WO2009050127A3 - Sondenhaltervorrichtung - Google Patents

Sondenhaltervorrichtung Download PDF

Info

Publication number
WO2009050127A3
WO2009050127A3 PCT/EP2008/063678 EP2008063678W WO2009050127A3 WO 2009050127 A3 WO2009050127 A3 WO 2009050127A3 EP 2008063678 W EP2008063678 W EP 2008063678W WO 2009050127 A3 WO2009050127 A3 WO 2009050127A3
Authority
WO
WIPO (PCT)
Prior art keywords
probe
needle
probe holder
manipulator
contacts
Prior art date
Application number
PCT/EP2008/063678
Other languages
English (en)
French (fr)
Other versions
WO2009050127A2 (de
Inventor
Joerg Kiesewetter
Stojan Kanev
Stefan Kreissig
Original Assignee
Suss Microtec Test Sys Gmbh
Joerg Kiesewetter
Stojan Kanev
Stefan Kreissig
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suss Microtec Test Sys Gmbh, Joerg Kiesewetter, Stojan Kanev, Stefan Kreissig filed Critical Suss Microtec Test Sys Gmbh
Priority to KR1020107010276A priority Critical patent/KR101496123B1/ko
Priority to JP2010528422A priority patent/JP2011501116A/ja
Priority to US12/681,967 priority patent/US8402848B2/en
Priority to DE112008002564T priority patent/DE112008002564A5/de
Publication of WO2009050127A2 publication Critical patent/WO2009050127A2/de
Publication of WO2009050127A3 publication Critical patent/WO2009050127A3/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Der Erfindung, die eine Sondenhaltervorrichtung betrifft, welche einen Manipulator (22), einen an dem Manipulator angeordneten Probearm sowie eine mit dem Probearm (9) zumindest mittelbar verbundene Probenadel (29) umfasst, liegt die Aufgabe zugrunde, eine Möglichkeit zu schaffen, die Vielzahl der Kontakte bei einem zu testenden Substrat zu erhöhen und eine vorteilhafte Möglichkeit zu schaffen, ein Testen einer Vielzahl von Kontakten in Ritzgräben von Halbleiterbauelementen in einem Scheibenverband zu kontaktieren. Dies wird gemäß der Erfindung dadurch gelöst, dass mit dem Probearm ein Nadelträger (13) verbunden ist, auf dem die Probenadel und mindestens eine zweite Probenadel angeordnet ist.
PCT/EP2008/063678 2007-10-10 2008-10-10 Sondenhaltervorrichtung WO2009050127A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020107010276A KR101496123B1 (ko) 2007-10-10 2008-10-10 프로브 홀더
JP2010528422A JP2011501116A (ja) 2007-10-10 2008-10-10 プローブ保持装置
US12/681,967 US8402848B2 (en) 2007-10-10 2008-10-10 Probe holder
DE112008002564T DE112008002564A5 (de) 2007-10-10 2008-10-10 Sondenhaltervorrichtung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007048816 2007-10-10
DE102007048816.7 2007-10-10

Publications (2)

Publication Number Publication Date
WO2009050127A2 WO2009050127A2 (de) 2009-04-23
WO2009050127A3 true WO2009050127A3 (de) 2009-07-02

Family

ID=40467228

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/063678 WO2009050127A2 (de) 2007-10-10 2008-10-10 Sondenhaltervorrichtung

Country Status (5)

Country Link
US (1) US8402848B2 (de)
JP (1) JP2011501116A (de)
KR (1) KR101496123B1 (de)
DE (1) DE112008002564A5 (de)
WO (1) WO2009050127A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8049522B2 (en) * 2008-08-26 2011-11-01 Evapco, Inc. Ice thickness probe, ice thickness probe assembly and ice thickness monitoring apparatus
US8904169B2 (en) * 2009-09-15 2014-12-02 Symantec Corporation Just in time trust establishment and propagation
WO2018119004A1 (en) * 2016-12-20 2018-06-28 Qualitau, Inc. Universal probing assembly with five degrees of freedom
KR102045506B1 (ko) * 2018-06-25 2019-11-18 주식회사에이치티엔씨 미세 피치 회로 검사 장치
US11828797B1 (en) * 2022-05-06 2023-11-28 Nanya Technology Corporation Probing device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6011405A (en) * 1997-10-28 2000-01-04 Qualitau, Inc. Apparatus and method for probing multiple integrated circuit dice in a semiconductor wafer
EP1204133A2 (de) * 2000-11-02 2002-05-08 Hitachi, Ltd. Verfahren und Vorrichtung zur Behandlung einer Mikroprobe
US20030042921A1 (en) * 1998-08-27 2003-03-06 Hollman Kenneth F. High resolution analytical probe station
US20040140794A1 (en) * 2002-01-07 2004-07-22 Seung-Gook Back Wafer probing test apparatus and method of docking the test head and probe card thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5761823A (en) * 1994-09-27 1998-06-09 Williamson, Jr.; John S. Relative planarity verification apparatus and method of use
US6864697B1 (en) * 2003-08-06 2005-03-08 Taiwan Semiconductor Manufacturing Co. Ltd Flip-over alignment station for probe needle adjustment
DE102006056543A1 (de) * 2006-11-29 2008-06-19 Suss Microtec Test Systems Gmbh Sondenhalter für eine Sonde zur Prüfung von Halbleiterbauelementen
DE102006056646B4 (de) * 2006-11-29 2009-04-30 Suss Microtec Test Systems Gmbh Sondenhalter für eine Sonde zur Prüfung von Halbleiterbauelementen

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6011405A (en) * 1997-10-28 2000-01-04 Qualitau, Inc. Apparatus and method for probing multiple integrated circuit dice in a semiconductor wafer
US20030042921A1 (en) * 1998-08-27 2003-03-06 Hollman Kenneth F. High resolution analytical probe station
EP1204133A2 (de) * 2000-11-02 2002-05-08 Hitachi, Ltd. Verfahren und Vorrichtung zur Behandlung einer Mikroprobe
US20040140794A1 (en) * 2002-01-07 2004-07-22 Seung-Gook Back Wafer probing test apparatus and method of docking the test head and probe card thereof

Also Published As

Publication number Publication date
WO2009050127A2 (de) 2009-04-23
KR20100105541A (ko) 2010-09-29
US8402848B2 (en) 2013-03-26
JP2011501116A (ja) 2011-01-06
US20100294053A1 (en) 2010-11-25
KR101496123B1 (ko) 2015-02-26
DE112008002564A5 (de) 2010-09-23

Similar Documents

Publication Publication Date Title
WO2011022301A3 (en) Wafer level contactor
TW200510729A (en) Probe card and contactor of the same
TW200706882A (en) Probe card assembly with a dielectric structure
WO2009050127A3 (de) Sondenhaltervorrichtung
WO2006073736A3 (en) Probe head arrays
TW200617410A (en) Semiconductor wafer and inspection method thereof
WO2006101861A3 (en) Microelectronic packages and methods therefor
WO2005098462A3 (en) Probe card and method for constructing same
TW200717677A (en) Semiconductor apparatus testing arrangement and semiconductor apparatus testing method
SG148104A1 (en) Probe card and method for fabricating the same
TW200834087A (en) Method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the same
TW200801526A (en) Multi-layered probes
TW200721339A (en) Manufacturing method of semiconductor integrated circuit device
GB2446629A (en) Technique for evaluating local electrical characteristics in semiconductor devices
WO2009004721A1 (ja) プローブ、プローブカード及びプローブの製造方法
EP1847834A4 (de) Zwischenstellungsglied, sondenkarte und verfahren zur herstellung eines zwischenstellungsglieds
WO2011087215A3 (ko) 프로브 카드
JP2010010306A (ja) 半導体ウエハ測定装置
EP2584596A3 (de) Testvorrichtung zum Testen von Wafern für elektrische Schaltungen und zugehöriges Verfahren
TW200636878A (en) Microelectronic assemblies having compliancy
JP2013053898A5 (ja) 半導体試験治具
TW200702667A (en) Test probe and manufacturing method for test probe
WO2012049087A3 (en) Semiconductor module and method of manufacturing a semiconductor module
WO2004102653A8 (ja) 半導体装置およびインターポーザー
TW200710411A (en) Method and apparatus for electrical testing of a unit under test, as well as a method for production of a contact-making apparatus which is used for testing

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08805239

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 1120080025649

Country of ref document: DE

WWE Wipo information: entry into national phase

Ref document number: 2010528422

Country of ref document: JP

ENP Entry into the national phase

Ref document number: 20107010276

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 12681967

Country of ref document: US

REF Corresponds to

Ref document number: 112008002564

Country of ref document: DE

Date of ref document: 20100923

Kind code of ref document: P

122 Ep: pct application non-entry in european phase

Ref document number: 08805239

Country of ref document: EP

Kind code of ref document: A2