332606A publication Critical patent/JP2006332606A/ja
Publication of JP2006332606A5 publication Critical patent/JP2006332606A5/ja
Application granted granted Critical
Publication of JP4993938B2 publication Critical patent/JP4993938B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006105193A 2005-04-28 2006-04-06 半導体装置の作製方法 Expired - Fee Related JP4993938B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006105193A JP4993938B2 (ja) 2005-04-28 2006-04-06 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005133713 2005-04-28
JP2005133713 2005-04-28
JP2006105193A JP4993938B2 (ja) 2005-04-28 2006-04-06 半導体装置の作製方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011235716A Division JP4994513B2 (ja) 2005-04-28 2011-10-27 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2006332606A JP2006332606A (ja) 2006-12-07
JP2006332606A5 true JP2006332606A5 (enExample) 2009-03-19
JP4993938B2 JP4993938B2 (ja) 2012-08-08

Family

ID=37553920

Family Applications (1)

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JP2006105193A Expired - Fee Related JP4993938B2 (ja) 2005-04-28 2006-04-06 半導体装置の作製方法

Country Status (1)

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JP (1) JP4993938B2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008038788A1 (en) * 2006-09-29 2008-04-03 Tokyo Electron Limited Method for forming silicon oxide film, plasma processing apparatus and storage medium
US8420456B2 (en) 2007-06-12 2013-04-16 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing for thin film transistor
KR101015338B1 (ko) 2008-03-13 2011-02-16 삼성모바일디스플레이주식회사 박막 트랜지스터의 제조방법
KR101634411B1 (ko) 2008-10-31 2016-06-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 구동 회로, 표시 장치 및 전자 장치
KR102503687B1 (ko) * 2009-07-03 2023-02-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
US8704230B2 (en) * 2010-08-26 2014-04-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9202822B2 (en) 2010-12-17 2015-12-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9401396B2 (en) * 2011-04-19 2016-07-26 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device and plasma oxidation treatment method
WO2015137022A1 (ja) * 2014-03-14 2015-09-17 ソニー株式会社 電子デバイス及びその製造方法
CN110313057A (zh) * 2017-02-28 2019-10-08 夏普株式会社 有源矩阵基板的制造方法和有机el显示装置的制造方法
WO2018163287A1 (ja) * 2017-03-07 2018-09-13 シャープ株式会社 アクティブマトリクス基板の製造方法、有機ｅｌ表示装置の製造方法およびアクティブマトリクス基板
KR102637201B1 (ko) * 2018-03-01 2024-02-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS644070A (en) * 1987-06-26 1989-01-09 Hitachi Ltd Thin film transistor and manufacture thereof
JPH031572A (ja) * 1989-05-29 1991-01-08 Fujitsu Ltd 薄膜トランジスタマトリクス及びその製造方法
KR960002086B1 (ko) * 1993-04-16 1996-02-10 엘지전자주식회사 박막 트랜지스터의 제조방법
JPH06338492A (ja) * 1993-05-31 1994-12-06 Matsushita Electric Ind Co Ltd 絶縁膜の形成方法、および薄膜トランジスタ用ゲート絶縁膜の製造方法
JP2001147424A (ja) * 1999-11-19 2001-05-29 Hitachi Ltd 導電性薄膜形成用の絶縁基板およびこの絶縁基板を用いた液晶表示素子
TW200511430A (en) * 2003-05-29 2005-03-16 Tokyo Electron Ltd Plasma processing apparatus and plasma processing method

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