JP2005259972A - 表面実装型ｌｅｄ - Google Patents

表面実装型ｌｅｄ Download PDF

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Publication number
JP2005259972A
JP2005259972A JP2004069311A JP2004069311A JP2005259972A JP 2005259972 A JP2005259972 A JP 2005259972A JP 2004069311 A JP2004069311 A JP 2004069311A JP 2004069311 A JP2004069311 A JP 2004069311A JP 2005259972 A JP2005259972 A JP 2005259972A
Authority
JP
Japan
Prior art keywords
frame
shaped member
transparent resin
led
led chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004069311A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005259972A5 (enExample
Inventor
Yasumasa Morita
康正 森田
Isato Oba
勇人 大場
Konosuke Nakada
幸之助 中田
Minoru Tanaka
稔 田中
Akifumi Ochiai
昭文 落合
Kazunobu Sumi
和宣 角
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2004069311A priority Critical patent/JP2005259972A/ja
Publication of JP2005259972A publication Critical patent/JP2005259972A/ja
Publication of JP2005259972A5 publication Critical patent/JP2005259972A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2004069311A 2004-03-11 2004-03-11 表面実装型ｌｅｄ Pending JP2005259972A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004069311A JP2005259972A (ja) 2004-03-11 2004-03-11 表面実装型ｌｅｄ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004069311A JP2005259972A (ja) 2004-03-11 2004-03-11 表面実装型ｌｅｄ

Publications (2)

Publication Number Publication Date
JP2005259972A true JP2005259972A (ja) 2005-09-22
JP2005259972A5 JP2005259972A5 (enExample) 2007-04-12

Family

ID=35085407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004069311A Pending JP2005259972A (ja) 2004-03-11 2004-03-11 表面実装型ｌｅｄ

Country Status (1)

Country Link
JP (1) JP2005259972A (enExample)

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006156704A (ja) * 2004-11-30 2006-06-15 Nichia Chem Ind Ltd 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
WO2007135707A1 (ja) * 2006-05-18 2007-11-29 Nichia Corporation 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP2007329219A (ja) * 2006-06-07 2007-12-20 Nichia Chem Ind Ltd 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP2007329249A (ja) * 2006-06-07 2007-12-20 Nichia Chem Ind Ltd 表面実装型発光装置及びその製造方法
WO2008081696A1 (ja) 2006-12-28 2008-07-10 Nichia Corporation 発光装置、パッケージ、発光装置の製造方法、パッケージの製造方法及びパッケージ製造用金型
CN100407462C (zh) * 2006-05-25 2008-07-30 吴质朴 一种发光二极管的封装方法
WO2008111504A1 (ja) * 2007-03-12 2008-09-18 Nichia Corporation 高出力発光装置及びそれに用いるパッケージ
JP2008252135A (ja) * 2004-11-30 2008-10-16 Nichia Corp 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP2008252148A (ja) * 2008-07-22 2008-10-16 Nichia Corp 発光装置用のパッケージ及びその製造方法
JP2008263235A (ja) * 2008-07-22 2008-10-30 Nichia Corp 表面実装型発光装置の製造方法
JP2009141322A (ja) * 2007-08-27 2009-06-25 Avago Technologies Ecbu Ip (Singapore) Pte Ltd 改良された熱循環耐性を有するｌｅｄ光源
JP2010519775A (ja) * 2007-02-28 2010-06-03 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ケーシングボディを有するオプトエレクトロニクス装置
US7777417B2 (en) 2007-05-31 2010-08-17 Nichia Corporation Light emitting apparatus, resin molding device composing light emitting device, method for producing the same
JP2011507228A (ja) * 2007-12-06 2011-03-03 ソウル セミコンダクター カンパニー リミテッド Ｌｅｄパッケージ及びその製造方法
JP2011171345A (ja) * 2010-02-16 2011-09-01 Stanley Electric Co Ltd 発光装置及びその製造方法
JP2012004567A (ja) * 2010-06-14 2012-01-05 Samsung Led Co Ltd 量子点を利用した発光素子パッケージ、照光装置及びディスプレイ装置
JP2013120821A (ja) * 2011-12-07 2013-06-17 Citizen Holdings Co Ltd 発光デバイス
US8575632B2 (en) 2005-08-04 2013-11-05 Nichia Corporation Light-emitting device, method for manufacturing same, molded body and sealing member
US8802459B2 (en) 2006-12-28 2014-08-12 Nichia Corporation Surface mount lateral light emitting apparatus and fabrication method thereof
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US8900710B2 (en) 2007-02-06 2014-12-02 Nichia Corporation Light-emitting device, method for manufacturing same, and molded part
US9035439B2 (en) 2006-03-28 2015-05-19 Cree Huizhou Solid State Lighting Company Limited Apparatus, system and method for use in mounting electronic elements
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US9722158B2 (en) 2009-01-14 2017-08-01 Cree Huizhou Solid State Lighting Company Limited Aligned multiple emitter package
US20170263832A1 (en) * 2006-06-02 2017-09-14 Hitachi Chemical Company, Ltd. Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
US10892383B2 (en) 2007-10-31 2021-01-12 Cree, Inc. Light emitting diode package and method for fabricating same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02288274A (ja) * 1989-04-27 1990-11-28 Unitika Ltd 耐ハンダ性発光ダイオード用リフレクター
JP2002314142A (ja) * 2001-04-09 2002-10-25 Toyoda Gosei Co Ltd 発光装置
JP2003101074A (ja) * 2001-09-26 2003-04-04 Stanley Electric Co Ltd 発光装置
JP2003332634A (ja) * 2002-03-06 2003-11-21 Nichia Chem Ind Ltd 半導体装置およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02288274A (ja) * 1989-04-27 1990-11-28 Unitika Ltd 耐ハンダ性発光ダイオード用リフレクター
JP2002314142A (ja) * 2001-04-09 2002-10-25 Toyoda Gosei Co Ltd 発光装置
JP2003101074A (ja) * 2001-09-26 2003-04-04 Stanley Electric Co Ltd 発光装置
JP2003332634A (ja) * 2002-03-06 2003-11-21 Nichia Chem Ind Ltd 半導体装置およびその製造方法

Cited By (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006156704A (ja) * 2004-11-30 2006-06-15 Nichia Chem Ind Ltd 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP2008252136A (ja) * 2004-11-30 2008-10-16 Nichia Corp 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP2008252135A (ja) * 2004-11-30 2008-10-16 Nichia Corp 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
US8803159B2 (en) 2005-08-04 2014-08-12 Nichia Corporation Light-emitting device and method for manufacturing same
US8575632B2 (en) 2005-08-04 2013-11-05 Nichia Corporation Light-emitting device, method for manufacturing same, molded body and sealing member
US9034671B2 (en) 2005-08-04 2015-05-19 Nichia Corporation Light-emitting device and method for manufacturing same
US9035439B2 (en) 2006-03-28 2015-05-19 Cree Huizhou Solid State Lighting Company Limited Apparatus, system and method for use in mounting electronic elements
US10263161B2 (en) 2006-05-18 2019-04-16 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
WO2007135707A1 (ja) * 2006-05-18 2007-11-29 Nichia Corporation 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
US11631790B2 (en) 2006-05-18 2023-04-18 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US10971656B2 (en) 2006-05-18 2021-04-06 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US9502624B2 (en) 2006-05-18 2016-11-22 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US10686102B2 (en) 2006-05-18 2020-06-16 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US9634204B2 (en) 2006-05-18 2017-04-25 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US9929318B2 (en) 2006-05-18 2018-03-27 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
CN100407462C (zh) * 2006-05-25 2008-07-30 吴质朴 一种发光二极管的封装方法
US12317657B2 (en) 2006-06-02 2025-05-27 Shenzhen Jufei Optoelectronics Co., Ltd. Optical semiconductor element mounting package and optical semiconductor device using the same
US10205072B2 (en) * 2006-06-02 2019-02-12 Hitachi Chemical Company, Ltd. Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same
US10326063B2 (en) * 2006-06-02 2019-06-18 Hitachi Chemical Company, Ltd. Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same
US20170263832A1 (en) * 2006-06-02 2017-09-14 Hitachi Chemical Company, Ltd. Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same
US20190252582A1 (en) * 2006-06-02 2019-08-15 Hitachi Chemical Company, Ltd. Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same
US10950767B2 (en) 2006-06-02 2021-03-16 Shenzhen Jufei Optoelectronics Co., Ltd. Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same
US11810778B2 (en) 2006-06-02 2023-11-07 Shenzhen Jufei Optoelectronics Co., Ltd. Optical semiconductor element mounting package and optical semiconductor device using the same
US12426415B2 (en) 2006-06-02 2025-09-23 Shenzhen Jufei Optoelectronics Co., Ltd. Method of manufacturing an optical semiconductor device
JP2007329249A (ja) * 2006-06-07 2007-12-20 Nichia Chem Ind Ltd 表面実装型発光装置及びその製造方法
JP2007329219A (ja) * 2006-06-07 2007-12-20 Nichia Chem Ind Ltd 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
US8802459B2 (en) 2006-12-28 2014-08-12 Nichia Corporation Surface mount lateral light emitting apparatus and fabrication method thereof
WO2008081696A1 (ja) 2006-12-28 2008-07-10 Nichia Corporation 発光装置、パッケージ、発光装置の製造方法、パッケージの製造方法及びパッケージ製造用金型
US8440478B2 (en) 2006-12-28 2013-05-14 Nichia Corporation Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die
US9190588B2 (en) 2006-12-28 2015-11-17 Nichia Corporation Side-view type light emitting apparatus and package
US8217414B2 (en) 2006-12-28 2012-07-10 Nichia Corporation Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die
US9808970B2 (en) 2007-02-06 2017-11-07 Nichia Corporation Light-emitting device, method for manufacturing same, and molded part
US8900710B2 (en) 2007-02-06 2014-12-02 Nichia Corporation Light-emitting device, method for manufacturing same, and molded part
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US8723211B2 (en) 2007-02-28 2014-05-13 Osram Opto Semiconductors Gmbh Optoelectronic device with housing body
JP2010519775A (ja) * 2007-02-28 2010-06-03 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ケーシングボディを有するオプトエレクトロニクス装置
US8610143B2 (en) 2007-03-12 2013-12-17 Nichia Corporation High output power light emitting device and package used therefor
WO2008111504A1 (ja) * 2007-03-12 2008-09-18 Nichia Corporation 高出力発光装置及びそれに用いるパッケージ
JPWO2008111504A1 (ja) * 2007-03-12 2010-06-24 日亜化学工業株式会社 高出力発光装置及びそれに用いるパッケージ
US8344622B2 (en) 2007-05-31 2013-01-01 Nichia Corporation Resin molding device
US7898177B2 (en) 2007-05-31 2011-03-01 Nichia Corporation Light emitting apparatus
US7777417B2 (en) 2007-05-31 2010-08-17 Nichia Corporation Light emitting apparatus, resin molding device composing light emitting device, method for producing the same
US7968899B2 (en) 2007-08-27 2011-06-28 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. LED light source having improved resistance to thermal cycling
JP2009141322A (ja) * 2007-08-27 2009-06-25 Avago Technologies Ecbu Ip (Singapore) Pte Ltd 改良された熱循環耐性を有するｌｅｄ光源
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US11791442B2 (en) 2007-10-31 2023-10-17 Creeled, Inc. Light emitting diode package and method for fabricating same
US10892383B2 (en) 2007-10-31 2021-01-12 Cree, Inc. Light emitting diode package and method for fabricating same
US9698319B2 (en) 2007-12-06 2017-07-04 Seoul Semiconductor Co., Ltd. LED package with lead terminals having protrusions of differing widths and method for fabricating the same
JP2011507228A (ja) * 2007-12-06 2011-03-03 ソウル セミコンダクター カンパニー リミテッド Ｌｅｄパッケージ及びその製造方法
JP2008263235A (ja) * 2008-07-22 2008-10-30 Nichia Corp 表面実装型発光装置の製造方法
JP2008252148A (ja) * 2008-07-22 2008-10-16 Nichia Corp 発光装置用のパッケージ及びその製造方法
US9722158B2 (en) 2009-01-14 2017-08-01 Cree Huizhou Solid State Lighting Company Limited Aligned multiple emitter package
JP2011171345A (ja) * 2010-02-16 2011-09-01 Stanley Electric Co Ltd 発光装置及びその製造方法
JP2012004567A (ja) * 2010-06-14 2012-01-05 Samsung Led Co Ltd 量子点を利用した発光素子パッケージ、照光装置及びディスプレイ装置
JP2013120821A (ja) * 2011-12-07 2013-06-17 Citizen Holdings Co Ltd 発光デバイス
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces

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