JP2008506246A5 - - Google Patents

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Publication number
JP2008506246A5
JP2008506246A5 JP2006554399A JP2006554399A JP2008506246A5 JP 2008506246 A5 JP2008506246 A5 JP 2008506246A5 JP 2006554399 A JP2006554399 A JP 2006554399A JP 2006554399 A JP2006554399 A JP 2006554399A JP 2008506246 A5 JP2008506246 A5 JP 2008506246A5
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JP
Japan
Prior art keywords
sealing layer
emitting device
light emitting
light
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006554399A
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English (en)
Japanese (ja)
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JP2008506246A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2005/012716 external-priority patent/WO2006006544A1/en
Publication of JP2008506246A publication Critical patent/JP2008506246A/ja
Publication of JP2008506246A5 publication Critical patent/JP2008506246A5/ja
Pending legal-status Critical Current

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JP2006554399A 2004-07-09 2005-07-04 発光装置 Pending JP2008506246A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004203486 2004-07-09
JP2005049321 2005-02-24
PCT/JP2005/012716 WO2006006544A1 (en) 2004-07-09 2005-07-04 Light-emitting device

Publications (2)

Publication Number Publication Date
JP2008506246A JP2008506246A (ja) 2008-02-28
JP2008506246A5 true JP2008506246A5 (enExample) 2008-08-14

Family

ID=34971925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006554399A Pending JP2008506246A (ja) 2004-07-09 2005-07-04 発光装置

Country Status (5)

Country Link
US (1) US20070182323A1 (enExample)
EP (1) EP1766696B1 (enExample)
JP (1) JP2008506246A (enExample)
TW (1) TW200614548A (enExample)
WO (1) WO2006006544A1 (enExample)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7855395B2 (en) 2004-09-10 2010-12-21 Seoul Semiconductor Co., Ltd. Light emitting diode package having multiple molding resins on a light emitting diode die
JP4634810B2 (ja) * 2005-01-20 2011-02-16 信越化学工業株式会社 シリコーン封止型ｌｅｄ
JP2007201354A (ja) * 2006-01-30 2007-08-09 Matsushita Electric Ind Co Ltd 発光モジュール
JP5268082B2 (ja) * 2006-02-22 2013-08-21 シチズン電子株式会社 光半導体装置
KR100738933B1 (ko) * 2006-03-17 2007-07-12 (주)대신엘이디 조명용 ｌｅｄ 모듈
US7755282B2 (en) * 2006-05-12 2010-07-13 Edison Opto Corporation LED structure and fabricating method for the same
JP4665832B2 (ja) * 2006-05-26 2011-04-06 パナソニック電工株式会社 発光装置ならびにそれを用いる白色光源および照明装置
WO2007140651A1 (en) * 2006-06-08 2007-12-13 Hong-Yuan Technology Co., Ltd Light emitting system, light emitting apparatus and forming method thereof
DE102007021042A1 (de) * 2006-07-24 2008-01-31 Samsung Electro-Mechanics Co., Ltd., Suwon Leuchtdiodenmodul für Lichtquellenreihe
JP5271258B2 (ja) * 2006-08-09 2013-08-21 パナソニック株式会社 発光装置
KR101258227B1 (ko) 2006-08-29 2013-04-25 서울반도체 주식회사 발광 소자
KR100828900B1 (ko) * 2006-09-04 2008-05-09 엘지이노텍 주식회사 발광 다이오드 패키지 및 그 제조방법
DE102006045704A1 (de) 2006-09-27 2008-04-03 Osram Opto Semiconductors Gmbh Optisches Element und optoelektronisches Bauelement mit solch einem optischen Element
WO2008043207A1 (fr) * 2006-10-08 2008-04-17 Hong-Yuan Technology Co., Ltd. Système électroluminescent, appareil électroluminescent et procédé de formation associé
JP2010514187A (ja) * 2006-12-21 2010-04-30 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 有形の波長変換器を有する発光装置
JP2008159708A (ja) * 2006-12-21 2008-07-10 Matsushita Electric Works Ltd 発光装置
JP2008166782A (ja) * 2006-12-26 2008-07-17 Seoul Semiconductor Co Ltd 発光素子
JP2008172140A (ja) * 2007-01-15 2008-07-24 Stanley Electric Co Ltd ハウジングと上部の硬質保護材の間に緩衝材を持つ発光装置
DE102007025749A1 (de) * 2007-06-01 2008-12-11 Wacker Chemie Ag Leuchtkörper-Silicon-Formteil
DE102007057710B4 (de) * 2007-09-28 2024-03-14 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierendes Bauelement mit Konversionselement
JP2009176847A (ja) * 2008-01-23 2009-08-06 Citizen Electronics Co Ltd 発光ダイオード
DE102008021661A1 (de) * 2008-04-30 2009-11-05 Ledon Lighting Jennersdorf Gmbh LED-Modul mit Rahmen und Leiterplatte
KR101431711B1 (ko) * 2008-05-07 2014-08-21 삼성전자 주식회사 발광 장치 및 발광 시스템의 제조 방법, 상기 방법을이용하여 제조한 발광 장치 및 발광 시스템
TWI363907B (en) * 2008-08-05 2012-05-11 Au Optronics Corp Backlight module and light emitting diode thereof
US20100033091A1 (en) * 2008-08-08 2010-02-11 Glory Science Co., Ltd. Light emitting unit and method of manufacturing the light emitting unit
JP5284006B2 (ja) * 2008-08-25 2013-09-11 シチズン電子株式会社 発光装置
US8022626B2 (en) * 2008-09-16 2011-09-20 Osram Sylvania Inc. Lighting module
US8405111B2 (en) 2008-11-13 2013-03-26 National University Corporation Nagoya University Semiconductor light-emitting device with sealing material including a phosphor
JP5404009B2 (ja) * 2008-11-20 2014-01-29 シャープ株式会社 発光装置
JP5418592B2 (ja) * 2009-06-22 2014-02-19 日亜化学工業株式会社 発光装置
US20110031516A1 (en) * 2009-08-07 2011-02-10 Koninklijke Philips Electronics N.V. Led with silicone layer and laminated remote phosphor layer
KR101039930B1 (ko) * 2009-10-23 2011-06-09 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
TW201115779A (en) * 2009-10-26 2011-05-01 Gio Optoelectronics Corp Light emitting apparatus
KR101020998B1 (ko) * 2009-11-12 2011-03-09 엘지이노텍 주식회사 발광소자 및 그 제조방법
JP2011155188A (ja) * 2010-01-28 2011-08-11 Konica Minolta Opto Inc 発光ダイオードユニットの製造方法
JP2011155187A (ja) * 2010-01-28 2011-08-11 Konica Minolta Opto Inc 発光ダイオードユニットの製造方法
WO2011149052A1 (ja) * 2010-05-27 2011-12-01 京セラ株式会社 発光装置および照明装置
JP5917796B2 (ja) * 2010-07-14 2016-05-18 三菱電機株式会社 Ｌｅｄパッケージ装置
DE102010046122A1 (de) * 2010-09-21 2012-03-22 Osram Opto Semiconductors Gmbh Elektronisches Bauelement
WO2012044887A1 (en) 2010-09-30 2012-04-05 Performance Indicator, Llc. Photolytically and environmentally stable multilayer structure for high efficiency electromagentic energy conversion and sustained secondary emission
US8664624B2 (en) 2010-09-30 2014-03-04 Performance Indicator Llc Illumination delivery system for generating sustained secondary emission
US20120097985A1 (en) * 2010-10-21 2012-04-26 Wen-Huang Liu Light Emitting Diode (LED) Package And Method Of Fabrication
WO2012147650A1 (ja) * 2011-04-27 2012-11-01 シャープ株式会社 Ｌｅｄモジュール、バックライトユニット及び液晶表示装置
DE102011100028A1 (de) 2011-04-29 2012-10-31 Osram Opto Semiconductors Gmbh Bauelement und Verfahren zur Herstellung eines Bauelements
US9269878B2 (en) 2011-05-27 2016-02-23 Lg Innotek Co., Ltd. Light emitting device and light emitting apparatus
TWI455364B (en) * 2011-06-01 2014-10-01 Light emitting diode package with filter
DE102011105010A1 (de) * 2011-06-20 2012-12-20 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung
US10686107B2 (en) * 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
US10211380B2 (en) 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
WO2013013154A2 (en) 2011-07-21 2013-01-24 Cree, Inc. Light emitter device packages, components, and methods for improved chemical resistance and related methods
US9562171B2 (en) 2011-09-22 2017-02-07 Sensor Electronic Technology, Inc. Ultraviolet device encapsulant
US10490713B2 (en) 2011-09-22 2019-11-26 Sensor Electronic Technology, Inc. Ultraviolet device encapsulant
DE102011086359A1 (de) 2011-11-15 2013-05-16 Tridonic Gmbh & Co. Kg LED-Modul
KR101969334B1 (ko) * 2011-11-16 2019-04-17 엘지이노텍 주식회사 발광 소자 및 이를 구비한 발광 장치
CN103975041B (zh) * 2011-12-16 2017-10-10 皇家飞利浦有限公司 用于led的水玻璃中的磷光体
US8907502B2 (en) * 2012-06-29 2014-12-09 Nitto Denko Corporation Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device
JP6476567B2 (ja) 2013-03-29 2019-03-06 日亜化学工業株式会社 発光装置
JP6221418B2 (ja) * 2013-07-01 2017-11-01 セイコーエプソン株式会社 発光装置および電子機器
JP2015111623A (ja) * 2013-12-06 2015-06-18 株式会社東海理化電機製作所 実装ユニット
US10811572B2 (en) 2014-10-08 2020-10-20 Seoul Semiconductor Co., Ltd. Light emitting device
JP6371725B2 (ja) * 2015-03-13 2018-08-08 株式会社東芝 半導体モジュール
JP6544962B2 (ja) * 2015-03-27 2019-07-17 東レエンジニアリング株式会社 Ｌｅｄモジュールおよびｌｅｄモジュールの製造方法
JP6566754B2 (ja) * 2015-07-15 2019-08-28 キヤノン株式会社 液体吐出ヘッド及びその製造方法
JP2017224707A (ja) * 2016-06-15 2017-12-21 日本電気硝子株式会社 波長変換部材及びその製造方法並びに発光デバイス
KR102817237B1 (ko) * 2016-11-22 2025-06-05 코쿠리츠켄큐카이하츠호진 죠호츠신켄큐키코 심자외광을 방사하는 반도체 발광 소자를 구비하는 발광 모듈
JP7100246B2 (ja) 2018-06-01 2022-07-13 日亜化学工業株式会社 発光装置
CN114397780A (zh) * 2021-12-20 2022-04-26 惠州视维新技术有限公司 一种背光源模组及显示装置
TWI880586B (zh) * 2024-01-12 2025-04-11 榮創能源科技股份有限公司 Led封裝結構及顯示設備

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48102585A (enExample) * 1972-04-04 1973-12-22
US4032963A (en) * 1974-09-03 1977-06-28 Motorola, Inc. Package and method for a semiconductor radiant energy emitting device
US4774434A (en) * 1986-08-13 1988-09-27 Innovative Products, Inc. Lighted display including led's mounted on a flexible circuit board
US6274890B1 (en) * 1997-01-15 2001-08-14 Kabushiki Kaisha Toshiba Semiconductor light emitting device and its manufacturing method
JP3572924B2 (ja) * 1997-03-06 2004-10-06 松下電器産業株式会社 発光装置及びそれを用いた記録装置
JPH11214752A (ja) * 1998-01-21 1999-08-06 Matsushita Electron Corp 半導体発光装置
JP3471220B2 (ja) * 1998-05-27 2003-12-02 株式会社東芝 半導体発光装置
US6204523B1 (en) * 1998-11-06 2001-03-20 Lumileds Lighting, U.S., Llc High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range
JP2001223305A (ja) * 2000-02-10 2001-08-17 Matsushita Electric Ind Co Ltd 樹脂封止半導体装置
US20020084749A1 (en) * 2000-12-28 2002-07-04 Ayala Raul E. UV reflecting materials for LED lamps using UV-emitting diodes
AT410266B (de) * 2000-12-28 2003-03-25 Tridonic Optoelectronics Gmbh Lichtquelle mit einem lichtemittierenden element
JP2002299699A (ja) * 2001-03-30 2002-10-11 Sumitomo Electric Ind Ltd 発光装置およびその製造方法
JP2002314143A (ja) * 2001-04-09 2002-10-25 Toshiba Corp 発光装置
WO2003001612A1 (fr) * 2001-06-20 2003-01-03 Nichia Corporation Dispositif a semi-conducteurs et procede de fabrication
US6734465B1 (en) * 2001-11-19 2004-05-11 Nanocrystals Technology Lp Nanocrystalline based phosphors and photonic structures for solid state lighting
US6734462B1 (en) * 2001-12-07 2004-05-11 The United States Of America As Represented By The Secretary Of The Army Silicon carbide power devices having increased voltage blocking capabilities
DE10214119A1 (de) * 2002-03-28 2003-10-23 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
JP2004235261A (ja) * 2003-01-28 2004-08-19 Matsushita Electric Works Ltd 光学系装置及びその製造方法
KR100567559B1 (ko) * 2002-07-25 2006-04-05 마츠시다 덴코 가부시키가이샤 광전소자부품
JP4241184B2 (ja) * 2002-07-25 2009-03-18 パナソニック電工株式会社 光電素子部品
DE10261428B8 (de) * 2002-12-30 2012-09-20 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiter-Bauelement mit mehrfachen Lumineszenz-Konversionselementen
JP4307094B2 (ja) * 2003-02-04 2009-08-05 パナソニック株式会社 Ｌｅｄ光源、ｌｅｄ照明装置、およびｌｅｄ表示装置
US7029935B2 (en) * 2003-09-09 2006-04-18 Cree, Inc. Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same
US7250715B2 (en) * 2004-02-23 2007-07-31 Philips Lumileds Lighting Company, Llc Wavelength converted semiconductor light emitting devices

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