JP2008528390A5 - - Google Patents

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Publication number
JP2008528390A5
JP2008528390A5 JP2007552163A JP2007552163A JP2008528390A5 JP 2008528390 A5 JP2008528390 A5 JP 2008528390A5 JP 2007552163 A JP2007552163 A JP 2007552163A JP 2007552163 A JP2007552163 A JP 2007552163A JP 2008528390 A5 JP2008528390 A5 JP 2008528390A5
Authority
JP
Japan
Prior art keywords
pockets
strip
tool
carrier tape
top surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007552163A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008528390A (ja
Filing date
Publication date
Priority claimed from US11/039,039 external-priority patent/US20060157381A1/en
Application filed filed Critical
Publication of JP2008528390A publication Critical patent/JP2008528390A/ja
Publication of JP2008528390A5 publication Critical patent/JP2008528390A5/ja
Pending legal-status Critical Current

Links

JP2007552163A 2005-01-20 2006-01-09 コンポーネントキャリヤおよび製造方法 Pending JP2008528390A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/039,039 US20060157381A1 (en) 2005-01-20 2005-01-20 Component carrier and method for making
PCT/US2006/000676 WO2006078493A2 (en) 2005-01-20 2006-01-09 Component carrier and method for making

Publications (2)

Publication Number Publication Date
JP2008528390A JP2008528390A (ja) 2008-07-31
JP2008528390A5 true JP2008528390A5 (enExample) 2009-03-05

Family

ID=36498811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007552163A Pending JP2008528390A (ja) 2005-01-20 2006-01-09 コンポーネントキャリヤおよび製造方法

Country Status (9)

Country Link
US (1) US20060157381A1 (enExample)
EP (1) EP1839471A2 (enExample)
JP (1) JP2008528390A (enExample)
KR (1) KR101236687B1 (enExample)
CN (1) CN101107897A (enExample)
MX (1) MX2007008539A (enExample)
PH (1) PH12012502049A1 (enExample)
TW (1) TW200631765A (enExample)
WO (1) WO2006078493A2 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007075662A1 (en) * 2005-12-20 2007-07-05 3M Innovative Properties Company Component carrier tape
JP2007182910A (ja) * 2005-12-29 2007-07-19 Brother Ind Ltd プーリホルダ
JP2007181934A (ja) * 2005-12-29 2007-07-19 Brother Ind Ltd プーリホルダ支持構造、プーリホルダ
CN101544294A (zh) * 2008-03-27 2009-09-30 3M创新有限公司 电子器件封装装置、电子器件封装方法及其封装设备
US8205766B2 (en) * 2009-05-20 2012-06-26 The Bergquist Company Method for packaging thermal interface materials
US8430264B2 (en) * 2009-05-20 2013-04-30 The Bergquist Company Method for packaging thermal interface materials
USD695635S1 (en) * 2010-08-06 2013-12-17 Murata Manufacturing Co., Ltd. Carrier tape
JP2012106475A (ja) * 2010-10-19 2012-06-07 Idemitsu Unitech Co Ltd エンボステープの製造方法、エンボステープの製造装置、およびエンボステープ
DE102012012562A1 (de) * 2011-06-30 2013-01-03 Asmo Co., Ltd. Werkstückzufuhrvorrichtung und werkstückzufuhrverfahren
JP6114514B2 (ja) * 2012-03-27 2017-04-12 信越ポリマー株式会社 電子部品収納用キャリアテープ、電子部品収納用キャリアテープの製造方法、および包装体
JP6257933B2 (ja) * 2012-08-31 2018-01-10 信越ポリマー株式会社 電子部品収納用キャリアテープの製造方法およびキャリアテープ作製用シートの製造方法
JP6257934B2 (ja) * 2012-08-31 2018-01-10 信越ポリマー株式会社 キャリアテープ製造装置およびキャリアテープ作製用シート製造装置
US20150083641A1 (en) * 2013-09-25 2015-03-26 Texas Instruments Incorporated Selective heat seal wafer cover tape (has tape)
JP2015110441A (ja) * 2013-10-31 2015-06-18 株式会社村田製作所 電子部品の包装体、電子部品連およびキャリアテープ
WO2016197342A1 (en) * 2015-06-10 2016-12-15 3M Innovative Properties Company Component carrier tape and manufacturing method thereof
US9698040B2 (en) * 2015-10-29 2017-07-04 Stmicroelectronics (Malta) Ltd Semiconductor device carrier tape with image sensor detectable dimples
JP2019094078A (ja) * 2017-11-20 2019-06-20 信越ポリマー株式会社 キャリアテープ及びキャリアテープの成形方法
US11452249B2 (en) * 2017-12-11 2022-09-20 Delphon Industries, Llc Carrier for reversibly immobilizing one or more objects
TW202222656A (zh) * 2020-12-01 2022-06-16 美商美光科技公司 用於微電子裝置的承載帶及相關方法
US20240351315A1 (en) * 2023-04-20 2024-10-24 Honeywell International Inc. Moisture barrier carrier tape and lid for electronic parts
CN118977403B (zh) * 2024-10-21 2024-12-20 新创源云海(成都)科技有限公司 一种高效连续生产载带短节的生产装置及方法

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US3399101A (en) * 1964-08-11 1968-08-27 Eugene A. Magid Valley printing effects and method of producing same
US3932248A (en) * 1973-09-28 1976-01-13 Keaton Clyde D Method and apparatus for making laminated board with a pocketed core
US4110152A (en) * 1975-06-20 1978-08-29 Avery International Corporation Embossing roller and method
GB2040569B (en) * 1978-12-26 1983-09-01 Murata Manufacturing Co Chip-like electronic component series and method for supplying chip-like electronic components
US4736841A (en) * 1985-02-20 1988-04-12 Murata Manufacturing Co., Ltd. Electronic component series
NL8503063A (nl) * 1985-11-08 1987-06-01 Philips Nv Bandverpakking voor elektrische en/of elektronische onderdelen.
JPS62158673A (ja) * 1985-12-28 1987-07-14 株式会社村田製作所 テ−ピング電子部品連
US5125508A (en) * 1989-07-06 1992-06-30 Murata Manufacturing Co., Ltd. Tape-form electronic component package
US5123984A (en) * 1990-08-17 1992-06-23 T-Systems International, Inc. Method and apparatus for forming ports in drip irrigation hose
US5269983A (en) * 1991-02-04 1993-12-14 James River Corporation Of Virginia Rubber-to-steel mated embossing
JPH07101461A (ja) * 1993-09-30 1995-04-18 Yayoi Kk エンボスキャリアテープ
US5472085A (en) * 1994-05-16 1995-12-05 Gpax International, Inc. Gated-pocket tape-form packaging system
US5526935A (en) * 1995-02-15 1996-06-18 Minnesota Mining And Manufacturing Company Component carrier tape
US5800772A (en) * 1995-03-22 1998-09-01 Yayoi Corporation Method for producing embossed carrier tape system
US5765692A (en) * 1995-11-13 1998-06-16 Minnesota Mining And Manufacturing Company Carrier tape with adhesive and protective walls
US5665456A (en) * 1995-12-06 1997-09-09 Sealed Air Corporation Heat-shrinkable flexible cushioning material and method of forming the same
US6016917A (en) * 1997-04-24 2000-01-25 Peak International, Inc. Component carrier having a pocket including a pedestal
US6375871B1 (en) * 1998-06-18 2002-04-23 3M Innovative Properties Company Methods of manufacturing microfluidic articles
IL129606A (en) * 1997-09-10 2003-05-29 Yayoi Corp Tape-shaped parts package, parts storing tape, tape-shaped cover and parts packaging apparatus
JP3388698B2 (ja) * 1997-11-21 2003-03-24 信越ポリマー株式会社 キャリアテープの製造方法
US6003676A (en) * 1997-12-05 1999-12-21 Tek Pak, Inc. Product carrier and method of making same
DE69913122T2 (de) * 1998-03-02 2004-05-27 Fabio Perini S.P.A. Verfahren und gerät zur herstellung von geprägtem bahnmaterial und auf diese weise hergestelltes produkt
JP2001180784A (ja) * 1999-10-28 2001-07-03 Texas Instr Inc <Ti> 可撓性担体テープ装置
WO2003092970A1 (de) * 2002-05-02 2003-11-13 Bos Berlin Oberspree Sondermaschinenbau Gmbh Perforationsvorrichtung
US20040014887A1 (en) * 2002-05-14 2004-01-22 Lee Coreen Y. Polycarbonate and acrylonitrile-butadiene-styrene polymeric blends with improved impact resistance
US20030216508A1 (en) * 2002-05-14 2003-11-20 Lee Coreen Y. Polycarbonate and acrylonitrile-butadiene-styrene polymeric blends with improved impact resistance
JP2004137080A (ja) * 2002-09-26 2004-05-13 Shin Etsu Polymer Co Ltd キャリアテープの巻き取り方法
JP4170086B2 (ja) * 2002-12-09 2008-10-22 日本ウェーブロック株式会社 エンボスキャリアテープの製造方法、及び、エンボスキャリアテープ製造装置
US7718133B2 (en) * 2003-10-09 2010-05-18 3M Innovative Properties Company Multilayer processing devices and methods

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