JP2008505487A5 - - Google Patents

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Publication number
JP2008505487A5
JP2008505487A5 JP2007519217A JP2007519217A JP2008505487A5 JP 2008505487 A5 JP2008505487 A5 JP 2008505487A5 JP 2007519217 A JP2007519217 A JP 2007519217A JP 2007519217 A JP2007519217 A JP 2007519217A JP 2008505487 A5 JP2008505487 A5 JP 2008505487A5
Authority
JP
Japan
Prior art keywords
region
conductivity type
conductive layer
electrically connected
schottky junction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007519217A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008505487A (ja
JP4975618B2 (ja
Filing date
Publication date
Priority claimed from US10/881,678 external-priority patent/US7355260B2/en
Application filed filed Critical
Publication of JP2008505487A publication Critical patent/JP2008505487A/ja
Publication of JP2008505487A5 publication Critical patent/JP2008505487A5/ja
Application granted granted Critical
Publication of JP4975618B2 publication Critical patent/JP4975618B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2007519217A 2004-06-30 2005-05-19 ショットキー接合を有するデバイス Expired - Lifetime JP4975618B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/881,678 2004-06-30
US10/881,678 US7355260B2 (en) 2004-06-30 2004-06-30 Schottky device and method of forming
PCT/US2005/017704 WO2006007143A2 (en) 2004-06-30 2005-05-19 Schottky device and method of forming

Publications (3)

Publication Number Publication Date
JP2008505487A JP2008505487A (ja) 2008-02-21
JP2008505487A5 true JP2008505487A5 (enExample) 2008-07-10
JP4975618B2 JP4975618B2 (ja) 2012-07-11

Family

ID=35512975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007519217A Expired - Lifetime JP4975618B2 (ja) 2004-06-30 2005-05-19 ショットキー接合を有するデバイス

Country Status (6)

Country Link
US (1) US7355260B2 (enExample)
JP (1) JP4975618B2 (enExample)
KR (1) KR20070026690A (enExample)
CN (1) CN100576569C (enExample)
TW (1) TWI358835B (enExample)
WO (1) WO2006007143A2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6704143B1 (en) 2000-10-23 2004-03-09 Adc Telecommunications, Inc. Method and apparatus for adjusting an optical element to achieve a precise length
US7550804B2 (en) * 2006-03-27 2009-06-23 Freescale Semiconductor, Inc. Semiconductor device and method for forming the same
US7777257B2 (en) * 2007-02-14 2010-08-17 Freescale Semiconductor, Inc. Bipolar Schottky diode and method
US8168466B2 (en) * 2007-06-01 2012-05-01 Semiconductor Components Industries, Llc Schottky diode and method therefor
US7781859B2 (en) * 2008-03-24 2010-08-24 Taiwan Semiconductor Manufacturing Company, Ltd. Schottky diode structures having deep wells for improving breakdown voltages
US8324705B2 (en) * 2008-05-27 2012-12-04 Taiwan Semiconductor Manufacturing Company, Ltd. Schottky diodes having low-voltage and high-concentration rings
US7915704B2 (en) * 2009-01-26 2011-03-29 Freescale Semiconductor, Inc. Schottky diode
US7972913B2 (en) * 2009-05-28 2011-07-05 Freescale Semiconductor, Inc. Method for forming a Schottky diode
CN102347373B (zh) * 2010-08-03 2013-04-17 旺宏电子股份有限公司 肖特基二极管
US8878329B2 (en) * 2010-09-17 2014-11-04 United Microelectronics Corp. High voltage device having Schottky diode
CN102842596B (zh) * 2011-06-22 2015-05-20 旺宏电子股份有限公司 半导体结构及其制造方法
JP6087520B2 (ja) * 2011-07-13 2017-03-01 キヤノン株式会社 ダイオード素子及び検出素子
US8592274B2 (en) * 2012-03-27 2013-11-26 Alpha And Omega Semiconductor Incorporated LDMOS with accumulation enhancement implant
EP3460856B1 (en) * 2017-09-26 2020-12-02 ams AG Schottky barrier diode with improved schottky contact for high voltages

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6050062B2 (ja) * 1982-03-19 1985-11-06 三菱電機株式会社 半導体集積回路装置
JPS5936264U (ja) * 1982-07-27 1984-03-07 サンケン電気株式会社 シヨツトキバリア半導体装置
JPS61296760A (ja) * 1985-06-26 1986-12-27 Hitachi Ltd 半導体装置
US4989058A (en) 1985-11-27 1991-01-29 North American Philips Corp. Fast switching lateral insulated gate transistors
US5614755A (en) 1993-04-30 1997-03-25 Texas Instruments Incorporated High voltage Shottky diode
US5483087A (en) 1994-07-08 1996-01-09 International Rectifier Corporation Bidirectional thyristor with MOS turn-off capability with a single gate
US5818084A (en) 1996-05-15 1998-10-06 Siliconix Incorporated Pseudo-Schottky diode
US6784489B1 (en) * 1997-03-28 2004-08-31 Stmicroelectronics, Inc. Method of operating a vertical DMOS transistor with schottky diode body structure
JP2001185740A (ja) * 1999-12-24 2001-07-06 Sanyo Electric Co Ltd 半導体装置とその製造方法
US6617642B1 (en) * 2000-02-23 2003-09-09 Tripath Technology, Inc. Field effect transistor structure for driving inductive loads
US6552406B1 (en) 2000-10-03 2003-04-22 International Business Machines Corporation SiGe transistor, varactor and p-i-n velocity saturated ballasting element for BiCMOS peripheral circuits and ESD networks
JP4097417B2 (ja) 2001-10-26 2008-06-11 株式会社ルネサステクノロジ 半導体装置
JP4277496B2 (ja) * 2001-11-21 2009-06-10 富士電機デバイステクノロジー株式会社 半導体装置

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