TW200634313A - Probe head arrays - Google Patents
Probe head arraysInfo
- Publication number
- TW200634313A TW200634313A TW094146763A TW94146763A TW200634313A TW 200634313 A TW200634313 A TW 200634313A TW 094146763 A TW094146763 A TW 094146763A TW 94146763 A TW94146763 A TW 94146763A TW 200634313 A TW200634313 A TW 200634313A
- Authority
- TW
- Taiwan
- Prior art keywords
- probe
- probe head
- arrays
- head arrays
- under test
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/028,940 US7282933B2 (en) | 2005-01-03 | 2005-01-03 | Probe head arrays |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200634313A true TW200634313A (en) | 2006-10-01 |
Family
ID=36639659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094146763A TW200634313A (en) | 2005-01-03 | 2005-12-27 | Probe head arrays |
Country Status (7)
Country | Link |
---|---|
US (1) | US7282933B2 (zh) |
EP (1) | EP1842073A2 (zh) |
JP (1) | JP2008527328A (zh) |
KR (1) | KR20070112125A (zh) |
CN (1) | CN101095057B (zh) |
TW (1) | TW200634313A (zh) |
WO (1) | WO2006073736A2 (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100652421B1 (ko) * | 2005-08-09 | 2006-12-01 | 삼성전자주식회사 | 도넛형 병렬 프로브 카드 및 이를 이용한 웨이퍼 검사방법 |
JP2007250691A (ja) * | 2006-03-14 | 2007-09-27 | Elpida Memory Inc | プローブカード、プローブカードの設計方法及びテスト方法 |
US7649366B2 (en) | 2006-09-01 | 2010-01-19 | Formfactor, Inc. | Method and apparatus for switching tester resources |
US7852094B2 (en) * | 2006-12-06 | 2010-12-14 | Formfactor, Inc. | Sharing resources in a system for testing semiconductor devices |
US7535239B1 (en) * | 2006-12-14 | 2009-05-19 | Xilinx, Inc. | Probe card configured for interchangeable heads |
KR100850274B1 (ko) * | 2007-01-04 | 2008-08-04 | 삼성전자주식회사 | 반도체 칩 테스트를 위한 프로브 카드 및 이를 이용한반도체 칩 테스트 방법 |
US7893700B2 (en) * | 2008-07-28 | 2011-02-22 | Formfactor, Inc. | Configuration of shared tester channels to avoid electrical connections across die area boundary on a wafer |
KR101534163B1 (ko) * | 2009-04-01 | 2015-07-06 | 삼성전자주식회사 | 실장 테스트에 적합한 메인 보드 및 이를 포함하는 메모리 실장 테스트 시스템 |
CN104204818B (zh) | 2012-03-23 | 2017-05-24 | 爱德万测试公司 | 用于半导体测试的横向驱动探针 |
US9678108B1 (en) | 2014-02-06 | 2017-06-13 | Advantest America, Inc. | Methods to manufacture semiconductor probe tips |
CN106597037B (zh) | 2015-10-20 | 2019-07-16 | 创意电子股份有限公司 | 探针卡与测试方法 |
CN107367678B (zh) * | 2016-05-11 | 2020-03-10 | 中芯国际集成电路制造(上海)有限公司 | 测试结构、测试探针卡、测试系统及测试方法 |
CN107422242A (zh) * | 2016-05-23 | 2017-12-01 | 北大方正集团有限公司 | 一种vdmos芯片的测试装置及方法 |
JP7498677B2 (ja) | 2021-02-25 | 2024-06-12 | ルネサスエレクトロニクス株式会社 | テスト装置、テスト方法および記録媒体 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4837622A (en) * | 1985-05-10 | 1989-06-06 | Micro-Probe, Inc. | High density probe card |
US5210485A (en) * | 1991-07-26 | 1993-05-11 | International Business Machines Corporation | Probe for wafer burn-in test system |
JPH0653299A (ja) * | 1992-07-31 | 1994-02-25 | Tokyo Electron Yamanashi Kk | バーンイン装置 |
US6246247B1 (en) * | 1994-11-15 | 2001-06-12 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
EP0707214A3 (en) * | 1994-10-14 | 1997-04-16 | Hughes Aircraft Co | Multiport membrane probe to test complete semiconductor plates |
US5642054A (en) * | 1995-08-08 | 1997-06-24 | Hughes Aircraft Company | Active circuit multi-port membrane probe for full wafer testing |
JP3135825B2 (ja) * | 1995-09-27 | 2001-02-19 | 株式会社東芝 | プローブカードおよびそのプローブカードを使用した半導体集積回路のプロービング試験方法 |
JP2001291750A (ja) * | 2000-04-06 | 2001-10-19 | Seiko Epson Corp | プローブカード及びそれを用いたチップ領域ソート方法 |
CN2444311Y (zh) * | 2000-08-15 | 2001-08-22 | 陈文杰 | 晶片测试装置 |
US6729019B2 (en) * | 2001-07-11 | 2004-05-04 | Formfactor, Inc. | Method of manufacturing a probe card |
US6714828B2 (en) * | 2001-09-17 | 2004-03-30 | Formfactor, Inc. | Method and system for designing a probe card |
TWI236723B (en) * | 2002-10-02 | 2005-07-21 | Renesas Tech Corp | Probe sheet, probe card, semiconductor inspection device, and manufacturing method for semiconductor device |
-
2005
- 2005-01-03 US US11/028,940 patent/US7282933B2/en not_active Expired - Fee Related
- 2005-12-15 KR KR1020077017753A patent/KR20070112125A/ko not_active Application Discontinuation
- 2005-12-15 CN CN2005800457196A patent/CN101095057B/zh not_active Expired - Fee Related
- 2005-12-15 JP JP2007549436A patent/JP2008527328A/ja active Pending
- 2005-12-15 EP EP05854328A patent/EP1842073A2/en not_active Withdrawn
- 2005-12-15 WO PCT/US2005/045582 patent/WO2006073736A2/en active Application Filing
- 2005-12-27 TW TW094146763A patent/TW200634313A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN101095057A (zh) | 2007-12-26 |
US7282933B2 (en) | 2007-10-16 |
KR20070112125A (ko) | 2007-11-22 |
WO2006073736A3 (en) | 2006-08-10 |
JP2008527328A (ja) | 2008-07-24 |
EP1842073A2 (en) | 2007-10-10 |
CN101095057B (zh) | 2010-06-23 |
US20060145713A1 (en) | 2006-07-06 |
WO2006073736A2 (en) | 2006-07-13 |
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