JP2006073547A5 - - Google Patents

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Publication number
JP2006073547A5
JP2006073547A5 JP2004251240A JP2004251240A JP2006073547A5 JP 2006073547 A5 JP2006073547 A5 JP 2006073547A5 JP 2004251240 A JP2004251240 A JP 2004251240A JP 2004251240 A JP2004251240 A JP 2004251240A JP 2006073547 A5 JP2006073547 A5 JP 2006073547A5
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JP
Japan
Prior art keywords
substrate
glass frame
hole
led
transparent resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004251240A
Other languages
English (en)
Japanese (ja)
Other versions
JP4547569B2 (ja
JP2006073547A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004251240A priority Critical patent/JP4547569B2/ja
Priority claimed from JP2004251240A external-priority patent/JP4547569B2/ja
Priority to CNB2005100935363A priority patent/CN100521264C/zh
Priority to US11/214,805 priority patent/US20060049422A1/en
Publication of JP2006073547A publication Critical patent/JP2006073547A/ja
Publication of JP2006073547A5 publication Critical patent/JP2006073547A5/ja
Application granted granted Critical
Publication of JP4547569B2 publication Critical patent/JP4547569B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004251240A 2004-08-31 2004-08-31 表面実装型ｌｅｄ Expired - Fee Related JP4547569B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004251240A JP4547569B2 (ja) 2004-08-31 2004-08-31 表面実装型ｌｅｄ
CNB2005100935363A CN100521264C (zh) 2004-08-31 2005-08-26 表面安装型led
US11/214,805 US20060049422A1 (en) 2004-08-31 2005-08-31 Surface mount LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004251240A JP4547569B2 (ja) 2004-08-31 2004-08-31 表面実装型ｌｅｄ

Publications (3)

Publication Number Publication Date
JP2006073547A JP2006073547A (ja) 2006-03-16
JP2006073547A5 true JP2006073547A5 (enExample) 2007-09-20
JP4547569B2 JP4547569B2 (ja) 2010-09-22

Family

ID=35995312

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004251240A Expired - Fee Related JP4547569B2 (ja) 2004-08-31 2004-08-31 表面実装型ｌｅｄ

Country Status (3)

Country Link
US (1) US20060049422A1 (enExample)
JP (1) JP4547569B2 (enExample)
CN (1) CN100521264C (enExample)

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US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
TW200926440A (en) 2007-12-12 2009-06-16 Advanced Optoelectronic Tech Light emitting diode and manufacturing method thereof
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
CN101465397B (zh) * 2007-12-20 2013-07-03 展晶科技(深圳)有限公司 发光二极管及其制造方法
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
US8049230B2 (en) 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
TWD133319S (zh) * 2008-06-20 2010-02-11 三星電機股份有限公司 發光二極體
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
USD635525S1 (en) 2009-04-22 2011-04-05 Cree, Inc. LED chip
US8415692B2 (en) 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US8598809B2 (en) 2009-08-19 2013-12-03 Cree, Inc. White light color changing solid state lighting and methods
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CN101880899B (zh) * 2010-07-12 2012-09-26 中山市琪朗灯饰厂有限公司 一种灯饰配件及制造灯饰配件的电铸沉积方法
JPWO2012014853A1 (ja) * 2010-07-26 2013-09-12 旭硝子株式会社 発光素子用基板、発光装置及び発光素子用基板の製造方法
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CN102646783A (zh) * 2011-02-22 2012-08-22 盈胜科技股份有限公司 可防止湿气侵入的包设有荧光层的光学透镜组
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CN103503182A (zh) 2012-01-23 2014-01-08 松下电器产业株式会社 氮化物半导体发光装置
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