TW200631765A - Component carrier and method for making - Google Patents
Component carrier and method for makingInfo
- Publication number
- TW200631765A TW200631765A TW095102066A TW95102066A TW200631765A TW 200631765 A TW200631765 A TW 200631765A TW 095102066 A TW095102066 A TW 095102066A TW 95102066 A TW95102066 A TW 95102066A TW 200631765 A TW200631765 A TW 200631765A
- Authority
- TW
- Taiwan
- Prior art keywords
- tool
- pockets
- circumferential surface
- longitudinal strip
- thickness
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
- B65H35/04—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators
- B65H35/06—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators from or with blade, e.g. shear-blade, cutters or perforators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Winding Of Webs (AREA)
- Containers And Plastic Fillers For Packaging (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/039,039 US20060157381A1 (en) | 2005-01-20 | 2005-01-20 | Component carrier and method for making |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200631765A true TW200631765A (en) | 2006-09-16 |
Family
ID=36498811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095102066A TW200631765A (en) | 2005-01-20 | 2006-01-19 | Component carrier and method for making |
Country Status (8)
Country | Link |
---|---|
US (1) | US20060157381A1 (es) |
EP (1) | EP1839471A2 (es) |
JP (1) | JP2008528390A (es) |
KR (1) | KR101236687B1 (es) |
CN (1) | CN101107897A (es) |
MX (1) | MX2007008539A (es) |
TW (1) | TW200631765A (es) |
WO (1) | WO2006078493A2 (es) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080296201A1 (en) * | 2005-12-20 | 2008-12-04 | Lahoussaine Lalouch | Component Carrier Tape |
JP2007182910A (ja) * | 2005-12-29 | 2007-07-19 | Brother Ind Ltd | プーリホルダ |
JP2007181934A (ja) * | 2005-12-29 | 2007-07-19 | Brother Ind Ltd | プーリホルダ支持構造、プーリホルダ |
CN101544294A (zh) * | 2008-03-27 | 2009-09-30 | 3M创新有限公司 | 电子器件封装装置、电子器件封装方法及其封装设备 |
US8205766B2 (en) * | 2009-05-20 | 2012-06-26 | The Bergquist Company | Method for packaging thermal interface materials |
US8430264B2 (en) * | 2009-05-20 | 2013-04-30 | The Bergquist Company | Method for packaging thermal interface materials |
JP2012106475A (ja) * | 2010-10-19 | 2012-06-07 | Idemitsu Unitech Co Ltd | エンボステープの製造方法、エンボステープの製造装置、およびエンボステープ |
DE102012012562A1 (de) * | 2011-06-30 | 2013-01-03 | Asmo Co., Ltd. | Werkstückzufuhrvorrichtung und werkstückzufuhrverfahren |
JP6114514B2 (ja) * | 2012-03-27 | 2017-04-12 | 信越ポリマー株式会社 | 電子部品収納用キャリアテープ、電子部品収納用キャリアテープの製造方法、および包装体 |
JP6257933B2 (ja) * | 2012-08-31 | 2018-01-10 | 信越ポリマー株式会社 | 電子部品収納用キャリアテープの製造方法およびキャリアテープ作製用シートの製造方法 |
JP6257934B2 (ja) * | 2012-08-31 | 2018-01-10 | 信越ポリマー株式会社 | キャリアテープ製造装置およびキャリアテープ作製用シート製造装置 |
US20150083641A1 (en) * | 2013-09-25 | 2015-03-26 | Texas Instruments Incorporated | Selective heat seal wafer cover tape (has tape) |
JP2015110441A (ja) * | 2013-10-31 | 2015-06-18 | 株式会社村田製作所 | 電子部品の包装体、電子部品連およびキャリアテープ |
WO2016197342A1 (en) * | 2015-06-10 | 2016-12-15 | 3M Innovative Properties Company | Component carrier tape and manufacturing method thereof |
US9698040B2 (en) * | 2015-10-29 | 2017-07-04 | Stmicroelectronics (Malta) Ltd | Semiconductor device carrier tape with image sensor detectable dimples |
JP2019094078A (ja) * | 2017-11-20 | 2019-06-20 | 信越ポリマー株式会社 | キャリアテープ及びキャリアテープの成形方法 |
WO2019118244A1 (en) * | 2017-12-11 | 2019-06-20 | Delphon Industries, Llc | Carrier for reversibly immobilizing one or more objects |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3399101A (en) * | 1964-08-11 | 1968-08-27 | Eugene A. Magid | Valley printing effects and method of producing same |
US3932248A (en) * | 1973-09-28 | 1976-01-13 | Keaton Clyde D | Method and apparatus for making laminated board with a pocketed core |
US4110152A (en) * | 1975-06-20 | 1978-08-29 | Avery International Corporation | Embossing roller and method |
GB2040569B (en) * | 1978-12-26 | 1983-09-01 | Murata Manufacturing Co | Chip-like electronic component series and method for supplying chip-like electronic components |
US4736841A (en) * | 1985-02-20 | 1988-04-12 | Murata Manufacturing Co., Ltd. | Electronic component series |
NL8503063A (nl) * | 1985-11-08 | 1987-06-01 | Philips Nv | Bandverpakking voor elektrische en/of elektronische onderdelen. |
JPS62158673A (ja) * | 1985-12-28 | 1987-07-14 | 株式会社村田製作所 | テ−ピング電子部品連 |
US5125508A (en) * | 1989-07-06 | 1992-06-30 | Murata Manufacturing Co., Ltd. | Tape-form electronic component package |
US5123984A (en) * | 1990-08-17 | 1992-06-23 | T-Systems International, Inc. | Method and apparatus for forming ports in drip irrigation hose |
US5269983A (en) * | 1991-02-04 | 1993-12-14 | James River Corporation Of Virginia | Rubber-to-steel mated embossing |
JPH07101461A (ja) * | 1993-09-30 | 1995-04-18 | Yayoi Kk | エンボスキャリアテープ |
US5472085A (en) * | 1994-05-16 | 1995-12-05 | Gpax International, Inc. | Gated-pocket tape-form packaging system |
US5526935A (en) * | 1995-02-15 | 1996-06-18 | Minnesota Mining And Manufacturing Company | Component carrier tape |
US5800772A (en) * | 1995-03-22 | 1998-09-01 | Yayoi Corporation | Method for producing embossed carrier tape system |
US5765692A (en) * | 1995-11-13 | 1998-06-16 | Minnesota Mining And Manufacturing Company | Carrier tape with adhesive and protective walls |
US5665456A (en) * | 1995-12-06 | 1997-09-09 | Sealed Air Corporation | Heat-shrinkable flexible cushioning material and method of forming the same |
US6016917A (en) * | 1997-04-24 | 2000-01-25 | Peak International, Inc. | Component carrier having a pocket including a pedestal |
US6375871B1 (en) * | 1998-06-18 | 2002-04-23 | 3M Innovative Properties Company | Methods of manufacturing microfluidic articles |
WO1999012827A1 (fr) * | 1997-09-10 | 1999-03-18 | Yayoi Corporation | Emballage de pieces de type bande, bande de logement de pieces, element de recouvrement de type bande et appareil d'emballage de pieces |
JP3388698B2 (ja) * | 1997-11-21 | 2003-03-24 | 信越ポリマー株式会社 | キャリアテープの製造方法 |
US6003676A (en) * | 1997-12-05 | 1999-12-21 | Tek Pak, Inc. | Product carrier and method of making same |
ES2211136T3 (es) * | 1998-03-02 | 2004-07-01 | Fabio Perini S.P.A. | Procedimiento y dispositivo para la fabricacion de un material en banda gofrado y producto asi obtenido. |
JP2001180784A (ja) * | 1999-10-28 | 2001-07-03 | Texas Instr Inc <Ti> | 可撓性担体テープ装置 |
WO2003092970A1 (de) * | 2002-05-02 | 2003-11-13 | Bos Berlin Oberspree Sondermaschinenbau Gmbh | Perforationsvorrichtung |
US20030216508A1 (en) * | 2002-05-14 | 2003-11-20 | Lee Coreen Y. | Polycarbonate and acrylonitrile-butadiene-styrene polymeric blends with improved impact resistance |
US20040014887A1 (en) * | 2002-05-14 | 2004-01-22 | Lee Coreen Y. | Polycarbonate and acrylonitrile-butadiene-styrene polymeric blends with improved impact resistance |
JP2004137080A (ja) * | 2002-09-26 | 2004-05-13 | Shin Etsu Polymer Co Ltd | キャリアテープの巻き取り方法 |
JP4170086B2 (ja) * | 2002-12-09 | 2008-10-22 | 日本ウェーブロック株式会社 | エンボスキャリアテープの製造方法、及び、エンボスキャリアテープ製造装置 |
US7718133B2 (en) * | 2003-10-09 | 2010-05-18 | 3M Innovative Properties Company | Multilayer processing devices and methods |
-
2005
- 2005-01-20 US US11/039,039 patent/US20060157381A1/en not_active Abandoned
-
2006
- 2006-01-09 EP EP06717830A patent/EP1839471A2/en not_active Withdrawn
- 2006-01-09 WO PCT/US2006/000676 patent/WO2006078493A2/en active Application Filing
- 2006-01-09 JP JP2007552163A patent/JP2008528390A/ja active Pending
- 2006-01-09 MX MX2007008539A patent/MX2007008539A/es unknown
- 2006-01-09 KR KR1020077016477A patent/KR101236687B1/ko not_active IP Right Cessation
- 2006-01-09 CN CNA2006800027633A patent/CN101107897A/zh active Pending
- 2006-01-19 TW TW095102066A patent/TW200631765A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2006078493A3 (en) | 2006-11-23 |
US20060157381A1 (en) | 2006-07-20 |
KR20070095955A (ko) | 2007-10-01 |
WO2006078493A2 (en) | 2006-07-27 |
EP1839471A2 (en) | 2007-10-03 |
MX2007008539A (es) | 2008-01-14 |
KR101236687B1 (ko) | 2013-02-22 |
JP2008528390A (ja) | 2008-07-31 |
CN101107897A (zh) | 2008-01-16 |
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