TW200634313A - Probe head arrays - Google Patents

Probe head arrays

Info

Publication number
TW200634313A
TW200634313A TW094146763A TW94146763A TW200634313A TW 200634313 A TW200634313 A TW 200634313A TW 094146763 A TW094146763 A TW 094146763A TW 94146763 A TW94146763 A TW 94146763A TW 200634313 A TW200634313 A TW 200634313A
Authority
TW
Taiwan
Prior art keywords
probe
probe head
arrays
head arrays
under test
Prior art date
Application number
TW094146763A
Other languages
English (en)
Chinese (zh)
Inventor
Roy J Henson
John M Long
Original Assignee
Formfactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc filed Critical Formfactor Inc
Publication of TW200634313A publication Critical patent/TW200634313A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
TW094146763A 2005-01-03 2005-12-27 Probe head arrays TW200634313A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/028,940 US7282933B2 (en) 2005-01-03 2005-01-03 Probe head arrays

Publications (1)

Publication Number Publication Date
TW200634313A true TW200634313A (en) 2006-10-01

Family

ID=36639659

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094146763A TW200634313A (en) 2005-01-03 2005-12-27 Probe head arrays

Country Status (7)

Country Link
US (1) US7282933B2 (enExample)
EP (1) EP1842073A2 (enExample)
JP (1) JP2008527328A (enExample)
KR (1) KR20070112125A (enExample)
CN (1) CN101095057B (enExample)
TW (1) TW200634313A (enExample)
WO (1) WO2006073736A2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100652421B1 (ko) * 2005-08-09 2006-12-01 삼성전자주식회사 도넛형 병렬 프로브 카드 및 이를 이용한 웨이퍼 검사방법
JP2007250691A (ja) * 2006-03-14 2007-09-27 Elpida Memory Inc プローブカード、プローブカードの設計方法及びテスト方法
US7649366B2 (en) 2006-09-01 2010-01-19 Formfactor, Inc. Method and apparatus for switching tester resources
US7852094B2 (en) * 2006-12-06 2010-12-14 Formfactor, Inc. Sharing resources in a system for testing semiconductor devices
US7535239B1 (en) * 2006-12-14 2009-05-19 Xilinx, Inc. Probe card configured for interchangeable heads
KR100850274B1 (ko) * 2007-01-04 2008-08-04 삼성전자주식회사 반도체 칩 테스트를 위한 프로브 카드 및 이를 이용한반도체 칩 테스트 방법
US7893700B2 (en) * 2008-07-28 2011-02-22 Formfactor, Inc. Configuration of shared tester channels to avoid electrical connections across die area boundary on a wafer
KR101534163B1 (ko) * 2009-04-01 2015-07-06 삼성전자주식회사 실장 테스트에 적합한 메인 보드 및 이를 포함하는 메모리 실장 테스트 시스템
KR20140148387A (ko) 2012-03-23 2014-12-31 주식회사 아도반테스토 반도체 테스팅을 위한 측방향 구동식 프로브
US9678108B1 (en) 2014-02-06 2017-06-13 Advantest America, Inc. Methods to manufacture semiconductor probe tips
CN106597037B (zh) 2015-10-20 2019-07-16 创意电子股份有限公司 探针卡与测试方法
CN107367678B (zh) * 2016-05-11 2020-03-10 中芯国际集成电路制造(上海)有限公司 测试结构、测试探针卡、测试系统及测试方法
CN107422242A (zh) * 2016-05-23 2017-12-01 北大方正集团有限公司 一种vdmos芯片的测试装置及方法
JP7498677B2 (ja) * 2021-02-25 2024-06-12 ルネサスエレクトロニクス株式会社 テスト装置、テスト方法および記録媒体

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4837622A (en) 1985-05-10 1989-06-06 Micro-Probe, Inc. High density probe card
US5210485A (en) * 1991-07-26 1993-05-11 International Business Machines Corporation Probe for wafer burn-in test system
JPH0653299A (ja) * 1992-07-31 1994-02-25 Tokyo Electron Yamanashi Kk バーンイン装置
US6246247B1 (en) 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
EP0707214A3 (en) 1994-10-14 1997-04-16 Hughes Aircraft Co Multiport membrane probe to test complete semiconductor plates
US5642054A (en) 1995-08-08 1997-06-24 Hughes Aircraft Company Active circuit multi-port membrane probe for full wafer testing
JP3135825B2 (ja) 1995-09-27 2001-02-19 株式会社東芝 プローブカードおよびそのプローブカードを使用した半導体集積回路のプロービング試験方法
JP2001291750A (ja) * 2000-04-06 2001-10-19 Seiko Epson Corp プローブカード及びそれを用いたチップ領域ソート方法
CN2444311Y (zh) * 2000-08-15 2001-08-22 陈文杰 晶片测试装置
US6729019B2 (en) 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card
US6714828B2 (en) 2001-09-17 2004-03-30 Formfactor, Inc. Method and system for designing a probe card
TWI236723B (en) * 2002-10-02 2005-07-21 Renesas Tech Corp Probe sheet, probe card, semiconductor inspection device, and manufacturing method for semiconductor device

Also Published As

Publication number Publication date
KR20070112125A (ko) 2007-11-22
US20060145713A1 (en) 2006-07-06
WO2006073736A2 (en) 2006-07-13
EP1842073A2 (en) 2007-10-10
WO2006073736A3 (en) 2006-08-10
CN101095057B (zh) 2010-06-23
US7282933B2 (en) 2007-10-16
JP2008527328A (ja) 2008-07-24
CN101095057A (zh) 2007-12-26

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