JP2008528390A - コンポーネントキャリヤおよび製造方法 - Google Patents
コンポーネントキャリヤおよび製造方法 Download PDFInfo
- Publication number
- JP2008528390A JP2008528390A JP2007552163A JP2007552163A JP2008528390A JP 2008528390 A JP2008528390 A JP 2008528390A JP 2007552163 A JP2007552163 A JP 2007552163A JP 2007552163 A JP2007552163 A JP 2007552163A JP 2008528390 A JP2008528390 A JP 2008528390A
- Authority
- JP
- Japan
- Prior art keywords
- carrier tape
- pockets
- tool
- strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 229920000642 polymer Polymers 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims description 29
- 238000003860 storage Methods 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 23
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 238000001816 cooling Methods 0.000 description 6
- -1 polyethylene terephthalate Polymers 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 238000010128 melt processing Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 238000007666 vacuum forming Methods 0.000 description 3
- 229920002943 EPDM rubber Polymers 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000010076 replication Effects 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical class C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920008790 Amorphous Polyethylene terephthalate Polymers 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000012050 conventional carrier Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
- B65H35/04—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators
- B65H35/06—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators from or with blade, e.g. shear-blade, cutters or perforators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Packages (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Packaging Frangible Articles (AREA)
- Winding Of Webs (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
- Containers And Plastic Fillers For Packaging (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/039,039 US20060157381A1 (en) | 2005-01-20 | 2005-01-20 | Component carrier and method for making |
| PCT/US2006/000676 WO2006078493A2 (en) | 2005-01-20 | 2006-01-09 | Component carrier and method for making |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008528390A true JP2008528390A (ja) | 2008-07-31 |
| JP2008528390A5 JP2008528390A5 (enExample) | 2009-03-05 |
Family
ID=36498811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007552163A Pending JP2008528390A (ja) | 2005-01-20 | 2006-01-09 | コンポーネントキャリヤおよび製造方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20060157381A1 (enExample) |
| EP (1) | EP1839471A2 (enExample) |
| JP (1) | JP2008528390A (enExample) |
| KR (1) | KR101236687B1 (enExample) |
| CN (1) | CN101107897A (enExample) |
| MX (1) | MX2007008539A (enExample) |
| PH (1) | PH12012502049A1 (enExample) |
| TW (1) | TW200631765A (enExample) |
| WO (1) | WO2006078493A2 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012106475A (ja) * | 2010-10-19 | 2012-06-07 | Idemitsu Unitech Co Ltd | エンボステープの製造方法、エンボステープの製造装置、およびエンボステープ |
| WO2013146593A1 (ja) * | 2012-03-27 | 2013-10-03 | 住友ベークライト株式会社 | 電子部品収納用キャリアテープ、電子部品収納用キャリアテープの製造方法、および包装体 |
| WO2014034536A1 (ja) * | 2012-08-31 | 2014-03-06 | 住友ベークライト株式会社 | 電子部品収納用キャリアテープの製造方法 |
| WO2014034537A1 (ja) * | 2012-08-31 | 2014-03-06 | 住友ベークライト株式会社 | キャリアテープ製造装置 |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007075662A1 (en) * | 2005-12-20 | 2007-07-05 | 3M Innovative Properties Company | Component carrier tape |
| JP2007182910A (ja) * | 2005-12-29 | 2007-07-19 | Brother Ind Ltd | プーリホルダ |
| JP2007181934A (ja) * | 2005-12-29 | 2007-07-19 | Brother Ind Ltd | プーリホルダ支持構造、プーリホルダ |
| CN101544294A (zh) * | 2008-03-27 | 2009-09-30 | 3M创新有限公司 | 电子器件封装装置、电子器件封装方法及其封装设备 |
| US8205766B2 (en) * | 2009-05-20 | 2012-06-26 | The Bergquist Company | Method for packaging thermal interface materials |
| US8430264B2 (en) * | 2009-05-20 | 2013-04-30 | The Bergquist Company | Method for packaging thermal interface materials |
| USD695635S1 (en) * | 2010-08-06 | 2013-12-17 | Murata Manufacturing Co., Ltd. | Carrier tape |
| DE102012012562A1 (de) * | 2011-06-30 | 2013-01-03 | Asmo Co., Ltd. | Werkstückzufuhrvorrichtung und werkstückzufuhrverfahren |
| US20150083641A1 (en) * | 2013-09-25 | 2015-03-26 | Texas Instruments Incorporated | Selective heat seal wafer cover tape (has tape) |
| JP2015110441A (ja) * | 2013-10-31 | 2015-06-18 | 株式会社村田製作所 | 電子部品の包装体、電子部品連およびキャリアテープ |
| WO2016197342A1 (en) * | 2015-06-10 | 2016-12-15 | 3M Innovative Properties Company | Component carrier tape and manufacturing method thereof |
| US9698040B2 (en) * | 2015-10-29 | 2017-07-04 | Stmicroelectronics (Malta) Ltd | Semiconductor device carrier tape with image sensor detectable dimples |
| JP2019094078A (ja) * | 2017-11-20 | 2019-06-20 | 信越ポリマー株式会社 | キャリアテープ及びキャリアテープの成形方法 |
| US11452249B2 (en) * | 2017-12-11 | 2022-09-20 | Delphon Industries, Llc | Carrier for reversibly immobilizing one or more objects |
| TW202222656A (zh) * | 2020-12-01 | 2022-06-16 | 美商美光科技公司 | 用於微電子裝置的承載帶及相關方法 |
| US20240351315A1 (en) * | 2023-04-20 | 2024-10-24 | Honeywell International Inc. | Moisture barrier carrier tape and lid for electronic parts |
| CN118977403B (zh) * | 2024-10-21 | 2024-12-20 | 新创源云海(成都)科技有限公司 | 一种高效连续生产载带短节的生产装置及方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11151749A (ja) * | 1997-11-21 | 1999-06-08 | Shin Etsu Polymer Co Ltd | キャリアテープの製造方法 |
| JP2004137080A (ja) * | 2002-09-26 | 2004-05-13 | Shin Etsu Polymer Co Ltd | キャリアテープの巻き取り方法 |
| JP2004189250A (ja) * | 2002-12-09 | 2004-07-08 | Japan Wavelock Co Ltd | エンボスキャリアテープの製造方法、及び、エンボスキャリアテープ製造装置 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3399101A (en) * | 1964-08-11 | 1968-08-27 | Eugene A. Magid | Valley printing effects and method of producing same |
| US3932248A (en) * | 1973-09-28 | 1976-01-13 | Keaton Clyde D | Method and apparatus for making laminated board with a pocketed core |
| US4110152A (en) * | 1975-06-20 | 1978-08-29 | Avery International Corporation | Embossing roller and method |
| GB2040569B (en) * | 1978-12-26 | 1983-09-01 | Murata Manufacturing Co | Chip-like electronic component series and method for supplying chip-like electronic components |
| US4736841A (en) * | 1985-02-20 | 1988-04-12 | Murata Manufacturing Co., Ltd. | Electronic component series |
| NL8503063A (nl) * | 1985-11-08 | 1987-06-01 | Philips Nv | Bandverpakking voor elektrische en/of elektronische onderdelen. |
| JPS62158673A (ja) * | 1985-12-28 | 1987-07-14 | 株式会社村田製作所 | テ−ピング電子部品連 |
| US5125508A (en) * | 1989-07-06 | 1992-06-30 | Murata Manufacturing Co., Ltd. | Tape-form electronic component package |
| US5123984A (en) * | 1990-08-17 | 1992-06-23 | T-Systems International, Inc. | Method and apparatus for forming ports in drip irrigation hose |
| US5269983A (en) * | 1991-02-04 | 1993-12-14 | James River Corporation Of Virginia | Rubber-to-steel mated embossing |
| JPH07101461A (ja) * | 1993-09-30 | 1995-04-18 | Yayoi Kk | エンボスキャリアテープ |
| US5472085A (en) * | 1994-05-16 | 1995-12-05 | Gpax International, Inc. | Gated-pocket tape-form packaging system |
| US5526935A (en) * | 1995-02-15 | 1996-06-18 | Minnesota Mining And Manufacturing Company | Component carrier tape |
| US5800772A (en) * | 1995-03-22 | 1998-09-01 | Yayoi Corporation | Method for producing embossed carrier tape system |
| US5765692A (en) * | 1995-11-13 | 1998-06-16 | Minnesota Mining And Manufacturing Company | Carrier tape with adhesive and protective walls |
| US5665456A (en) * | 1995-12-06 | 1997-09-09 | Sealed Air Corporation | Heat-shrinkable flexible cushioning material and method of forming the same |
| US6016917A (en) * | 1997-04-24 | 2000-01-25 | Peak International, Inc. | Component carrier having a pocket including a pedestal |
| US6375871B1 (en) * | 1998-06-18 | 2002-04-23 | 3M Innovative Properties Company | Methods of manufacturing microfluidic articles |
| IL129606A (en) * | 1997-09-10 | 2003-05-29 | Yayoi Corp | Tape-shaped parts package, parts storing tape, tape-shaped cover and parts packaging apparatus |
| US6003676A (en) * | 1997-12-05 | 1999-12-21 | Tek Pak, Inc. | Product carrier and method of making same |
| DE69913122T2 (de) * | 1998-03-02 | 2004-05-27 | Fabio Perini S.P.A. | Verfahren und gerät zur herstellung von geprägtem bahnmaterial und auf diese weise hergestelltes produkt |
| JP2001180784A (ja) * | 1999-10-28 | 2001-07-03 | Texas Instr Inc <Ti> | 可撓性担体テープ装置 |
| WO2003092970A1 (de) * | 2002-05-02 | 2003-11-13 | Bos Berlin Oberspree Sondermaschinenbau Gmbh | Perforationsvorrichtung |
| US20040014887A1 (en) * | 2002-05-14 | 2004-01-22 | Lee Coreen Y. | Polycarbonate and acrylonitrile-butadiene-styrene polymeric blends with improved impact resistance |
| US20030216508A1 (en) * | 2002-05-14 | 2003-11-20 | Lee Coreen Y. | Polycarbonate and acrylonitrile-butadiene-styrene polymeric blends with improved impact resistance |
| US7718133B2 (en) * | 2003-10-09 | 2010-05-18 | 3M Innovative Properties Company | Multilayer processing devices and methods |
-
2005
- 2005-01-20 US US11/039,039 patent/US20060157381A1/en not_active Abandoned
-
2006
- 2006-01-09 WO PCT/US2006/000676 patent/WO2006078493A2/en not_active Ceased
- 2006-01-09 KR KR1020077016477A patent/KR101236687B1/ko not_active Expired - Fee Related
- 2006-01-09 CN CNA2006800027633A patent/CN101107897A/zh active Pending
- 2006-01-09 EP EP06717830A patent/EP1839471A2/en not_active Withdrawn
- 2006-01-09 JP JP2007552163A patent/JP2008528390A/ja active Pending
- 2006-01-09 MX MX2007008539A patent/MX2007008539A/es unknown
- 2006-01-19 TW TW095102066A patent/TW200631765A/zh unknown
- 2006-04-09 PH PH1/2012/502049A patent/PH12012502049A1/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11151749A (ja) * | 1997-11-21 | 1999-06-08 | Shin Etsu Polymer Co Ltd | キャリアテープの製造方法 |
| JP2004137080A (ja) * | 2002-09-26 | 2004-05-13 | Shin Etsu Polymer Co Ltd | キャリアテープの巻き取り方法 |
| JP2004189250A (ja) * | 2002-12-09 | 2004-07-08 | Japan Wavelock Co Ltd | エンボスキャリアテープの製造方法、及び、エンボスキャリアテープ製造装置 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012106475A (ja) * | 2010-10-19 | 2012-06-07 | Idemitsu Unitech Co Ltd | エンボステープの製造方法、エンボステープの製造装置、およびエンボステープ |
| WO2013146593A1 (ja) * | 2012-03-27 | 2013-10-03 | 住友ベークライト株式会社 | 電子部品収納用キャリアテープ、電子部品収納用キャリアテープの製造方法、および包装体 |
| WO2014034536A1 (ja) * | 2012-08-31 | 2014-03-06 | 住友ベークライト株式会社 | 電子部品収納用キャリアテープの製造方法 |
| WO2014034537A1 (ja) * | 2012-08-31 | 2014-03-06 | 住友ベークライト株式会社 | キャリアテープ製造装置 |
| JP2014061945A (ja) * | 2012-08-31 | 2014-04-10 | Sumitomo Bakelite Co Ltd | キャリアテープ製造装置およびキャリアテープ作製用シート製造装置 |
| JP2014061944A (ja) * | 2012-08-31 | 2014-04-10 | Sumitomo Bakelite Co Ltd | 電子部品収納用キャリアテープの製造方法およびキャリアテープ作製用シートの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| PH12012502049A1 (en) | 2013-05-20 |
| KR20070095955A (ko) | 2007-10-01 |
| MX2007008539A (es) | 2008-01-14 |
| CN101107897A (zh) | 2008-01-16 |
| KR101236687B1 (ko) | 2013-02-22 |
| TW200631765A (en) | 2006-09-16 |
| US20060157381A1 (en) | 2006-07-20 |
| WO2006078493A3 (en) | 2006-11-23 |
| EP1839471A2 (en) | 2007-10-03 |
| WO2006078493A2 (en) | 2006-07-27 |
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