JP2008524840A - 過渡的増速拡散を削減するためのイオン注入方法 - Google Patents
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- 238000000034 method Methods 0.000 title claims abstract description 74
- 238000005468 ion implantation Methods 0.000 title claims abstract description 18
- 238000009792 diffusion process Methods 0.000 title description 8
- 230000001052 transient effect Effects 0.000 title description 4
- 238000002513 implantation Methods 0.000 claims abstract description 144
- 239000000758 substrate Substances 0.000 claims abstract description 118
- 239000004065 semiconductor Substances 0.000 claims abstract description 85
- 238000005280 amorphization Methods 0.000 claims abstract description 66
- 230000007547 defect Effects 0.000 claims abstract description 60
- 239000002019 doping agent Substances 0.000 claims abstract description 20
- 229910052799 carbon Inorganic materials 0.000 claims description 54
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 52
- 239000007943 implant Substances 0.000 claims description 42
- 229910052710 silicon Inorganic materials 0.000 claims description 37
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 36
- 239000010703 silicon Substances 0.000 claims description 36
- 229910052796 boron Inorganic materials 0.000 claims description 33
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 32
- 229910052732 germanium Inorganic materials 0.000 claims description 27
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 27
- 238000000137 annealing Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 8
- 229910052731 fluorine Inorganic materials 0.000 claims description 8
- 239000011737 fluorine Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 5
- 229910052785 arsenic Inorganic materials 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052787 antimony Inorganic materials 0.000 claims description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 38
- 238000002347 injection Methods 0.000 description 15
- 239000007924 injection Substances 0.000 description 15
- 150000002500 ions Chemical class 0.000 description 12
- 230000008901 benefit Effects 0.000 description 7
- 229910021419 crystalline silicon Inorganic materials 0.000 description 7
- 230000004913 activation Effects 0.000 description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 description 6
- 230000009467 reduction Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 238000005224 laser annealing Methods 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000007669 thermal treatment Methods 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 230000005465 channeling Effects 0.000 description 2
- 230000008030 elimination Effects 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- HMDDXIMCDZRSNE-UHFFFAOYSA-N [C].[Si] Chemical compound [C].[Si] HMDDXIMCDZRSNE-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- RBFDCQDDCJFGIK-UHFFFAOYSA-N arsenic germanium Chemical compound [Ge].[As] RBFDCQDDCJFGIK-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000004151 rapid thermal annealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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Abstract
【選択図】 なし
Description
1−最適炭素エネルギは、ホウ素TEDを効率的に削減するために10keVであることを必要とする。
2−炭素は、a/c界面に、またはこれを超えてではなくアモルファス層内に位置決めされる必要がある。
3−炭素はホウ素に重畳すべきではない。
1−炭素共注入プロセスは、接合が変化する1keVだけ炭素エネルギを増大させることによって、炭素エネルギieに対して非常に感応性である。
2−10keVの炭素を使用することによって、(注入ピークとしての)最大炭素濃度は約400Aに位置決めされ、これは20keV Ge(300Aのアモルファス深さ)によって作成されたa/c界面を超えて置かれる。これは8keV〜10keVの炭素で生じるリバース挙動を説明する。
3−最適炭素エネルギは5keVであり、80keV Geプレアモルファス化による前の実験において見られる炭素とゲルマニウムの1〜4のエネルギ比を検証する。
シリコン基板を提供するステップと、
第1の注入エネルギで半導体基板に第1のアモルファス化前の注入を実行するステップと、
第2の注入エネルギで半導体基板に第2のアモルファス化前の注入を実行するステップと、
半導体基板にドーパントの注入を実行して浅い接合を提供するステップであって、第1の注入エネルギが第2の注入エネルギよりも大きいステップと、
を備える。
Claims (27)
- イオン注入方法であって、
a)半導体基板を提供するステップと、
b)第1の注入エネルギで前記半導体基板にアモルファス化前の注入(pre-amorphisation implant)を実行するステップと、
c)第2の注入エネルギで前記半導体基板に欠陥トラップ要素の注入を実行するステップと、
d)前記半導体基板にドーパントの注入を実行して浅い接合を提供するステップであって、前記第1の注入エネルギに対する前記第2の注入エネルギの比が10〜40%の範囲にあるステップと、
を備える方法。 - 前記比が実質的に25%である、請求項1に記載の方法。
- アモルファス化前の注入を実行する前記ステップが、以下の半導体材料:ゲルマニウム、シリコン、フッ素、アンチモンのうちのいずれか1つを前記半導体基板に注入する工程を備える、請求項1または2のいずれか一項に記載の方法。
- 前記欠陥トラップ要素が以下の材料:炭素、窒素およびフッ素のうちのいずれか1つである、請求項1〜3のいずれか一項に記載の方法。
- アモルファス化前の注入を実行する前記ステップが、ゲルマニウムを前記半導体基板に注入する工程を備えており、前記欠陥トラップ要素が炭素であり、前記第1の注入エネルギに対する前記第2の注入エネルギの比が実質的に25%である、請求項の1〜4のいずれか一項に記載の方法。
- ステップc)、c)およびd)が任意の順序で実行される、請求項1〜5のいずれか一項に記載の方法。
- 前記ドーパントが、以下の材料:ホウ素、ヒ素およびリンのうちのいずれか1つである、請求項1〜6のいずれか一項に記載の方法。
- アモルファス化前の注入を実行する前記ステップが、注入方向が前記半導体基板の表面への法線に対して20〜60°の範囲の角度であるように注入を実行する工程を備える、請求項1〜7のいずれか一項に記載の方法。
- ステップd)が、注入方向が前記半導体基板の表面への法線に対して20〜60°の範囲の角度になるように注入を実行する工程を備える、請求項8に記載の方法。
- イオン注入方法であって、
a)シリコン基板を提供するステップと、
b)第1の注入エネルギで前記シリコン基板にゲルマニウムのアモルファス化前の注入を実行するステップと、
c)第2の注入エネルギで前記シリコン基板に、炭素を備える欠陥トラップ要素の注入を実行するステップと、
d)前記シリコン基板にホウ素ドーパントの注入を実行して浅い接合を提供するステップであって、前記第1の注入エネルギに対する前記第2の注入エネルギの比が実質的に25%であるステップと、
を備える方法。 - イオン注入方法であって、
a)半導体基板を提供するステップと、
b)前記半導体基板の表面への法線に対して20〜60°の範囲の角度の注入方向で前記半導体基板にアモルファス化前の注入を実行するステップと、
c)前記半導体基板にドーパントの注入を実行して浅い接合を提供するステップと、
を備える方法。 - 前記角度が35〜40°の範囲にある、請求項11に記載の方法。
- アモルファス化前の注入を実行する前記ステップがさらに、前記注入角度に左右される注入エネルギでプレアモルファス化材料を注入する工程を備える、請求項11または12のいずれか一項に記載の方法。
- ステップc)が、注入方向が前記半導体基板の表面への法線に対して20〜60°の範囲の角度になるように注入を実行する工程を備える、請求項11〜13のいずれか一項に記載の方法。
- d)前記半導体基板に欠陥トラップ要素の注入を実行するステップをさらに備える、請求項11〜14のいずれか一項に記載の方法。
- ステップb)が、第1の注入エネルギで前記半導体基板に前記アモルファス化前の注入を実行する工程を備えており、ステップd)が、第2の注入エネルギで前記半導体基板に欠陥トラップ要素の前記注入を実行する工程を備えており、前記第2の注入エネルギに対する前記第1の注入エネルギの比が10〜40%の範囲にある、請求項15に記載の方法。
- 前記比が実質的に25%である、請求項16に記載の方法。
- アモルファス化前の注入を実行する前記ステップが、以下の半導体材料:ゲルマニウム、シリコンおよびフッ素のうちのいずれか1つを前記半導体基板に注入する工程を備える、請求項11〜17のいずれか一項に記載の方法。
- 前記欠陥トラップ要素が以下の材料:炭素、窒素およびフッ素のうちのいずれか1つである、請求項15〜17のいずれか一項に記載の方法。
- アモルファス化前の注入を実行する前記ステップが、ゲルマニウムを前記半導体基板に注入する工程を備えており、前記欠陥トラップ要素が炭素であり、前記第2の注入エネルギに対する前記第1の注入エネルギの比が実質的に25%である、請求項16または17のいずれか一項に記載の方法。
- ステップb)、c)およびd)が任意の順序で実行される、請求項15〜17のいずれか一項に記載の方法。
- 前記ドーパントが以下の材料:ホウ素、ヒ素およびリンのうちのいずれか1つである、請求項11〜21のいずれか一項に記載の方法。
- アニーリングプロセスを実行するステップをさらに備える、請求項11〜22のいずれか一項に記載の方法。
- 前記アニーリングプロセスが、急速加熱アニーリングおよび不均衡アニーリングのうちの一方を備える、請求項23に記載の方法。
- イオン注入方法であって、
a)シリコン基板を提供するステップと、
b)前記シリコン基板の表面への法線に対して20〜60°の範囲の角度の注入方向で前記シリコン基板へのゲルマニウムのアモルファス化前の注入を実行するステップと、
d)前記シリコン基板にホウ素ドーパントの注入を実行して浅い接合を提供するステップと、
を備える方法。 - イオン注入方法であって、
シリコン基板を提供するステップと、
第1の注入エネルギで前記半導体基板に第1のアモルファス化前の注入を実行するステップと、
第2の注入エネルギで前記半導体基板に第2のアモルファス化前の注入を実行するステップと、
前記半導体基板にドーパントの注入を実行して浅い接合を提供するステップであって、前記第1の注入エネルギが前記第2の注入エネルギよりも大きいステップと、
を備える方法。 - イオン注入方法であって、
シリコン基板を提供するステップと、
第1の注入用量で前記半導体基板に第1のアモルファス化前の注入を実行するステップと、
第2の注入用量で前記半導体基板に第2のアモルファス化前の注入を実行するステップと、
前記半導体基板にドーパントの注入を実行して浅い接合を提供するステップであって、前記第1の注入用量が前記第2の注入用量よりも大きいステップと、
を備える方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US63665504P | 2004-12-17 | 2004-12-17 | |
PCT/GB2005/004925 WO2006064282A2 (en) | 2004-12-17 | 2005-12-19 | A method of ion implantation to reduce transient enhanced diffusion |
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JP2008524840A true JP2008524840A (ja) | 2008-07-10 |
JP2008524840A5 JP2008524840A5 (ja) | 2012-09-06 |
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Country | Link |
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US (1) | US7482255B2 (ja) |
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CN105762116B (zh) * | 2014-12-16 | 2018-09-18 | 中芯国际集成电路制造(上海)有限公司 | 硅衬底、其制作方法及包括其的ipd器件 |
KR102497125B1 (ko) * | 2015-12-22 | 2023-02-07 | 에스케이하이닉스 주식회사 | 반도체장치 및 그 제조 방법 |
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TW200641978A (en) | 2006-12-01 |
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GB2422246A (en) | 2006-07-19 |
US20060160338A1 (en) | 2006-07-20 |
US7482255B2 (en) | 2009-01-27 |
GB0525780D0 (en) | 2006-01-25 |
WO2006064282A2 (en) | 2006-06-22 |
KR20070093103A (ko) | 2007-09-17 |
WO2006064282A3 (en) | 2006-09-21 |
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