JP2008531319A - サファイア表面を研磨するための組成物および方法 - Google Patents

サファイア表面を研磨するための組成物および方法 Download PDF

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Publication number
JP2008531319A
JP2008531319A JP2007558239A JP2007558239A JP2008531319A JP 2008531319 A JP2008531319 A JP 2008531319A JP 2007558239 A JP2007558239 A JP 2007558239A JP 2007558239 A JP2007558239 A JP 2007558239A JP 2008531319 A JP2008531319 A JP 2008531319A
Authority
JP
Japan
Prior art keywords
sapphire
polishing
slurry
acid
salt compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007558239A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008531319A5 (enExample
Inventor
シェリアン，イサック
デサイ，ムケシュ
モゲンボーグ，ケビン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of JP2008531319A publication Critical patent/JP2008531319A/ja
Publication of JP2008531319A5 publication Critical patent/JP2008531319A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0056—Control means for lapping machines or devices taking regard of the pH-value of lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/22—Removing surface-material, e.g. by engraving, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/18, H10D48/04 and H10D48/07, with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2007558239A 2005-03-04 2006-03-02 サファイア表面を研磨するための組成物および方法 Pending JP2008531319A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US65865305P 2005-03-04 2005-03-04
PCT/US2006/007518 WO2006115581A2 (en) 2005-03-04 2006-03-02 Composition and method for polishing a sapphire surface

Publications (2)

Publication Number Publication Date
JP2008531319A true JP2008531319A (ja) 2008-08-14
JP2008531319A5 JP2008531319A5 (enExample) 2009-03-19

Family

ID=37215174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007558239A Pending JP2008531319A (ja) 2005-03-04 2006-03-02 サファイア表面を研磨するための組成物および方法

Country Status (9)

Country Link
US (1) US20060196849A1 (enExample)
EP (1) EP1868953A4 (enExample)
JP (1) JP2008531319A (enExample)
KR (1) KR20070114800A (enExample)
CN (1) CN101511532A (enExample)
CA (1) CA2599401A1 (enExample)
IL (1) IL185418A0 (enExample)
TW (1) TWI287484B (enExample)
WO (1) WO2006115581A2 (enExample)

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CN103252708A (zh) * 2013-05-29 2013-08-21 南京航空航天大学 基于固结磨料抛光垫的蓝宝石衬底的超精密加工方法
KR20150065682A (ko) * 2012-08-24 2015-06-15 에코랍 유에스에이 인코퍼레이티드 사파이어 표면 폴리싱 방법
JP2015196826A (ja) * 2014-04-03 2015-11-09 昭和電工株式会社 研磨組成物、及び該研磨組成物を用いた基板の研磨方法
JP2016520436A (ja) * 2013-03-15 2016-07-14 エコラボ ユーエスエー インコーポレイティド サファイアの表面を研磨する方法
JP2016222762A (ja) * 2015-05-27 2016-12-28 日立化成株式会社 サファイア用研磨液、貯蔵液及び研磨方法
US9879156B2 (en) 2013-02-20 2018-01-30 Fujimi Incorporated Polishing composition

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KR101715024B1 (ko) * 2006-12-28 2017-03-10 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 사파이어 기판
JP5098483B2 (ja) * 2007-07-25 2012-12-12 住友金属鉱山株式会社 サファイア基板の研磨方法
US9120960B2 (en) 2007-10-05 2015-09-01 Saint-Gobain Ceramics & Plastics, Inc. Composite slurries of nano silicon carbide and alumina
CN101302403B (zh) * 2008-07-03 2011-10-19 大连理工大学 用于大尺寸金刚石晶圆超精密低损伤抛光的抛光液及制备方法
WO2010075091A2 (en) 2008-12-15 2010-07-01 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of use
JP5443192B2 (ja) * 2010-02-10 2014-03-19 株式会社ディスコ サファイア基板の加工方法
CN102869478A (zh) * 2010-04-28 2013-01-09 日本百考基株式会社 蓝宝石研磨用浆液和蓝宝石的研磨方法
CN102585705B (zh) * 2011-12-21 2014-02-05 上海新安纳电子科技有限公司 一种用于蓝宝石衬底的化学机械抛光液及其应用
US10052848B2 (en) 2012-03-06 2018-08-21 Apple Inc. Sapphire laminates
CN103184010A (zh) * 2012-04-05 2013-07-03 铜陵市琨鹏光电科技有限公司 一种用于led用蓝宝石衬底片精密抛光的抛光液
CN102775916B (zh) * 2012-07-16 2015-01-07 芜湖海森材料科技有限公司 一种提高蓝宝石表面质量的抛光组合物
US9221289B2 (en) 2012-07-27 2015-12-29 Apple Inc. Sapphire window
CN102873590B (zh) * 2012-10-24 2015-07-15 广州普贺宝石饰品有限公司 黑曜石抛光方法
CN102911606A (zh) * 2012-11-10 2013-02-06 长治虹源科技晶片技术有限公司 一种蓝宝石抛光液及配制方法
US9232672B2 (en) 2013-01-10 2016-01-05 Apple Inc. Ceramic insert control mechanism
US9388328B2 (en) 2013-08-23 2016-07-12 Diamond Innovations, Inc. Lapping slurry having a cationic surfactant
US9633831B2 (en) * 2013-08-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same
US9678540B2 (en) 2013-09-23 2017-06-13 Apple Inc. Electronic component embedded in ceramic material
US9632537B2 (en) 2013-09-23 2017-04-25 Apple Inc. Electronic component embedded in ceramic material
CN103753381B (zh) * 2013-11-12 2016-06-22 江苏吉星新材料有限公司 A-面蓝宝石晶片的表面抛光方法
US9154678B2 (en) 2013-12-11 2015-10-06 Apple Inc. Cover glass arrangement for an electronic device
US9225056B2 (en) 2014-02-12 2015-12-29 Apple Inc. Antenna on sapphire structure
JP6506913B2 (ja) * 2014-03-31 2019-04-24 ニッタ・ハース株式会社 研磨用組成物及び研磨方法
WO2016033253A1 (en) * 2014-08-27 2016-03-03 Apple Inc. Sapphire cover for electronic devices
KR20170047307A (ko) * 2014-08-29 2017-05-04 캐보트 마이크로일렉트로닉스 코포레이션 사파이어 표면을 연마하기 위한 방법 및 조성물
JP5940754B1 (ja) * 2014-10-14 2016-06-29 花王株式会社 サファイア板用研磨液組成物
US10406634B2 (en) 2015-07-01 2019-09-10 Apple Inc. Enhancing strength in laser cutting of ceramic components
US10112278B2 (en) * 2015-09-25 2018-10-30 Apple Inc. Polishing a ceramic component using a formulated slurry
CN105462504A (zh) * 2015-12-11 2016-04-06 蓝思科技（长沙）有限公司 一种c向蓝宝石抛光液及其制备方法
RU2635132C1 (ru) * 2017-02-20 2017-11-09 Общество с ограниченной ответственностью "Научно-технический центр "Компас" (ООО "НТЦ "Компас") Полировальная суспензия для сапфировых подложек
US10377014B2 (en) 2017-02-28 2019-08-13 Ecolab Usa Inc. Increased wetting of colloidal silica as a polishing slurry
US10775889B1 (en) 2017-07-21 2020-09-15 Apple Inc. Enclosure with locally-flexible regions
CN110018028B (zh) * 2019-04-17 2023-01-13 宸鸿科技(厦门)有限公司 一种蓝宝石基材电子组件的金相切片样品制备方法
CN119912878B (zh) * 2025-04-02 2025-06-10 芯越微电子材料(嘉兴)有限公司 一种化学机械抛光液及应用

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JPS52150789A (en) * 1976-06-11 1977-12-14 Nippon Telegr & Teleph Corp <Ntt> Undisturred mirror surface polishing method of crystal
JPH05156238A (ja) * 1990-10-09 1993-06-22 Buehler Ltd メカノケミカル研摩用研摩剤、および材料片を研摩する方法

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JPH05156238A (ja) * 1990-10-09 1993-06-22 Buehler Ltd メカノケミカル研摩用研摩剤、および材料片を研摩する方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150065682A (ko) * 2012-08-24 2015-06-15 에코랍 유에스에이 인코퍼레이티드 사파이어 표면 폴리싱 방법
JP2015533868A (ja) * 2012-08-24 2015-11-26 エコラブ ユーエスエイ インク サファイア表面を研磨する方法
KR102105844B1 (ko) 2012-08-24 2020-04-29 에코랍 유에스에이 인코퍼레이티드 사파이어 표면 폴리싱 방법
US9879156B2 (en) 2013-02-20 2018-01-30 Fujimi Incorporated Polishing composition
JP2016520436A (ja) * 2013-03-15 2016-07-14 エコラボ ユーエスエー インコーポレイティド サファイアの表面を研磨する方法
US9896604B2 (en) 2013-03-15 2018-02-20 Ecolab Usa Inc. Methods of polishing sapphire surfaces
CN103252708A (zh) * 2013-05-29 2013-08-21 南京航空航天大学 基于固结磨料抛光垫的蓝宝石衬底的超精密加工方法
JP2015196826A (ja) * 2014-04-03 2015-11-09 昭和電工株式会社 研磨組成物、及び該研磨組成物を用いた基板の研磨方法
JP2016222762A (ja) * 2015-05-27 2016-12-28 日立化成株式会社 サファイア用研磨液、貯蔵液及び研磨方法

Also Published As

Publication number Publication date
CN101511532A (zh) 2009-08-19
EP1868953A2 (en) 2007-12-26
CA2599401A1 (en) 2006-11-02
IL185418A0 (en) 2008-01-06
TWI287484B (en) 2007-10-01
TW200635704A (en) 2006-10-16
EP1868953A4 (en) 2010-08-25
US20060196849A1 (en) 2006-09-07
KR20070114800A (ko) 2007-12-04
WO2006115581A3 (en) 2009-04-02
WO2006115581A2 (en) 2006-11-02

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