MX2007008539A - Transportador de componentes y metodo para fabricarlo. - Google Patents

Transportador de componentes y metodo para fabricarlo.

Info

Publication number
MX2007008539A
MX2007008539A MX2007008539A MX2007008539A MX2007008539A MX 2007008539 A MX2007008539 A MX 2007008539A MX 2007008539 A MX2007008539 A MX 2007008539A MX 2007008539 A MX2007008539 A MX 2007008539A MX 2007008539 A MX2007008539 A MX 2007008539A
Authority
MX
Mexico
Prior art keywords
tool
pockets
circumferential surface
longitudinal strip
thickness
Prior art date
Application number
MX2007008539A
Other languages
English (en)
Inventor
Nelson D Sewall
William J Bryan
David F Slama
James T Adams
Daniel F Cronch
Jose P De Souza
Bryan C Feisel
Carsten Franke
Brent R Hansen
Mitchell T Huang
Joseph E Weiler
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of MX2007008539A publication Critical patent/MX2007008539A/es

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/04Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators
    • B65H35/06Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators from or with blade, e.g. shear-blade, cutters or perforators
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084Containers and magazines for components, e.g. tube-like magazines
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Winding Of Webs (AREA)
  • Containers And Plastic Fillers For Packaging (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)

Abstract

Se describe una cinta transportadora que incluye una tira longitudinal que tiene una pluralidad de cavidades receptoras de componentes posicionadas en la misma. La profundidad de cavidad es mayor que un espesor de la tira longitudinal. Las cavidades adyacentes esta separadas por una distancia menor de aproximadamente cinco veces el espesor de la tira longitudinal. Las paredes laterales que separan las cavidades adyacentes tienen una altura mayor que la profundidad de cavidad menos una altura de un componente para el cual las cavidades estan configuradas para recibir. La cinta transportadora es producida al proporcionar una herramienta rotatoria y un rodillo de laminado que cuenta con una superficie circunferencial exterior conformable opuesta a la herramienta. La superficie circunferencial exterior de la herramienta incluye proyecciones para formar las cavidades. Una membrana de polimero es introducida dentro de la linea de prensado entre la herramienta y el rodillo de laminado, y gofrada con las proyecciones obre la superficie circunferencial de la herramienta.
MX2007008539A 2005-01-20 2006-01-09 Transportador de componentes y metodo para fabricarlo. MX2007008539A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/039,039 US20060157381A1 (en) 2005-01-20 2005-01-20 Component carrier and method for making
PCT/US2006/000676 WO2006078493A2 (en) 2005-01-20 2006-01-09 Component carrier and method for making

Publications (1)

Publication Number Publication Date
MX2007008539A true MX2007008539A (es) 2008-01-14

Family

ID=36498811

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2007008539A MX2007008539A (es) 2005-01-20 2006-01-09 Transportador de componentes y metodo para fabricarlo.

Country Status (8)

Country Link
US (1) US20060157381A1 (es)
EP (1) EP1839471A2 (es)
JP (1) JP2008528390A (es)
KR (1) KR101236687B1 (es)
CN (1) CN101107897A (es)
MX (1) MX2007008539A (es)
TW (1) TW200631765A (es)
WO (1) WO2006078493A2 (es)

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CN101346287A (zh) * 2005-12-20 2009-01-14 3M创新有限公司 元件载带
JP2007181934A (ja) * 2005-12-29 2007-07-19 Brother Ind Ltd プーリホルダ支持構造、プーリホルダ
JP2007182910A (ja) * 2005-12-29 2007-07-19 Brother Ind Ltd プーリホルダ
CN101544294A (zh) * 2008-03-27 2009-09-30 3M创新有限公司 电子器件封装装置、电子器件封装方法及其封装设备
US8430264B2 (en) * 2009-05-20 2013-04-30 The Bergquist Company Method for packaging thermal interface materials
US8205766B2 (en) * 2009-05-20 2012-06-26 The Bergquist Company Method for packaging thermal interface materials
JP2012106475A (ja) * 2010-10-19 2012-06-07 Idemitsu Unitech Co Ltd エンボステープの製造方法、エンボステープの製造装置、およびエンボステープ
KR20130004105A (ko) * 2011-06-30 2013-01-09 아스모 가부시키가이샤 워크 공급 장치 및 워크 공급 방법
JP6114514B2 (ja) * 2012-03-27 2017-04-12 信越ポリマー株式会社 電子部品収納用キャリアテープ、電子部品収納用キャリアテープの製造方法、および包装体
JP6257933B2 (ja) * 2012-08-31 2018-01-10 信越ポリマー株式会社 電子部品収納用キャリアテープの製造方法およびキャリアテープ作製用シートの製造方法
JP6257934B2 (ja) * 2012-08-31 2018-01-10 信越ポリマー株式会社 キャリアテープ製造装置およびキャリアテープ作製用シート製造装置
US20150083641A1 (en) * 2013-09-25 2015-03-26 Texas Instruments Incorporated Selective heat seal wafer cover tape (has tape)
JP2015110441A (ja) * 2013-10-31 2015-06-18 株式会社村田製作所 電子部品の包装体、電子部品連およびキャリアテープ
WO2016197342A1 (en) * 2015-06-10 2016-12-15 3M Innovative Properties Company Component carrier tape and manufacturing method thereof
US9698040B2 (en) * 2015-10-29 2017-07-04 Stmicroelectronics (Malta) Ltd Semiconductor device carrier tape with image sensor detectable dimples
JP2019094078A (ja) * 2017-11-20 2019-06-20 信越ポリマー株式会社 キャリアテープ及びキャリアテープの成形方法
US11452249B2 (en) * 2017-12-11 2022-09-20 Delphon Industries, Llc Carrier for reversibly immobilizing one or more objects

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US3399101A (en) * 1964-08-11 1968-08-27 Eugene A. Magid Valley printing effects and method of producing same
US3932248A (en) * 1973-09-28 1976-01-13 Keaton Clyde D Method and apparatus for making laminated board with a pocketed core
US4110152A (en) * 1975-06-20 1978-08-29 Avery International Corporation Embossing roller and method
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NL8503063A (nl) * 1985-11-08 1987-06-01 Philips Nv Bandverpakking voor elektrische en/of elektronische onderdelen.
JPS62158673A (ja) * 1985-12-28 1987-07-14 株式会社村田製作所 テ−ピング電子部品連
US5125508A (en) * 1989-07-06 1992-06-30 Murata Manufacturing Co., Ltd. Tape-form electronic component package
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US5765692A (en) * 1995-11-13 1998-06-16 Minnesota Mining And Manufacturing Company Carrier tape with adhesive and protective walls
US5665456A (en) * 1995-12-06 1997-09-09 Sealed Air Corporation Heat-shrinkable flexible cushioning material and method of forming the same
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US6375871B1 (en) * 1998-06-18 2002-04-23 3M Innovative Properties Company Methods of manufacturing microfluidic articles
CN1521094A (zh) * 1997-09-10 2004-08-18 ������������ʽ���� 物品储存带
JP3388698B2 (ja) * 1997-11-21 2003-03-24 信越ポリマー株式会社 キャリアテープの製造方法
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WO1999044814A1 (en) * 1998-03-02 1999-09-10 Fabio Perini S.P.A. Method and device for producing an embossed web material and product made in this way
JP2001180784A (ja) * 1999-10-28 2001-07-03 Texas Instr Inc <Ti> 可撓性担体テープ装置
AU2003232238A1 (en) * 2002-05-02 2003-11-17 Bos Berlin Oberspree Sondermaschinenbau Gmbh Forming device for the production of a component-supporting tape for electronic parts
US20030216508A1 (en) * 2002-05-14 2003-11-20 Lee Coreen Y. Polycarbonate and acrylonitrile-butadiene-styrene polymeric blends with improved impact resistance
US20040014887A1 (en) * 2002-05-14 2004-01-22 Lee Coreen Y. Polycarbonate and acrylonitrile-butadiene-styrene polymeric blends with improved impact resistance
JP2004137080A (ja) * 2002-09-26 2004-05-13 Shin Etsu Polymer Co Ltd キャリアテープの巻き取り方法
JP4170086B2 (ja) * 2002-12-09 2008-10-22 日本ウェーブロック株式会社 エンボスキャリアテープの製造方法、及び、エンボスキャリアテープ製造装置
US7718133B2 (en) * 2003-10-09 2010-05-18 3M Innovative Properties Company Multilayer processing devices and methods

Also Published As

Publication number Publication date
WO2006078493A3 (en) 2006-11-23
CN101107897A (zh) 2008-01-16
EP1839471A2 (en) 2007-10-03
KR101236687B1 (ko) 2013-02-22
KR20070095955A (ko) 2007-10-01
WO2006078493A2 (en) 2006-07-27
TW200631765A (en) 2006-09-16
JP2008528390A (ja) 2008-07-31
US20060157381A1 (en) 2006-07-20

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