JP2008527328A5 - - Google Patents

Download PDF

Info

Publication number
JP2008527328A5
JP2008527328A5 JP2007549436A JP2007549436A JP2008527328A5 JP 2008527328 A5 JP2008527328 A5 JP 2008527328A5 JP 2007549436 A JP2007549436 A JP 2007549436A JP 2007549436 A JP2007549436 A JP 2007549436A JP 2008527328 A5 JP2008527328 A5 JP 2008527328A5
Authority
JP
Japan
Prior art keywords
array
opening
dut
devices
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007549436A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008527328A (ja
Filing date
Publication date
Priority claimed from US11/028,940 external-priority patent/US7282933B2/en
Application filed filed Critical
Publication of JP2008527328A publication Critical patent/JP2008527328A/ja
Publication of JP2008527328A5 publication Critical patent/JP2008527328A5/ja
Pending legal-status Critical Current

Links

JP2007549436A 2005-01-03 2005-12-15 プローブヘッドアレイ Pending JP2008527328A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/028,940 US7282933B2 (en) 2005-01-03 2005-01-03 Probe head arrays
PCT/US2005/045582 WO2006073736A2 (en) 2005-01-03 2005-12-15 Probe head arrays

Publications (2)

Publication Number Publication Date
JP2008527328A JP2008527328A (ja) 2008-07-24
JP2008527328A5 true JP2008527328A5 (enExample) 2009-02-19

Family

ID=36639659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007549436A Pending JP2008527328A (ja) 2005-01-03 2005-12-15 プローブヘッドアレイ

Country Status (7)

Country Link
US (1) US7282933B2 (enExample)
EP (1) EP1842073A2 (enExample)
JP (1) JP2008527328A (enExample)
KR (1) KR20070112125A (enExample)
CN (1) CN101095057B (enExample)
TW (1) TW200634313A (enExample)
WO (1) WO2006073736A2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100652421B1 (ko) * 2005-08-09 2006-12-01 삼성전자주식회사 도넛형 병렬 프로브 카드 및 이를 이용한 웨이퍼 검사방법
JP2007250691A (ja) * 2006-03-14 2007-09-27 Elpida Memory Inc プローブカード、プローブカードの設計方法及びテスト方法
US7649366B2 (en) 2006-09-01 2010-01-19 Formfactor, Inc. Method and apparatus for switching tester resources
US7852094B2 (en) * 2006-12-06 2010-12-14 Formfactor, Inc. Sharing resources in a system for testing semiconductor devices
US7535239B1 (en) * 2006-12-14 2009-05-19 Xilinx, Inc. Probe card configured for interchangeable heads
KR100850274B1 (ko) * 2007-01-04 2008-08-04 삼성전자주식회사 반도체 칩 테스트를 위한 프로브 카드 및 이를 이용한반도체 칩 테스트 방법
US7893700B2 (en) * 2008-07-28 2011-02-22 Formfactor, Inc. Configuration of shared tester channels to avoid electrical connections across die area boundary on a wafer
KR101534163B1 (ko) * 2009-04-01 2015-07-06 삼성전자주식회사 실장 테스트에 적합한 메인 보드 및 이를 포함하는 메모리 실장 테스트 시스템
CN104204818B (zh) 2012-03-23 2017-05-24 爱德万测试公司 用于半导体测试的横向驱动探针
US9678108B1 (en) 2014-02-06 2017-06-13 Advantest America, Inc. Methods to manufacture semiconductor probe tips
CN106597037B (zh) 2015-10-20 2019-07-16 创意电子股份有限公司 探针卡与测试方法
CN107367678B (zh) * 2016-05-11 2020-03-10 中芯国际集成电路制造(上海)有限公司 测试结构、测试探针卡、测试系统及测试方法
CN107422242A (zh) * 2016-05-23 2017-12-01 北大方正集团有限公司 一种vdmos芯片的测试装置及方法
JP7498677B2 (ja) 2021-02-25 2024-06-12 ルネサスエレクトロニクス株式会社 テスト装置、テスト方法および記録媒体

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4837622A (en) 1985-05-10 1989-06-06 Micro-Probe, Inc. High density probe card
US5210485A (en) * 1991-07-26 1993-05-11 International Business Machines Corporation Probe for wafer burn-in test system
JPH0653299A (ja) * 1992-07-31 1994-02-25 Tokyo Electron Yamanashi Kk バーンイン装置
US6246247B1 (en) 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
EP0707214A3 (en) 1994-10-14 1997-04-16 Hughes Aircraft Co Multiport membrane probe to test complete semiconductor plates
US5642054A (en) 1995-08-08 1997-06-24 Hughes Aircraft Company Active circuit multi-port membrane probe for full wafer testing
JP3135825B2 (ja) 1995-09-27 2001-02-19 株式会社東芝 プローブカードおよびそのプローブカードを使用した半導体集積回路のプロービング試験方法
JP2001291750A (ja) * 2000-04-06 2001-10-19 Seiko Epson Corp プローブカード及びそれを用いたチップ領域ソート方法
CN2444311Y (zh) * 2000-08-15 2001-08-22 陈文杰 晶片测试装置
US6729019B2 (en) 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card
US6714828B2 (en) 2001-09-17 2004-03-30 Formfactor, Inc. Method and system for designing a probe card
TWI236723B (en) * 2002-10-02 2005-07-21 Renesas Tech Corp Probe sheet, probe card, semiconductor inspection device, and manufacturing method for semiconductor device

Similar Documents

Publication Publication Date Title
JP2008527328A5 (enExample)
JP2013053898A5 (ja) 半導体試験治具
CN201194023Y (zh) 一种集成电路测试装置
TW200731442A (en) Layout for DUT arrays used in semiconductor wafer testing
JP2008183910A5 (enExample)
JP2007088418A5 (enExample)
JP2006024939A5 (enExample)
WO2009042976A3 (en) Apparatus for testing devices
JP2012522381A5 (enExample)
WO2005124652A3 (en) Localizing a temperature of a device for testing
JP2009133722A5 (enExample)
WO2005091006A1 (ja) 複数種のテスタに対応可能なプローブ装置
WO2006073736A3 (en) Probe head arrays
WO2005098462A3 (en) Probe card and method for constructing same
TWI507695B (zh) 檢測發光元件的方法
WO2004102653A8 (ja) 半導体装置およびインターポーザー
JP6262547B2 (ja) プローバ及びプローブカードの針先研磨装置
TW200607038A (en) Contacts to semiconductor fin device and method for manufacturing the same
JP2009503504A5 (enExample)
WO2009050127A3 (de) Sondenhaltervorrichtung
JP2016051644A (ja) 電気部品用ソケット
JP3559725B2 (ja) 半導体素子検査用ソケット、半導体装置の検査方法及び製造方法
TW200643421A (en) Substrate inspection tool, substrate inspection device, and inspection contactor
JPH0373551A (ja) チップトレイ
JP2004311799A (ja) 半導体試験装置