CN101095057B - 探针头阵列 - Google Patents

探针头阵列 Download PDF

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Publication number
CN101095057B
CN101095057B CN2005800457196A CN200580045719A CN101095057B CN 101095057 B CN101095057 B CN 101095057B CN 2005800457196 A CN2005800457196 A CN 2005800457196A CN 200580045719 A CN200580045719 A CN 200580045719A CN 101095057 B CN101095057 B CN 101095057B
Authority
CN
China
Prior art keywords
probe
dut
array
wafer
duts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2005800457196A
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English (en)
Chinese (zh)
Other versions
CN101095057A (zh
Inventor
R·J·汉森
J·M·隆恩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of CN101095057A publication Critical patent/CN101095057A/zh
Application granted granted Critical
Publication of CN101095057B publication Critical patent/CN101095057B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
CN2005800457196A 2005-01-03 2005-12-15 探针头阵列 Expired - Fee Related CN101095057B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/028,940 2005-01-03
US11/028,940 US7282933B2 (en) 2005-01-03 2005-01-03 Probe head arrays
PCT/US2005/045582 WO2006073736A2 (en) 2005-01-03 2005-12-15 Probe head arrays

Publications (2)

Publication Number Publication Date
CN101095057A CN101095057A (zh) 2007-12-26
CN101095057B true CN101095057B (zh) 2010-06-23

Family

ID=36639659

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005800457196A Expired - Fee Related CN101095057B (zh) 2005-01-03 2005-12-15 探针头阵列

Country Status (7)

Country Link
US (1) US7282933B2 (enExample)
EP (1) EP1842073A2 (enExample)
JP (1) JP2008527328A (enExample)
KR (1) KR20070112125A (enExample)
CN (1) CN101095057B (enExample)
TW (1) TW200634313A (enExample)
WO (1) WO2006073736A2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100652421B1 (ko) * 2005-08-09 2006-12-01 삼성전자주식회사 도넛형 병렬 프로브 카드 및 이를 이용한 웨이퍼 검사방법
JP2007250691A (ja) * 2006-03-14 2007-09-27 Elpida Memory Inc プローブカード、プローブカードの設計方法及びテスト方法
US7649366B2 (en) 2006-09-01 2010-01-19 Formfactor, Inc. Method and apparatus for switching tester resources
US7852094B2 (en) * 2006-12-06 2010-12-14 Formfactor, Inc. Sharing resources in a system for testing semiconductor devices
US7535239B1 (en) * 2006-12-14 2009-05-19 Xilinx, Inc. Probe card configured for interchangeable heads
KR100850274B1 (ko) * 2007-01-04 2008-08-04 삼성전자주식회사 반도체 칩 테스트를 위한 프로브 카드 및 이를 이용한반도체 칩 테스트 방법
US7893700B2 (en) * 2008-07-28 2011-02-22 Formfactor, Inc. Configuration of shared tester channels to avoid electrical connections across die area boundary on a wafer
KR101534163B1 (ko) * 2009-04-01 2015-07-06 삼성전자주식회사 실장 테스트에 적합한 메인 보드 및 이를 포함하는 메모리 실장 테스트 시스템
CN104204818B (zh) 2012-03-23 2017-05-24 爱德万测试公司 用于半导体测试的横向驱动探针
US9678108B1 (en) 2014-02-06 2017-06-13 Advantest America, Inc. Methods to manufacture semiconductor probe tips
CN106597037B (zh) 2015-10-20 2019-07-16 创意电子股份有限公司 探针卡与测试方法
CN107367678B (zh) * 2016-05-11 2020-03-10 中芯国际集成电路制造(上海)有限公司 测试结构、测试探针卡、测试系统及测试方法
CN107422242A (zh) * 2016-05-23 2017-12-01 北大方正集团有限公司 一种vdmos芯片的测试装置及方法
JP7498677B2 (ja) 2021-02-25 2024-06-12 ルネサスエレクトロニクス株式会社 テスト装置、テスト方法および記録媒体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5623214A (en) * 1994-10-14 1997-04-22 Hughes Aircraft Company Multiport membrane probe for full-wafer testing
US5642054A (en) * 1995-08-08 1997-06-24 Hughes Aircraft Company Active circuit multi-port membrane probe for full wafer testing
US5818249A (en) * 1995-09-27 1998-10-06 Kabushiki Kaisha Toshiba Probe card having groups of probe needles in a probing test apparatus for testing semiconductor integrated circuits
CN2444311Y (zh) * 2000-08-15 2001-08-22 陈文杰 晶片测试装置
CN1512186A (zh) * 2002-10-02 2004-07-14 ��ʽ���������Ƽ� 探针片、探针卡、半导体检查装置及半导体装置的制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4837622A (en) * 1985-05-10 1989-06-06 Micro-Probe, Inc. High density probe card
US5210485A (en) * 1991-07-26 1993-05-11 International Business Machines Corporation Probe for wafer burn-in test system
JPH0653299A (ja) * 1992-07-31 1994-02-25 Tokyo Electron Yamanashi Kk バーンイン装置
US6246247B1 (en) * 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
JP2001291750A (ja) * 2000-04-06 2001-10-19 Seiko Epson Corp プローブカード及びそれを用いたチップ領域ソート方法
US6729019B2 (en) * 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card
US6714828B2 (en) * 2001-09-17 2004-03-30 Formfactor, Inc. Method and system for designing a probe card

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5623214A (en) * 1994-10-14 1997-04-22 Hughes Aircraft Company Multiport membrane probe for full-wafer testing
US5642054A (en) * 1995-08-08 1997-06-24 Hughes Aircraft Company Active circuit multi-port membrane probe for full wafer testing
US5818249A (en) * 1995-09-27 1998-10-06 Kabushiki Kaisha Toshiba Probe card having groups of probe needles in a probing test apparatus for testing semiconductor integrated circuits
CN2444311Y (zh) * 2000-08-15 2001-08-22 陈文杰 晶片测试装置
CN1512186A (zh) * 2002-10-02 2004-07-14 ��ʽ���������Ƽ� 探针片、探针卡、半导体检查装置及半导体装置的制造方法

Also Published As

Publication number Publication date
TW200634313A (en) 2006-10-01
KR20070112125A (ko) 2007-11-22
US20060145713A1 (en) 2006-07-06
CN101095057A (zh) 2007-12-26
WO2006073736A3 (en) 2006-08-10
EP1842073A2 (en) 2007-10-10
JP2008527328A (ja) 2008-07-24
US7282933B2 (en) 2007-10-16
WO2006073736A2 (en) 2006-07-13

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SE01 Entry into force of request for substantive examination
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GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100623

Termination date: 20111215