JP2005252219A5 - - Google Patents

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Publication number
JP2005252219A5
JP2005252219A5 JP2004223889A JP2004223889A JP2005252219A5 JP 2005252219 A5 JP2005252219 A5 JP 2005252219A5 JP 2004223889 A JP2004223889 A JP 2004223889A JP 2004223889 A JP2004223889 A JP 2004223889A JP 2005252219 A5 JP2005252219 A5 JP 2005252219A5
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JP
Japan
Prior art keywords
light
light emitting
translucent
emitting element
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2004223889A
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English (en)
Japanese (ja)
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JP2005252219A (ja
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Priority to JP2004223889A priority Critical patent/JP2005252219A/ja
Priority claimed from JP2004223889A external-priority patent/JP2005252219A/ja
Priority to US11/050,432 priority patent/US7304326B2/en
Publication of JP2005252219A publication Critical patent/JP2005252219A/ja
Publication of JP2005252219A5 publication Critical patent/JP2005252219A5/ja
Withdrawn legal-status Critical Current

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JP2004223889A 2004-02-06 2004-07-30 発光装置及び封止部材 Withdrawn JP2005252219A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004223889A JP2005252219A (ja) 2004-02-06 2004-07-30 発光装置及び封止部材
US11/050,432 US7304326B2 (en) 2004-02-06 2005-02-04 Light emitting device and sealing material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004031305 2004-02-06
JP2004223889A JP2005252219A (ja) 2004-02-06 2004-07-30 発光装置及び封止部材

Publications (2)

Publication Number Publication Date
JP2005252219A JP2005252219A (ja) 2005-09-15
JP2005252219A5 true JP2005252219A5 (enExample) 2006-11-02

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Family Applications (1)

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JP2004223889A Withdrawn JP2005252219A (ja) 2004-02-06 2004-07-30 発光装置及び封止部材

Country Status (2)

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US (1) US7304326B2 (enExample)
JP (1) JP2005252219A (enExample)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100693969B1 (ko) * 2003-03-10 2007-03-12 도요다 고세이 가부시키가이샤 고체 소자 디바이스 및 그 제조 방법
WO2006054228A2 (en) * 2004-11-18 2006-05-26 Koninklijke Philips Electronics N.V. Illuminator and method for producing such illuminator
US20060171152A1 (en) * 2005-01-20 2006-08-03 Toyoda Gosei Co., Ltd. Light emitting device and method of making the same
US20060198008A1 (en) * 2005-03-07 2006-09-07 Micron Technology, Inc. Formation of micro lens by using flowable oxide deposition
US8076680B2 (en) * 2005-03-11 2011-12-13 Seoul Semiconductor Co., Ltd. LED package having an array of light emitting cells coupled in series
JP2007027278A (ja) * 2005-07-13 2007-02-01 Shinko Electric Ind Co Ltd 半導体装置および半導体装置の製造方法
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
US8373195B2 (en) 2006-04-12 2013-02-12 SemiLEDs Optoelectronics Co., Ltd. Light-emitting diode lamp with low thermal resistance
US7863639B2 (en) * 2006-04-12 2011-01-04 Semileds Optoelectronics Co. Ltd. Light-emitting diode lamp with low thermal resistance
KR100764391B1 (ko) * 2006-04-25 2007-10-05 삼성전기주식회사 발광 다이오드 모듈
KR100731678B1 (ko) * 2006-05-08 2007-06-22 서울반도체 주식회사 칩형 발광 다이오드 패키지 및 그것을 갖는 발광 장치
JP2007311663A (ja) * 2006-05-19 2007-11-29 Sharp Corp 発光装置の製造方法、発光装置、および発光装置の製造装置
TWI321857B (en) * 2006-07-21 2010-03-11 Epistar Corp A light emitting device
TWI418054B (zh) * 2006-08-08 2013-12-01 Ｌｇ電子股份有限公司 發光裝置封裝與製造此封裝之方法
US9111950B2 (en) 2006-09-28 2015-08-18 Philips Lumileds Lighting Company, Llc Process for preparing a semiconductor structure for mounting
KR100772113B1 (ko) * 2006-09-28 2007-11-01 주식회사 하이닉스반도체 입체 인쇄회로 기판
US7687823B2 (en) * 2006-12-26 2010-03-30 Nichia Corporation Light-emitting apparatus and method of producing the same
TWI329934B (en) * 2007-01-17 2010-09-01 Chi Mei Lighting Tech Corp Lead frame structure of light emitting diode
US7968900B2 (en) * 2007-01-19 2011-06-28 Cree, Inc. High performance LED package
EP2122694A2 (en) * 2007-03-12 2009-11-25 Philips Intellectual Property & Standards GmbH Illumination system comprising a compound with low thermal expansion coefficient
JP2008251664A (ja) * 2007-03-29 2008-10-16 Toshiba Lighting & Technology Corp 照明装置
JP4435204B2 (ja) 2007-05-17 2010-03-17 株式会社東芝 無線通信装置および方法
JP4932606B2 (ja) * 2007-06-06 2012-05-16 株式会社フジクラ 光送受信装置
US7791096B2 (en) * 2007-06-08 2010-09-07 Koninklijke Philips Electronics N.V. Mount for a semiconductor light emitting device
KR100880638B1 (ko) 2007-07-06 2009-01-30 엘지전자 주식회사 발광 소자 패키지
US20090032827A1 (en) * 2007-07-30 2009-02-05 Philips Lumileds Lighting Company, Llc Concave Wide Emitting Lens for LED Useful for Backlighting
US8704265B2 (en) * 2007-08-27 2014-04-22 Lg Electronics Inc. Light emitting device package and lighting apparatus using the same
US10008637B2 (en) 2011-12-06 2018-06-26 Cree, Inc. Light emitter devices and methods with reduced dimensions and improved light output
US20110260192A1 (en) * 2008-10-01 2011-10-27 Chang Hoon Kwak Light-emitting diode package using a liquid crystal polymer
TWI385834B (zh) * 2009-02-06 2013-02-11 沈育濃 Light emitting diode chip package and manufacturing method thereof
US8530990B2 (en) * 2009-07-20 2013-09-10 Sunpower Corporation Optoelectronic device with heat spreader unit
JP2011082339A (ja) * 2009-10-07 2011-04-21 Nitto Denko Corp 光半導体封止用キット
JP5744386B2 (ja) * 2009-10-07 2015-07-08 日東電工株式会社 光半導体封止材
US8203161B2 (en) * 2009-11-23 2012-06-19 Koninklijke Philips Electronics N.V. Wavelength converted semiconductor light emitting device
KR101163850B1 (ko) * 2009-11-23 2012-07-09 엘지이노텍 주식회사 발광 소자 패키지
US8541793B2 (en) * 2010-02-04 2013-09-24 Yu-Nung Shen Light emitting diode device and method for fabricating the same
JP5716010B2 (ja) 2010-03-11 2015-05-13 株式会社東芝 発光装置
CN102414851B (zh) * 2010-03-11 2016-06-22 松下知识产权经营株式会社 发光模块、光源装置、液晶显示装置和发光模块的制造方法
JP5515992B2 (ja) * 2010-04-07 2014-06-11 日亜化学工業株式会社 発光装置
JP5939977B2 (ja) * 2010-04-09 2016-06-29 ローム株式会社 Ｌｅｄモジュール
DE102010021791A1 (de) 2010-05-27 2011-12-01 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements und eines Verbunds
US8563849B2 (en) 2010-08-03 2013-10-22 Sunpower Corporation Diode and heat spreader for solar module
JP5049382B2 (ja) * 2010-12-21 2012-10-17 パナソニック株式会社 発光装置及びそれを用いた照明装置
US8697541B1 (en) * 2010-12-24 2014-04-15 Ananda H. Kumar Methods and structures for preparing single crystal silicon wafers for use as substrates for epitaxial growth of crack-free gallium nitride films and devices
US10147853B2 (en) 2011-03-18 2018-12-04 Cree, Inc. Encapsulant with index matched thixotropic agent
JP5809440B2 (ja) * 2011-05-10 2015-11-10 ローム株式会社 Ｌｅｄモジュール
US10211380B2 (en) 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
WO2013013154A2 (en) 2011-07-21 2013-01-24 Cree, Inc. Light emitter device packages, components, and methods for improved chemical resistance and related methods
US10686107B2 (en) 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
US9117941B2 (en) * 2011-09-02 2015-08-25 King Dragon International Inc. LED package and method of the same
US20150001570A1 (en) * 2011-09-02 2015-01-01 King Dragon International Inc. LED Package and Method of the Same
US9562171B2 (en) 2011-09-22 2017-02-07 Sensor Electronic Technology, Inc. Ultraviolet device encapsulant
US10490713B2 (en) 2011-09-22 2019-11-26 Sensor Electronic Technology, Inc. Ultraviolet device encapsulant
US9496466B2 (en) 2011-12-06 2016-11-15 Cree, Inc. Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction
JP5277326B2 (ja) * 2012-02-13 2013-08-28 株式会社フジクラ 光送受信装置の製造方法
US9240530B2 (en) * 2012-02-13 2016-01-19 Cree, Inc. Light emitter devices having improved chemical and physical resistance and related methods
US9343441B2 (en) * 2012-02-13 2016-05-17 Cree, Inc. Light emitter devices having improved light output and related methods
US20130240934A1 (en) 2012-03-14 2013-09-19 Samsung Electronics Co., Ltd. Light emitting element package and method of manufacturing the same
US10468565B2 (en) 2012-06-11 2019-11-05 Cree, Inc. LED package with multiple element light source and encapsulant having curved and/or planar surfaces
US9887327B2 (en) 2012-06-11 2018-02-06 Cree, Inc. LED package with encapsulant having curved and planar surfaces
US9818919B2 (en) 2012-06-11 2017-11-14 Cree, Inc. LED package with multiple element light source and encapsulant having planar surfaces
US10424702B2 (en) 2012-06-11 2019-09-24 Cree, Inc. Compact LED package with reflectivity layer
US8636198B1 (en) 2012-09-28 2014-01-28 Sunpower Corporation Methods and structures for forming and improving solder joint thickness and planarity control features for solar cells
KR102019499B1 (ko) * 2012-11-05 2019-09-06 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 시스템
US9461024B2 (en) 2013-08-01 2016-10-04 Cree, Inc. Light emitter devices and methods for light emitting diode (LED) chips
USD758976S1 (en) 2013-08-08 2016-06-14 Cree, Inc. LED package
JP6195760B2 (ja) * 2013-08-16 2017-09-13 シチズン電子株式会社 Ｌｅｄ発光装置
US20150137163A1 (en) * 2013-11-13 2015-05-21 Nanoco Technologies Ltd. LED Cap Containing Quantum Dot Phosphors
TW201616689A (zh) * 2014-06-25 2016-05-01 皇家飛利浦有限公司 經封裝之波長轉換發光裝置
USD790486S1 (en) 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD777122S1 (en) 2015-02-27 2017-01-24 Cree, Inc. LED package
CN106016013A (zh) * 2015-03-26 2016-10-12 艾泰库思株式会社 带状led灯
USD783547S1 (en) 2015-06-04 2017-04-11 Cree, Inc. LED package
JP6619641B2 (ja) * 2015-12-14 2019-12-11 株式会社小糸製作所 光源ユニット、及び、それを用いた灯具
CN106972093B (zh) * 2016-01-13 2019-01-08 光宝光电(常州)有限公司 发光二极管封装结构
DE102016106896A1 (de) * 2016-04-14 2017-10-19 Osram Opto Semiconductors Gmbh Lichtemittierendes Bauteil
TWI683452B (zh) * 2017-04-12 2020-01-21 聯京光電股份有限公司 光電封裝體
JP2019021768A (ja) * 2017-07-18 2019-02-07 株式会社デンソー 電子装置
US10797207B2 (en) 2018-07-30 2020-10-06 Lumileds Llc Light emitting device with porous structure to enhance color point shift as a function of drive current
US10756242B2 (en) 2018-07-30 2020-08-25 Lumileds Llc Light-emitting device with light scatter tuning to control color shift

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05315652A (ja) 1992-04-02 1993-11-26 Nec Corp 光半導体装置
US6020067A (en) * 1997-09-09 2000-02-01 Kasei Optonix, Ltd. Phosphor having surface coated with a quaternary salt-containing compound
US6683325B2 (en) * 1999-01-26 2004-01-27 Patent-Treuhand-Gesellschaft-für Elektrische Glühlampen mbH Thermal expansion compensated opto-electronic semiconductor element, particularly ultraviolet (UV) light emitting diode, and method of its manufacture
JP3721935B2 (ja) * 2000-04-19 2005-11-30 住友電気工業株式会社 光学装置
JP2002050797A (ja) * 2000-07-31 2002-02-15 Toshiba Corp 半導体励起蛍光体発光装置およびその製造方法
JP4101468B2 (ja) 2001-04-09 2008-06-18 豊田合成株式会社 発光装置の製造方法
JP2003268202A (ja) * 2002-03-18 2003-09-25 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂成形材料及び半導体装置
JP2004214249A (ja) * 2002-12-27 2004-07-29 Renesas Technology Corp 半導体モジュール
TW200427111A (en) * 2003-03-12 2004-12-01 Shinetsu Chemical Co Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device
US20050280016A1 (en) * 2004-06-17 2005-12-22 Mok Thye L PCB-based surface mount LED device with silicone-based encapsulation structure

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