JP2010507257A5 - - Google Patents
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- Publication number
- JP2010507257A5 JP2010507257A5 JP2009533432A JP2009533432A JP2010507257A5 JP 2010507257 A5 JP2010507257 A5 JP 2010507257A5 JP 2009533432 A JP2009533432 A JP 2009533432A JP 2009533432 A JP2009533432 A JP 2009533432A JP 2010507257 A5 JP2010507257 A5 JP 2010507257A5
- Authority
- JP
- Japan
- Prior art keywords
- pockets
- tool
- crossbar
- carrier tape
- adjacent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000002093 peripheral effect Effects 0.000 claims 3
- 229920000642 polymer Polymers 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US82980706P | 2006-10-17 | 2006-10-17 | |
| PCT/US2007/080370 WO2008048785A1 (en) | 2006-10-17 | 2007-10-04 | Component carrier and method for making |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010507257A JP2010507257A (ja) | 2010-03-04 |
| JP2010507257A5 true JP2010507257A5 (es) | 2010-10-07 |
Family
ID=39314349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009533432A Withdrawn JP2010507257A (ja) | 2006-10-17 | 2007-10-04 | 構成部品キャリア及びその作製方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20080087572A1 (es) |
| JP (1) | JP2010507257A (es) |
| KR (1) | KR20090071595A (es) |
| CN (1) | CN101528565A (es) |
| DE (1) | DE112007002445T5 (es) |
| TW (1) | TW200833570A (es) |
| WO (1) | WO2008048785A1 (es) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9969541B2 (en) * | 2016-05-14 | 2018-05-15 | Qualcomm Incorporated | Vented carrier tape |
| DE102017004563A1 (de) | 2017-03-05 | 2018-09-06 | Entex Rust & Mitschke Gmbh | Entgasen beim Extrudieren von Polymeren |
| JP6990590B2 (ja) * | 2017-05-16 | 2022-01-12 | 太陽誘電株式会社 | 電子部品挿入装置、電子部品収納テープ製造装置、電子部品挿入方法、ならびに、電子部品収納テープ製造方法 |
| DE102018001412A1 (de) | 2017-12-11 | 2019-06-13 | Entex Rust & Mitschke Gmbh | Entgasen beim Extrudieren von Stoffen, vorzugsweise von Kunststoffen |
| US11240947B2 (en) * | 2018-06-28 | 2022-02-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Carrier tape system and components and methods of use |
| US10879098B2 (en) * | 2018-09-18 | 2020-12-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor chip holder |
| TW202239688A (zh) * | 2021-04-06 | 2022-10-16 | 美商3M新設資產公司 | 用於電子組件之載帶 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3444993A (en) * | 1968-04-23 | 1969-05-20 | Thomas J Lunsford | Component package with dust cover |
| GB2040569B (en) * | 1978-12-26 | 1983-09-01 | Murata Manufacturing Co | Chip-like electronic component series and method for supplying chip-like electronic components |
| US4736841A (en) * | 1985-02-20 | 1988-04-12 | Murata Manufacturing Co., Ltd. | Electronic component series |
| JPS62158673A (ja) * | 1985-12-28 | 1987-07-14 | 株式会社村田製作所 | テ−ピング電子部品連 |
| EP0254099A1 (de) * | 1986-07-17 | 1988-01-27 | Siemens Aktiengesellschaft | Gurt zum maschinengerechten Zuführen von Stückgütern, insbesondere von elektrischen bauelementen und Bauelementegruppen in Bestückungsautomaten für Leiterplatten |
| US5125508A (en) * | 1989-07-06 | 1992-06-30 | Murata Manufacturing Co., Ltd. | Tape-form electronic component package |
| US5234104A (en) * | 1991-02-04 | 1993-08-10 | Illinois Tool Works Inc. | Carrier tape system |
| DE69303230D1 (de) * | 1992-05-13 | 1996-07-25 | Gold Ind Co Ltd | Verketteter Behälter zum Transportieren von Präzisionsvorrichtungen |
| US5526935A (en) * | 1995-02-15 | 1996-06-18 | Minnesota Mining And Manufacturing Company | Component carrier tape |
| US5800772A (en) | 1995-03-22 | 1998-09-01 | Yayoi Corporation | Method for producing embossed carrier tape system |
| JPH10157767A (ja) * | 1996-10-03 | 1998-06-16 | Fujitsu Ltd | エンボスキャリアテープとエンボステーピング梱包体及びエンボステーピング梱包体の出荷包装箱 |
| WO1999012827A1 (fr) * | 1997-09-10 | 1999-03-18 | Yayoi Corporation | Emballage de pieces de type bande, bande de logement de pieces, element de recouvrement de type bande et appareil d'emballage de pieces |
| JP2001180784A (ja) * | 1999-10-28 | 2001-07-03 | Texas Instr Inc <Ti> | 可撓性担体テープ装置 |
| JP2003261173A (ja) * | 2002-03-05 | 2003-09-16 | Japan Aviation Electronics Industry Ltd | エンボスキャリアテープ |
| US20040014887A1 (en) * | 2002-05-14 | 2004-01-22 | Lee Coreen Y. | Polycarbonate and acrylonitrile-butadiene-styrene polymeric blends with improved impact resistance |
| US20030216508A1 (en) * | 2002-05-14 | 2003-11-20 | Lee Coreen Y. | Polycarbonate and acrylonitrile-butadiene-styrene polymeric blends with improved impact resistance |
| US7718133B2 (en) * | 2003-10-09 | 2010-05-18 | 3M Innovative Properties Company | Multilayer processing devices and methods |
| US20060293438A1 (en) * | 2005-06-23 | 2006-12-28 | 3M Innovative Properties Company | Carrier tapes and compositions thereof |
-
2007
- 2007-10-04 KR KR1020097007776A patent/KR20090071595A/ko not_active Application Discontinuation
- 2007-10-04 CN CNA200780038760XA patent/CN101528565A/zh active Pending
- 2007-10-04 DE DE112007002445T patent/DE112007002445T5/de not_active Withdrawn
- 2007-10-04 WO PCT/US2007/080370 patent/WO2008048785A1/en active Application Filing
- 2007-10-04 JP JP2009533432A patent/JP2010507257A/ja not_active Withdrawn
- 2007-10-04 US US11/867,088 patent/US20080087572A1/en not_active Abandoned
- 2007-10-16 TW TW096138735A patent/TW200833570A/zh unknown
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