JP2005259972A5 - - Google Patents

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Publication number
JP2005259972A5
JP2005259972A5 JP2004069311A JP2004069311A JP2005259972A5 JP 2005259972 A5 JP2005259972 A5 JP 2005259972A5 JP 2004069311 A JP2004069311 A JP 2004069311A JP 2004069311 A JP2004069311 A JP 2004069311A JP 2005259972 A5 JP2005259972 A5 JP 2005259972A5
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JP
Japan
Prior art keywords
frame
shaped member
transparent resin
led
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004069311A
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English (en)
Japanese (ja)
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JP2005259972A (ja
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Publication date
Application filed filed Critical
Priority to JP2004069311A priority Critical patent/JP2005259972A/ja
Priority claimed from JP2004069311A external-priority patent/JP2005259972A/ja
Publication of JP2005259972A publication Critical patent/JP2005259972A/ja
Publication of JP2005259972A5 publication Critical patent/JP2005259972A5/ja
Pending legal-status Critical Current

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JP2004069311A 2004-03-11 2004-03-11 表面実装型ｌｅｄ Pending JP2005259972A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004069311A JP2005259972A (ja) 2004-03-11 2004-03-11 表面実装型ｌｅｄ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004069311A JP2005259972A (ja) 2004-03-11 2004-03-11 表面実装型ｌｅｄ

Publications (2)

Publication Number Publication Date
JP2005259972A JP2005259972A (ja) 2005-09-22
JP2005259972A5 true JP2005259972A5 (enExample) 2007-04-12

Family

ID=35085407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004069311A Pending JP2005259972A (ja) 2004-03-11 2004-03-11 表面実装型ｌｅｄ

Country Status (1)

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JP (1) JP2005259972A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5262374B2 (ja) * 2004-11-30 2013-08-14 日亜化学工業株式会社 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP4608294B2 (ja) * 2004-11-30 2011-01-12 日亜化学工業株式会社 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
EP2768031B1 (en) 2005-08-04 2021-02-17 Nichia Corporation Light-emitting device
US7675145B2 (en) 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US9502624B2 (en) 2006-05-18 2016-11-22 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
CN100407462C (zh) * 2006-05-25 2008-07-30 吴质朴 一种发光二极管的封装方法
JP4968258B2 (ja) * 2006-06-02 2012-07-04 日立化成工業株式会社 光半導体素子搭載用パッケージおよびこれを用いた光半導体装置
JP4611937B2 (ja) * 2006-06-07 2011-01-12 日亜化学工業株式会社 表面実装型発光装置及びその製造方法
JP2007329219A (ja) * 2006-06-07 2007-12-20 Nichia Chem Ind Ltd 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
WO2008081696A1 (ja) 2006-12-28 2008-07-10 Nichia Corporation 発光装置、パッケージ、発光装置の製造方法、パッケージの製造方法及びパッケージ製造用金型
JP5380774B2 (ja) 2006-12-28 2014-01-08 日亜化学工業株式会社 表面実装型側面発光装置及びその製造方法
JP5470680B2 (ja) 2007-02-06 2014-04-16 日亜化学工業株式会社 発光装置及びその製造方法並びに成形体
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
DE102007021904A1 (de) 2007-02-28 2008-09-04 Osram Opto Semiconductors Gmbh Optoelektronische Vorrichtung mit Gehäusekörper
US8610143B2 (en) 2007-03-12 2013-12-17 Nichia Corporation High output power light emitting device and package used therefor
JP5233170B2 (ja) 2007-05-31 2013-07-10 日亜化学工業株式会社 発光装置、発光装置を構成する樹脂成形体及びそれらの製造方法
US7968899B2 (en) 2007-08-27 2011-06-28 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. LED light source having improved resistance to thermal cycling
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
KR101488448B1 (ko) 2007-12-06 2015-02-02 서울반도체 주식회사 Ｌｅｄ 패키지 및 그 제조방법
JP5628475B2 (ja) * 2008-07-22 2014-11-19 日亜化学工業株式会社 表面実装型発光装置の製造方法
JP2008252148A (ja) * 2008-07-22 2008-10-16 Nichia Corp 発光装置用のパッケージ及びその製造方法
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
JP2011171345A (ja) * 2010-02-16 2011-09-01 Stanley Electric Co Ltd 発光装置及びその製造方法
KR20110136676A (ko) * 2010-06-14 2011-12-21 삼성엘이디 주식회사 양자점을 이용한 발광소자 패키지, 조광 장치 및 디스플레이 장치
JP2013120821A (ja) * 2011-12-07 2013-06-17 Citizen Holdings Co Ltd 発光デバイス
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02288274A (ja) * 1989-04-27 1990-11-28 Unitika Ltd 耐ハンダ性発光ダイオード用リフレクター
JP4101468B2 (ja) * 2001-04-09 2008-06-18 豊田合成株式会社 発光装置の製造方法
JP4447806B2 (ja) * 2001-09-26 2010-04-07 スタンレー電気株式会社 発光装置
JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate

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