JP2008531319A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008531319A5 JP2008531319A5 JP2007558239A JP2007558239A JP2008531319A5 JP 2008531319 A5 JP2008531319 A5 JP 2008531319A5 JP 2007558239 A JP2007558239 A JP 2007558239A JP 2007558239 A JP2007558239 A JP 2007558239A JP 2008531319 A5 JP2008531319 A5 JP 2008531319A5
- Authority
- JP
- Japan
- Prior art keywords
- sapphire
- polishing
- acid
- salt
- slurry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052594 sapphire Inorganic materials 0.000 claims 24
- 239000010980 sapphire Substances 0.000 claims 24
- 238000000034 method Methods 0.000 claims 21
- 238000005498 polishing Methods 0.000 claims 20
- -1 salt compound Chemical class 0.000 claims 18
- 239000002002 slurry Substances 0.000 claims 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 8
- 229910052783 alkali metal Inorganic materials 0.000 claims 7
- 239000008119 colloidal silica Substances 0.000 claims 6
- 239000003082 abrasive agent Substances 0.000 claims 5
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims 5
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims 4
- 239000002253 acid Substances 0.000 claims 4
- 150000001340 alkali metals Chemical class 0.000 claims 4
- 239000012736 aqueous medium Substances 0.000 claims 4
- 150000007522 mineralic acids Chemical class 0.000 claims 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims 3
- 239000000203 mixture Substances 0.000 claims 3
- 150000007524 organic acids Chemical class 0.000 claims 3
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 claims 3
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 claims 2
- SIOXPEMLGUPBBT-UHFFFAOYSA-N picolinic acid Chemical compound OC(=O)C1=CC=CC=N1 SIOXPEMLGUPBBT-UHFFFAOYSA-N 0.000 claims 2
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 claims 2
- 239000011780 sodium chloride Substances 0.000 claims 2
- BMYNFMYTOJXKLE-UHFFFAOYSA-N 3-azaniumyl-2-hydroxypropanoate Chemical compound NCC(O)C(O)=O BMYNFMYTOJXKLE-UHFFFAOYSA-N 0.000 claims 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 claims 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims 1
- 238000005299 abrasion Methods 0.000 claims 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims 1
- 239000008365 aqueous carrier Substances 0.000 claims 1
- 229960005070 ascorbic acid Drugs 0.000 claims 1
- 235000010323 ascorbic acid Nutrition 0.000 claims 1
- 239000011668 ascorbic acid Substances 0.000 claims 1
- 239000001110 calcium chloride Substances 0.000 claims 1
- 229910001628 calcium chloride Inorganic materials 0.000 claims 1
- 235000011148 calcium chloride Nutrition 0.000 claims 1
- 159000000007 calcium salts Chemical group 0.000 claims 1
- 229960004887 ferric hydroxide Drugs 0.000 claims 1
- 229940093915 gynecological organic acid Drugs 0.000 claims 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 claims 1
- 229940071870 hydroiodic acid Drugs 0.000 claims 1
- 150000002505 iron Chemical class 0.000 claims 1
- IEECXTSVVFWGSE-UHFFFAOYSA-M iron(3+);oxygen(2-);hydroxide Chemical compound [OH-].[O-2].[Fe+3] IEECXTSVVFWGSE-UHFFFAOYSA-M 0.000 claims 1
- 229910003002 lithium salt Inorganic materials 0.000 claims 1
- 159000000002 lithium salts Chemical class 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910017604 nitric acid Inorganic materials 0.000 claims 1
- 235000005985 organic acids Nutrition 0.000 claims 1
- 235000006408 oxalic acid Nutrition 0.000 claims 1
- 229940116315 oxalic acid Drugs 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229940081066 picolinic acid Drugs 0.000 claims 1
- 238000007517 polishing process Methods 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 235000009518 sodium iodide Nutrition 0.000 claims 1
- 159000000000 sodium salts Chemical group 0.000 claims 1
- 229910052938 sodium sulfate Inorganic materials 0.000 claims 1
- 235000011152 sodium sulphate Nutrition 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US65865305P | 2005-03-04 | 2005-03-04 | |
| PCT/US2006/007518 WO2006115581A2 (en) | 2005-03-04 | 2006-03-02 | Composition and method for polishing a sapphire surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008531319A JP2008531319A (ja) | 2008-08-14 |
| JP2008531319A5 true JP2008531319A5 (enExample) | 2009-03-19 |
Family
ID=37215174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007558239A Pending JP2008531319A (ja) | 2005-03-04 | 2006-03-02 | サファイア表面を研磨するための組成物および方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20060196849A1 (enExample) |
| EP (1) | EP1868953A4 (enExample) |
| JP (1) | JP2008531319A (enExample) |
| KR (1) | KR20070114800A (enExample) |
| CN (1) | CN101511532A (enExample) |
| CA (1) | CA2599401A1 (enExample) |
| IL (1) | IL185418A0 (enExample) |
| TW (1) | TWI287484B (enExample) |
| WO (1) | WO2006115581A2 (enExample) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101715024B1 (ko) * | 2006-12-28 | 2017-03-10 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | 사파이어 기판 |
| JP5098483B2 (ja) * | 2007-07-25 | 2012-12-12 | 住友金属鉱山株式会社 | サファイア基板の研磨方法 |
| US9120960B2 (en) | 2007-10-05 | 2015-09-01 | Saint-Gobain Ceramics & Plastics, Inc. | Composite slurries of nano silicon carbide and alumina |
| CN101302403B (zh) * | 2008-07-03 | 2011-10-19 | 大连理工大学 | 用于大尺寸金刚石晶圆超精密低损伤抛光的抛光液及制备方法 |
| WO2010075091A2 (en) | 2008-12-15 | 2010-07-01 | Saint-Gobain Abrasives, Inc. | Bonded abrasive article and method of use |
| JP5443192B2 (ja) * | 2010-02-10 | 2014-03-19 | 株式会社ディスコ | サファイア基板の加工方法 |
| CN102869478A (zh) * | 2010-04-28 | 2013-01-09 | 日本百考基株式会社 | 蓝宝石研磨用浆液和蓝宝石的研磨方法 |
| CN102585705B (zh) * | 2011-12-21 | 2014-02-05 | 上海新安纳电子科技有限公司 | 一种用于蓝宝石衬底的化学机械抛光液及其应用 |
| US10052848B2 (en) | 2012-03-06 | 2018-08-21 | Apple Inc. | Sapphire laminates |
| CN103184010A (zh) * | 2012-04-05 | 2013-07-03 | 铜陵市琨鹏光电科技有限公司 | 一种用于led用蓝宝石衬底片精密抛光的抛光液 |
| CN102775916B (zh) * | 2012-07-16 | 2015-01-07 | 芜湖海森材料科技有限公司 | 一种提高蓝宝石表面质量的抛光组合物 |
| US9221289B2 (en) | 2012-07-27 | 2015-12-29 | Apple Inc. | Sapphire window |
| JP6273281B2 (ja) * | 2012-08-24 | 2018-01-31 | エコラブ ユーエスエイ インク | サファイア表面を研磨する方法 |
| CN102873590B (zh) * | 2012-10-24 | 2015-07-15 | 广州普贺宝石饰品有限公司 | 黑曜石抛光方法 |
| CN102911606A (zh) * | 2012-11-10 | 2013-02-06 | 长治虹源科技晶片技术有限公司 | 一种蓝宝石抛光液及配制方法 |
| US9232672B2 (en) | 2013-01-10 | 2016-01-05 | Apple Inc. | Ceramic insert control mechanism |
| JP6436517B2 (ja) * | 2013-02-20 | 2018-12-12 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP6291026B2 (ja) * | 2013-03-15 | 2018-03-14 | エコラボ ユーエスエー インコーポレイティド | サファイアの表面を研磨する方法 |
| CN103252708B (zh) * | 2013-05-29 | 2016-01-06 | 南京航空航天大学 | 基于固结磨料抛光垫的蓝宝石衬底的超精密加工方法 |
| US9388328B2 (en) | 2013-08-23 | 2016-07-12 | Diamond Innovations, Inc. | Lapping slurry having a cationic surfactant |
| US9633831B2 (en) * | 2013-08-26 | 2017-04-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same |
| US9678540B2 (en) | 2013-09-23 | 2017-06-13 | Apple Inc. | Electronic component embedded in ceramic material |
| US9632537B2 (en) | 2013-09-23 | 2017-04-25 | Apple Inc. | Electronic component embedded in ceramic material |
| CN103753381B (zh) * | 2013-11-12 | 2016-06-22 | 江苏吉星新材料有限公司 | A-面蓝宝石晶片的表面抛光方法 |
| US9154678B2 (en) | 2013-12-11 | 2015-10-06 | Apple Inc. | Cover glass arrangement for an electronic device |
| US9225056B2 (en) | 2014-02-12 | 2015-12-29 | Apple Inc. | Antenna on sapphire structure |
| JP6506913B2 (ja) * | 2014-03-31 | 2019-04-24 | ニッタ・ハース株式会社 | 研磨用組成物及び研磨方法 |
| JP6408236B2 (ja) * | 2014-04-03 | 2018-10-17 | 昭和電工株式会社 | 研磨組成物、及び該研磨組成物を用いた基板の研磨方法 |
| WO2016033253A1 (en) * | 2014-08-27 | 2016-03-03 | Apple Inc. | Sapphire cover for electronic devices |
| KR20170047307A (ko) * | 2014-08-29 | 2017-05-04 | 캐보트 마이크로일렉트로닉스 코포레이션 | 사파이어 표면을 연마하기 위한 방법 및 조성물 |
| JP5940754B1 (ja) * | 2014-10-14 | 2016-06-29 | 花王株式会社 | サファイア板用研磨液組成物 |
| JP6536176B2 (ja) * | 2015-05-27 | 2019-07-03 | 日立化成株式会社 | サファイア用研磨液、貯蔵液及び研磨方法 |
| US10406634B2 (en) | 2015-07-01 | 2019-09-10 | Apple Inc. | Enhancing strength in laser cutting of ceramic components |
| US10112278B2 (en) * | 2015-09-25 | 2018-10-30 | Apple Inc. | Polishing a ceramic component using a formulated slurry |
| CN105462504A (zh) * | 2015-12-11 | 2016-04-06 | 蓝思科技（长沙）有限公司 | 一种c向蓝宝石抛光液及其制备方法 |
| RU2635132C1 (ru) * | 2017-02-20 | 2017-11-09 | Общество с ограниченной ответственностью "Научно-технический центр "Компас" (ООО "НТЦ "Компас") | Полировальная суспензия для сапфировых подложек |
| US10377014B2 (en) | 2017-02-28 | 2019-08-13 | Ecolab Usa Inc. | Increased wetting of colloidal silica as a polishing slurry |
| US10775889B1 (en) | 2017-07-21 | 2020-09-15 | Apple Inc. | Enclosure with locally-flexible regions |
| CN110018028B (zh) * | 2019-04-17 | 2023-01-13 | 宸鸿科技(厦门)有限公司 | 一种蓝宝石基材电子组件的金相切片样品制备方法 |
| CN119912878B (zh) * | 2025-04-02 | 2025-06-10 | 芯越微电子材料(嘉兴)有限公司 | 一种化学机械抛光液及应用 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5927316B2 (ja) * | 1976-06-11 | 1984-07-04 | 日本電信電話株式会社 | 結晶の無じよう乱鏡面研摩方法 |
| US4959113C1 (en) * | 1989-07-31 | 2001-03-13 | Rodel Inc | Method and composition for polishing metal surfaces |
| CA2039998A1 (en) * | 1990-10-09 | 1992-04-10 | Donald C. Zipperian | Mechanochemical polishing abrasive |
| JPH10204416A (ja) * | 1997-01-21 | 1998-08-04 | Fujimi Inkooporeetetsudo:Kk | 研磨用組成物 |
| JP4132432B2 (ja) * | 1999-07-02 | 2008-08-13 | 日産化学工業株式会社 | 研磨用組成物 |
| US20040055993A1 (en) * | 1999-10-12 | 2004-03-25 | Moudgil Brij M. | Materials and methods for control of stability and rheological behavior of particulate suspensions |
| CA2607856C (en) * | 2000-05-12 | 2009-10-20 | Nissan Chemical Industries, Ltd. | Polishing composition |
| US7416680B2 (en) * | 2001-10-12 | 2008-08-26 | International Business Machines Corporation | Self-cleaning colloidal slurry composition and process for finishing a surface of a substrate |
| US7306748B2 (en) * | 2003-04-25 | 2007-12-11 | Saint-Gobain Ceramics & Plastics, Inc. | Methods for machining ceramics |
| US7201784B2 (en) * | 2003-06-30 | 2007-04-10 | Intel Corporation | Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low k dielectrics |
| US7968465B2 (en) * | 2003-08-14 | 2011-06-28 | Dupont Air Products Nanomaterials Llc | Periodic acid compositions for polishing ruthenium/low K substrates |
| US7223156B2 (en) * | 2003-11-14 | 2007-05-29 | Amcol International Corporation | Method chemical-mechanical polishing and planarizing corundum, GaAs, GaP and GaAs/GaP alloy surfaces |
| KR101715024B1 (ko) * | 2006-12-28 | 2017-03-10 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | 사파이어 기판 |
-
2006
- 2006-03-01 US US11/365,155 patent/US20060196849A1/en not_active Abandoned
- 2006-03-02 KR KR1020077022502A patent/KR20070114800A/ko not_active Withdrawn
- 2006-03-02 CN CNA2006800070811A patent/CN101511532A/zh active Pending
- 2006-03-02 JP JP2007558239A patent/JP2008531319A/ja active Pending
- 2006-03-02 CA CA002599401A patent/CA2599401A1/en not_active Abandoned
- 2006-03-02 EP EP06784322A patent/EP1868953A4/en not_active Withdrawn
- 2006-03-02 WO PCT/US2006/007518 patent/WO2006115581A2/en not_active Ceased
- 2006-03-03 TW TW095107298A patent/TWI287484B/zh not_active IP Right Cessation
-
2007
- 2007-08-21 IL IL185418A patent/IL185418A0/en unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2008531319A5 (enExample) | ||
| TWI287484B (en) | Composition and method for polishing a sapphire surface | |
| JP5385141B2 (ja) | 水に可溶性酸化剤を使用する炭化ケイ素の研磨方法 | |
| CN102089865B (zh) | 抛光镍-磷的方法 | |
| JP2010503232A5 (enExample) | ||
| TWI444458B (zh) | 用於金屬移除速率控制之鹵化物陰離子 | |
| TWI596202B (zh) | 用於鎳-磷記憶碟之拋光組合物 | |
| JP2001342454A (ja) | 研磨剤、研磨方法及び半導体装置の製造方法 | |
| JP6506913B2 (ja) | 研磨用組成物及び研磨方法 | |
| EP3210238A1 (en) | Cobalt polishing accelerators | |
| WO2018116521A1 (ja) | 研摩液及び研摩方法 | |
| TW201542788A (zh) | 硏磨劑組合物及磁碟基板之硏磨法 | |
| JP2013527985A5 (enExample) | ||
| JP2001150334A (ja) | 半導体ウェーハーの研磨方法及び研磨剤 | |
| WO2015118927A1 (ja) | 研磨用砥粒とその製造方法と研磨方法と研磨装置とスラリー | |
| JP2007027663A (ja) | 研磨用組成物 | |
| JP2008503874A5 (enExample) | ||
| JP2017063173A5 (enExample) | ||
| JP6054341B2 (ja) | 研磨用砥粒とその製造方法と研磨方法と研磨部材とスラリー | |
| JPWO2005090511A1 (ja) | 研磨用組成物および研磨方法 | |
| JPH0463428A (ja) | ウエハーのファイン研磨用濃縮組成物 | |
| JP2019163457A5 (enExample) | ||
| JP2007021703A (ja) | 研磨用組成物 | |
| JP2014024156A (ja) | 研磨材、研磨用組成物、硬脆材料の研磨方法及び硬脆材料基板の製造方法 | |
| JP2009539253A5 (enExample) |