CN101511532A - 抛光蓝宝石表面的组合物和方法 - Google Patents

抛光蓝宝石表面的组合物和方法 Download PDF

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Publication number
CN101511532A
CN101511532A CNA2006800070811A CN200680007081A CN101511532A CN 101511532 A CN101511532 A CN 101511532A CN A2006800070811 A CNA2006800070811 A CN A2006800070811A CN 200680007081 A CN200680007081 A CN 200680007081A CN 101511532 A CN101511532 A CN 101511532A
Authority
CN
China
Prior art keywords
sapphire
polishing
salt
acid
slurry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006800070811A
Other languages
English (en)
Chinese (zh)
Inventor
艾萨克·谢里安
穆凯什·德塞
凯文·莫根博格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cabot Corp
Original Assignee
Cabot Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Corp filed Critical Cabot Corp
Publication of CN101511532A publication Critical patent/CN101511532A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0056—Control means for lapping machines or devices taking regard of the pH-value of lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/22—Removing surface-material, e.g. by engraving, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/18, H10D48/04 and H10D48/07, with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
CNA2006800070811A 2005-03-04 2006-03-02 抛光蓝宝石表面的组合物和方法 Pending CN101511532A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US65865305P 2005-03-04 2005-03-04
US60/658,653 2005-03-04

Publications (1)

Publication Number Publication Date
CN101511532A true CN101511532A (zh) 2009-08-19

Family

ID=37215174

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006800070811A Pending CN101511532A (zh) 2005-03-04 2006-03-02 抛光蓝宝石表面的组合物和方法

Country Status (9)

Country Link
US (1) US20060196849A1 (enExample)
EP (1) EP1868953A4 (enExample)
JP (1) JP2008531319A (enExample)
KR (1) KR20070114800A (enExample)
CN (1) CN101511532A (enExample)
CA (1) CA2599401A1 (enExample)
IL (1) IL185418A0 (enExample)
TW (1) TWI287484B (enExample)
WO (1) WO2006115581A2 (enExample)

Cited By (13)

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CN102189485A (zh) * 2010-02-10 2011-09-21 株式会社迪思科 蓝宝石基板的加工方法
CN102873590A (zh) * 2012-10-24 2013-01-16 广州普贺宝石饰品有限公司 黑曜石抛光方法
CN102911606A (zh) * 2012-11-10 2013-02-06 长治虹源科技晶片技术有限公司 一种蓝宝石抛光液及配制方法
CN103184010A (zh) * 2012-04-05 2013-07-03 铜陵市琨鹏光电科技有限公司 一种用于led用蓝宝石衬底片精密抛光的抛光液
CN103753381A (zh) * 2013-11-12 2014-04-30 江苏吉星新材料有限公司 A-面蓝宝石晶片的表面抛光方法
CN104736296A (zh) * 2012-08-24 2015-06-24 埃科莱布美国股份有限公司 抛光蓝宝石表面的方法
CN104974714A (zh) * 2014-04-03 2015-10-14 昭和电工株式会社 研磨组合物和使用该研磨组合物的基板的研磨方法
CN105462504A (zh) * 2015-12-11 2016-04-06 蓝思科技（长沙）有限公司 一种c向蓝宝石抛光液及其制备方法
CN106133107A (zh) * 2014-03-31 2016-11-16 霓达哈斯股份有限公司 研磨用组合物及研磨方法
CN107075345A (zh) * 2014-10-14 2017-08-18 花王株式会社 蓝宝石板用研磨液组合物
US9896604B2 (en) 2013-03-15 2018-02-20 Ecolab Usa Inc. Methods of polishing sapphire surfaces
CN110018028A (zh) * 2019-04-17 2019-07-16 宸鸿科技(厦门)有限公司 一种蓝宝石基材电子组件的金相切片样品制备方法
CN119912878A (zh) * 2025-04-02 2025-05-02 芯越微电子材料(嘉兴)有限公司 一种化学机械抛光液及应用

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KR101715024B1 (ko) * 2006-12-28 2017-03-10 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 사파이어 기판
JP5098483B2 (ja) * 2007-07-25 2012-12-12 住友金属鉱山株式会社 サファイア基板の研磨方法
US9120960B2 (en) 2007-10-05 2015-09-01 Saint-Gobain Ceramics & Plastics, Inc. Composite slurries of nano silicon carbide and alumina
CN101302403B (zh) * 2008-07-03 2011-10-19 大连理工大学 用于大尺寸金刚石晶圆超精密低损伤抛光的抛光液及制备方法
WO2010075091A2 (en) 2008-12-15 2010-07-01 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of use
CN102869478A (zh) * 2010-04-28 2013-01-09 日本百考基株式会社 蓝宝石研磨用浆液和蓝宝石的研磨方法
CN102585705B (zh) * 2011-12-21 2014-02-05 上海新安纳电子科技有限公司 一种用于蓝宝石衬底的化学机械抛光液及其应用
US10052848B2 (en) 2012-03-06 2018-08-21 Apple Inc. Sapphire laminates
CN102775916B (zh) * 2012-07-16 2015-01-07 芜湖海森材料科技有限公司 一种提高蓝宝石表面质量的抛光组合物
US9221289B2 (en) 2012-07-27 2015-12-29 Apple Inc. Sapphire window
US9232672B2 (en) 2013-01-10 2016-01-05 Apple Inc. Ceramic insert control mechanism
JP6436517B2 (ja) * 2013-02-20 2018-12-12 株式会社フジミインコーポレーテッド 研磨用組成物
CN103252708B (zh) * 2013-05-29 2016-01-06 南京航空航天大学 基于固结磨料抛光垫的蓝宝石衬底的超精密加工方法
US9388328B2 (en) 2013-08-23 2016-07-12 Diamond Innovations, Inc. Lapping slurry having a cationic surfactant
US9633831B2 (en) * 2013-08-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same
US9678540B2 (en) 2013-09-23 2017-06-13 Apple Inc. Electronic component embedded in ceramic material
US9632537B2 (en) 2013-09-23 2017-04-25 Apple Inc. Electronic component embedded in ceramic material
US9154678B2 (en) 2013-12-11 2015-10-06 Apple Inc. Cover glass arrangement for an electronic device
US9225056B2 (en) 2014-02-12 2015-12-29 Apple Inc. Antenna on sapphire structure
WO2016033253A1 (en) * 2014-08-27 2016-03-03 Apple Inc. Sapphire cover for electronic devices
KR20170047307A (ko) * 2014-08-29 2017-05-04 캐보트 마이크로일렉트로닉스 코포레이션 사파이어 표면을 연마하기 위한 방법 및 조성물
JP6536176B2 (ja) * 2015-05-27 2019-07-03 日立化成株式会社 サファイア用研磨液、貯蔵液及び研磨方法
US10406634B2 (en) 2015-07-01 2019-09-10 Apple Inc. Enhancing strength in laser cutting of ceramic components
US10112278B2 (en) * 2015-09-25 2018-10-30 Apple Inc. Polishing a ceramic component using a formulated slurry
RU2635132C1 (ru) * 2017-02-20 2017-11-09 Общество с ограниченной ответственностью "Научно-технический центр "Компас" (ООО "НТЦ "Компас") Полировальная суспензия для сапфировых подложек
US10377014B2 (en) 2017-02-28 2019-08-13 Ecolab Usa Inc. Increased wetting of colloidal silica as a polishing slurry
US10775889B1 (en) 2017-07-21 2020-09-15 Apple Inc. Enclosure with locally-flexible regions

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JPS5927316B2 (ja) * 1976-06-11 1984-07-04 日本電信電話株式会社 結晶の無じよう乱鏡面研摩方法
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Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102189485A (zh) * 2010-02-10 2011-09-21 株式会社迪思科 蓝宝石基板的加工方法
CN103184010A (zh) * 2012-04-05 2013-07-03 铜陵市琨鹏光电科技有限公司 一种用于led用蓝宝石衬底片精密抛光的抛光液
CN104736296A (zh) * 2012-08-24 2015-06-24 埃科莱布美国股份有限公司 抛光蓝宝石表面的方法
CN104736296B (zh) * 2012-08-24 2018-08-28 艺康美国股份有限公司 抛光蓝宝石表面的方法
CN102873590A (zh) * 2012-10-24 2013-01-16 广州普贺宝石饰品有限公司 黑曜石抛光方法
CN102873590B (zh) * 2012-10-24 2015-07-15 广州普贺宝石饰品有限公司 黑曜石抛光方法
CN102911606A (zh) * 2012-11-10 2013-02-06 长治虹源科技晶片技术有限公司 一种蓝宝石抛光液及配制方法
US9896604B2 (en) 2013-03-15 2018-02-20 Ecolab Usa Inc. Methods of polishing sapphire surfaces
CN103753381A (zh) * 2013-11-12 2014-04-30 江苏吉星新材料有限公司 A-面蓝宝石晶片的表面抛光方法
CN103753381B (zh) * 2013-11-12 2016-06-22 江苏吉星新材料有限公司 A-面蓝宝石晶片的表面抛光方法
CN106133107A (zh) * 2014-03-31 2016-11-16 霓达哈斯股份有限公司 研磨用组合物及研磨方法
US11791164B2 (en) 2014-03-31 2023-10-17 Nitta Dupont Incorporated Polishing composition and polishing method
CN104974714A (zh) * 2014-04-03 2015-10-14 昭和电工株式会社 研磨组合物和使用该研磨组合物的基板的研磨方法
CN104974714B (zh) * 2014-04-03 2019-03-08 昭和电工株式会社 研磨组合物和使用该研磨组合物的基板的研磨方法
CN107075345A (zh) * 2014-10-14 2017-08-18 花王株式会社 蓝宝石板用研磨液组合物
CN107075345B (zh) * 2014-10-14 2019-03-12 花王株式会社 蓝宝石板用研磨液组合物
CN105462504A (zh) * 2015-12-11 2016-04-06 蓝思科技（长沙）有限公司 一种c向蓝宝石抛光液及其制备方法
CN110018028A (zh) * 2019-04-17 2019-07-16 宸鸿科技(厦门)有限公司 一种蓝宝石基材电子组件的金相切片样品制备方法
CN110018028B (zh) * 2019-04-17 2023-01-13 宸鸿科技(厦门)有限公司 一种蓝宝石基材电子组件的金相切片样品制备方法
CN119912878A (zh) * 2025-04-02 2025-05-02 芯越微电子材料(嘉兴)有限公司 一种化学机械抛光液及应用
CN119912878B (zh) * 2025-04-02 2025-06-10 芯越微电子材料(嘉兴)有限公司 一种化学机械抛光液及应用

Also Published As

Publication number Publication date
JP2008531319A (ja) 2008-08-14
EP1868953A2 (en) 2007-12-26
CA2599401A1 (en) 2006-11-02
IL185418A0 (en) 2008-01-06
TWI287484B (en) 2007-10-01
TW200635704A (en) 2006-10-16
EP1868953A4 (en) 2010-08-25
US20060196849A1 (en) 2006-09-07
KR20070114800A (ko) 2007-12-04
WO2006115581A3 (en) 2009-04-02
WO2006115581A2 (en) 2006-11-02

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Open date: 20090819