JP2008156475A5 - - Google Patents
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- Publication number
- JP2008156475A5 JP2008156475A5 JP2006346866A JP2006346866A JP2008156475A5 JP 2008156475 A5 JP2008156475 A5 JP 2008156475A5 JP 2006346866 A JP2006346866 A JP 2006346866A JP 2006346866 A JP2006346866 A JP 2006346866A JP 2008156475 A5 JP2008156475 A5 JP 2008156475A5
- Authority
- JP
- Japan
- Prior art keywords
- anhydride
- component
- mass
- sio
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000203 mixture Substances 0.000 claims description 10
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 125000000962 organic group Chemical group 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 125000005375 organosiloxane group Chemical group 0.000 claims 1
- 150000008065 acid anhydrides Chemical class 0.000 description 8
- 239000007822 coupling agent Substances 0.000 description 6
- 150000008064 anhydrides Chemical class 0.000 description 4
- -1 tetracarboxylic anhydride Chemical class 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 2
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 description 2
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- HMXHUUDRVBXHBQ-UHFFFAOYSA-N (2-hydroxyacetyl) 2-hydroxyacetate Chemical compound OCC(=O)OC(=O)CO HMXHUUDRVBXHBQ-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- RXYVNNWGXQRJAC-UHFFFAOYSA-N 1-chloro-1-[3-(trifluoromethyl)phenyl]propan-2-one Chemical compound CC(=O)C(Cl)C1=CC=CC(C(F)(F)F)=C1 RXYVNNWGXQRJAC-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- OLQWMCSSZKNOLQ-UHFFFAOYSA-N 3-(2,5-dioxooxolan-3-yl)oxolane-2,5-dione Chemical compound O=C1OC(=O)CC1C1C(=O)OC(=O)C1 OLQWMCSSZKNOLQ-UHFFFAOYSA-N 0.000 description 1
- YAXXOCZAXKLLCV-UHFFFAOYSA-N 3-dodecyloxolane-2,5-dione Chemical compound CCCCCCCCCCCCC1CC(=O)OC1=O YAXXOCZAXKLLCV-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- DGQOZCNCJKEVOA-UHFFFAOYSA-N 5-(2,5-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1CC(=O)OC1=O DGQOZCNCJKEVOA-UHFFFAOYSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- QHWKHLYUUZGSCW-UHFFFAOYSA-N Tetrabromophthalic anhydride Chemical compound BrC1=C(Br)C(Br)=C2C(=O)OC(=O)C2=C1Br QHWKHLYUUZGSCW-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- BKDVBBSUAGJUBA-UHFFFAOYSA-N bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic acid Chemical compound C1=CC2C(C(O)=O)C(C(=O)O)C1C(C(O)=O)C2C(O)=O BKDVBBSUAGJUBA-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical group CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- FLISWPFVWWWNNP-BQYQJAHWSA-N dihydro-3-(1-octenyl)-2,5-furandione Chemical compound CCCCCC\C=C\C1CC(=O)OC1=O FLISWPFVWWWNNP-BQYQJAHWSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- FLBJFXNAEMSXGL-UHFFFAOYSA-N het anhydride Chemical compound O=C1OC(=O)C2C1C1(Cl)C(Cl)=C(Cl)C2(Cl)C1(Cl)Cl FLBJFXNAEMSXGL-UHFFFAOYSA-N 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- SLYCYWCVSGPDFR-UHFFFAOYSA-N octadecyltrimethoxysilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OC)(OC)OC SLYCYWCVSGPDFR-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical group C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical group CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006346866A JP5248012B2 (ja) | 2006-12-25 | 2006-12-25 | 硬化性シリコーン組成物 |
| MYPI20092672A MY148272A (en) | 2006-12-25 | 2007-12-14 | Curable silicone composition |
| US12/520,900 US8119744B2 (en) | 2006-12-25 | 2007-12-14 | Curable silicone composition |
| KR1020097013181A KR20090099059A (ko) | 2006-12-25 | 2007-12-14 | 경화성 실리콘 조성물 |
| CN2007800467905A CN101616994B (zh) | 2006-12-25 | 2007-12-14 | 可固化的硅氧烷组合物 |
| EP07851013.8A EP2097483B8 (en) | 2006-12-25 | 2007-12-14 | Curable silicone composition |
| PCT/JP2007/074606 WO2008078662A1 (en) | 2006-12-25 | 2007-12-14 | Curable silicone composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006346866A JP5248012B2 (ja) | 2006-12-25 | 2006-12-25 | 硬化性シリコーン組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008156475A JP2008156475A (ja) | 2008-07-10 |
| JP2008156475A5 true JP2008156475A5 (https=) | 2011-02-17 |
| JP5248012B2 JP5248012B2 (ja) | 2013-07-31 |
Family
ID=39144607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006346866A Expired - Fee Related JP5248012B2 (ja) | 2006-12-25 | 2006-12-25 | 硬化性シリコーン組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8119744B2 (https=) |
| EP (1) | EP2097483B8 (https=) |
| JP (1) | JP5248012B2 (https=) |
| KR (1) | KR20090099059A (https=) |
| CN (1) | CN101616994B (https=) |
| MY (1) | MY148272A (https=) |
| WO (1) | WO2008078662A1 (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4931366B2 (ja) * | 2005-04-27 | 2012-05-16 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
| JP5207591B2 (ja) * | 2006-02-23 | 2013-06-12 | 東レ・ダウコーニング株式会社 | 半導体装置の製造方法および半導体装置 |
| JP5285846B2 (ja) * | 2006-09-11 | 2013-09-11 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
| JP5547369B2 (ja) * | 2007-09-28 | 2014-07-09 | 東レ・ダウコーニング株式会社 | 硬化性液状エポキシ樹脂組成物およびその硬化物 |
| JP5422109B2 (ja) | 2007-10-16 | 2014-02-19 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物およびその硬化物 |
| JP2010031149A (ja) * | 2008-07-29 | 2010-02-12 | Shin-Etsu Chemical Co Ltd | 光半導体素子封止用樹脂組成物 |
| US9040164B2 (en) * | 2008-12-05 | 2015-05-26 | Axalta Coating Systems Ip Co., Llc | Self-assembled silica condensates |
| CN101831180A (zh) * | 2010-05-21 | 2010-09-15 | 浙江三元电子科技有限公司 | 一种导热绝缘硅橡胶复合片材的制备方法 |
| WO2012058657A2 (en) * | 2010-10-29 | 2012-05-03 | Hardcoat Surfaces Llc | High hardness low surface energy coating |
| JP2012149131A (ja) * | 2011-01-17 | 2012-08-09 | Shin-Etsu Chemical Co Ltd | シリコーン樹脂組成物及び当該組成物を使用した光半導体装置 |
| JP6046395B2 (ja) * | 2012-06-29 | 2016-12-14 | 東レ・ダウコーニング株式会社 | 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置 |
| JP5987221B2 (ja) * | 2012-07-27 | 2016-09-07 | エルジー・ケム・リミテッド | 硬化性組成物 |
| KR101560046B1 (ko) * | 2012-07-27 | 2015-10-15 | 주식회사 엘지화학 | 경화성 조성물 |
| US11028269B2 (en) * | 2017-05-19 | 2021-06-08 | Shin-Etsu Chemical Co., Ltd | Silicone-modified epoxy resin composition and semiconductor device |
| US10449422B2 (en) | 2017-06-16 | 2019-10-22 | Sumitomo Rubber Industries, Ltd. | Couplings for securing golf shaft to golf club head |
| JP2019085534A (ja) * | 2017-11-10 | 2019-06-06 | 信越化学工業株式会社 | シリコーン変性エポキシ樹脂組成物及び半導体装置 |
| MX2020007498A (es) * | 2018-01-16 | 2020-09-14 | Taiyo Mfg Co Ltd | Capa de deposito recubierta de silice formada por revestimiento. |
| JP7215300B2 (ja) * | 2019-03-29 | 2023-01-31 | 味の素株式会社 | 硬化性樹脂組成物 |
| EP4534608A1 (en) * | 2022-05-31 | 2025-04-09 | Sumitomo Bakelite Co., Ltd. | Easily detachable thermosetting resin composition and detaching method |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3168405A (en) * | 1962-12-28 | 1965-02-02 | Procter & Gamble | Culinary composition containing edible acidic lipid anhydrides |
| JP2511348B2 (ja) | 1991-10-17 | 1996-06-26 | 東レ・ダウコーニング・シリコーン株式会社 | オルガノポリシロキサンおよびその製造方法 |
| JP3251655B2 (ja) | 1992-08-05 | 2002-01-28 | 東レ・ダウコーニング・シリコーン株式会社 | ジオルガノポリシロキサンおよびその製造方法 |
| JP2705519B2 (ja) * | 1993-02-26 | 1998-01-28 | 松下電工株式会社 | 液状エポキシ樹脂組成物 |
| US6117953A (en) * | 1998-01-22 | 2000-09-12 | Shin-Etsu Chemical Co., Ltd. | Liquid epoxy resin composition for ball grid array package |
| US6512031B1 (en) * | 1999-04-15 | 2003-01-28 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition, laminate film using the same, and semiconductor device |
| JP3796648B2 (ja) * | 1999-04-15 | 2006-07-12 | 信越化学工業株式会社 | エポキシ樹脂組成物並びにこのエポキシ樹脂組成物を用いた積層フィルム及び半導体装置 |
| US6632892B2 (en) * | 2001-08-21 | 2003-10-14 | General Electric Company | Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst |
| US20050267286A1 (en) * | 2003-10-20 | 2005-12-01 | Shinya Nakamura | Curing accelerator for curing resin, curing resin composition, electronic component device and method for producing phosphine derivative |
| TWI345576B (en) * | 2003-11-07 | 2011-07-21 | Dow Corning Toray Silicone | Curable silicone composition and cured product thereof |
| CN1737072B (zh) * | 2004-08-18 | 2011-06-08 | 播磨化成株式会社 | 导电粘合剂及使用该导电粘合剂制造物件的方法 |
| JP5166677B2 (ja) * | 2005-03-15 | 2013-03-21 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
| JP5004433B2 (ja) * | 2005-04-27 | 2012-08-22 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物およびその硬化物 |
| JP4931366B2 (ja) * | 2005-04-27 | 2012-05-16 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
| EP2017488A1 (en) * | 2007-07-20 | 2009-01-21 | Visiocorp Patents S.à.r.l. | Compact clutch assembly method and apparatus |
-
2006
- 2006-12-25 JP JP2006346866A patent/JP5248012B2/ja not_active Expired - Fee Related
-
2007
- 2007-12-14 EP EP07851013.8A patent/EP2097483B8/en not_active Not-in-force
- 2007-12-14 WO PCT/JP2007/074606 patent/WO2008078662A1/en not_active Ceased
- 2007-12-14 CN CN2007800467905A patent/CN101616994B/zh not_active Expired - Fee Related
- 2007-12-14 US US12/520,900 patent/US8119744B2/en not_active Expired - Fee Related
- 2007-12-14 MY MYPI20092672A patent/MY148272A/en unknown
- 2007-12-14 KR KR1020097013181A patent/KR20090099059A/ko not_active Abandoned
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