CN101616994B - 可固化的硅氧烷组合物 - Google Patents

可固化的硅氧烷组合物 Download PDF

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Publication number
CN101616994B
CN101616994B CN2007800467905A CN200780046790A CN101616994B CN 101616994 B CN101616994 B CN 101616994B CN 2007800467905 A CN2007800467905 A CN 2007800467905A CN 200780046790 A CN200780046790 A CN 200780046790A CN 101616994 B CN101616994 B CN 101616994B
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CN
China
Prior art keywords
group
component
curable silicone
sio
silicone composition
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Expired - Fee Related
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CN2007800467905A
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English (en)
Chinese (zh)
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CN101616994A (zh
Inventor
森田好次
加藤智子
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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Publication of CN101616994A publication Critical patent/CN101616994A/zh
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Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C08K5/1539—Cyclic anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
CN2007800467905A 2006-12-25 2007-12-14 可固化的硅氧烷组合物 Expired - Fee Related CN101616994B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP346866/2006 2006-12-25
JP2006346866A JP5248012B2 (ja) 2006-12-25 2006-12-25 硬化性シリコーン組成物
PCT/JP2007/074606 WO2008078662A1 (en) 2006-12-25 2007-12-14 Curable silicone composition

Publications (2)

Publication Number Publication Date
CN101616994A CN101616994A (zh) 2009-12-30
CN101616994B true CN101616994B (zh) 2012-05-16

Family

ID=39144607

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800467905A Expired - Fee Related CN101616994B (zh) 2006-12-25 2007-12-14 可固化的硅氧烷组合物

Country Status (7)

Country Link
US (1) US8119744B2 (https=)
EP (1) EP2097483B8 (https=)
JP (1) JP5248012B2 (https=)
KR (1) KR20090099059A (https=)
CN (1) CN101616994B (https=)
MY (1) MY148272A (https=)
WO (1) WO2008078662A1 (https=)

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JP4931366B2 (ja) * 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5207591B2 (ja) * 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP5285846B2 (ja) * 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5547369B2 (ja) * 2007-09-28 2014-07-09 東レ・ダウコーニング株式会社 硬化性液状エポキシ樹脂組成物およびその硬化物
JP5422109B2 (ja) 2007-10-16 2014-02-19 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
JP2010031149A (ja) * 2008-07-29 2010-02-12 Shin-Etsu Chemical Co Ltd 光半導体素子封止用樹脂組成物
US9040164B2 (en) * 2008-12-05 2015-05-26 Axalta Coating Systems Ip Co., Llc Self-assembled silica condensates
CN101831180A (zh) * 2010-05-21 2010-09-15 浙江三元电子科技有限公司 一种导热绝缘硅橡胶复合片材的制备方法
WO2012058657A2 (en) * 2010-10-29 2012-05-03 Hardcoat Surfaces Llc High hardness low surface energy coating
JP2012149131A (ja) * 2011-01-17 2012-08-09 Shin-Etsu Chemical Co Ltd シリコーン樹脂組成物及び当該組成物を使用した光半導体装置
JP6046395B2 (ja) * 2012-06-29 2016-12-14 東レ・ダウコーニング株式会社 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
JP5987221B2 (ja) * 2012-07-27 2016-09-07 エルジー・ケム・リミテッド 硬化性組成物
KR101560046B1 (ko) * 2012-07-27 2015-10-15 주식회사 엘지화학 경화성 조성물
US11028269B2 (en) * 2017-05-19 2021-06-08 Shin-Etsu Chemical Co., Ltd Silicone-modified epoxy resin composition and semiconductor device
US10449422B2 (en) 2017-06-16 2019-10-22 Sumitomo Rubber Industries, Ltd. Couplings for securing golf shaft to golf club head
JP2019085534A (ja) * 2017-11-10 2019-06-06 信越化学工業株式会社 シリコーン変性エポキシ樹脂組成物及び半導体装置
MX2020007498A (es) * 2018-01-16 2020-09-14 Taiyo Mfg Co Ltd Capa de deposito recubierta de silice formada por revestimiento.
JP7215300B2 (ja) * 2019-03-29 2023-01-31 味の素株式会社 硬化性樹脂組成物
EP4534608A1 (en) * 2022-05-31 2025-04-09 Sumitomo Bakelite Co., Ltd. Easily detachable thermosetting resin composition and detaching method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6512031B1 (en) * 1999-04-15 2003-01-28 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition, laminate film using the same, and semiconductor device
WO2006098493A1 (en) * 2005-03-15 2006-09-21 Dow Corning Toray Co., Ltd. Curable silicone composition and electronic device produced therefrom
CN1875071A (zh) * 2003-11-07 2006-12-06 陶氏康宁东丽株式会社 可固化的硅氧烷组合物及其固化产物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
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US3168405A (en) * 1962-12-28 1965-02-02 Procter & Gamble Culinary composition containing edible acidic lipid anhydrides
JP2511348B2 (ja) 1991-10-17 1996-06-26 東レ・ダウコーニング・シリコーン株式会社 オルガノポリシロキサンおよびその製造方法
JP3251655B2 (ja) 1992-08-05 2002-01-28 東レ・ダウコーニング・シリコーン株式会社 ジオルガノポリシロキサンおよびその製造方法
JP2705519B2 (ja) * 1993-02-26 1998-01-28 松下電工株式会社 液状エポキシ樹脂組成物
US6117953A (en) * 1998-01-22 2000-09-12 Shin-Etsu Chemical Co., Ltd. Liquid epoxy resin composition for ball grid array package
JP3796648B2 (ja) * 1999-04-15 2006-07-12 信越化学工業株式会社 エポキシ樹脂組成物並びにこのエポキシ樹脂組成物を用いた積層フィルム及び半導体装置
US6632892B2 (en) * 2001-08-21 2003-10-14 General Electric Company Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst
US20050267286A1 (en) * 2003-10-20 2005-12-01 Shinya Nakamura Curing accelerator for curing resin, curing resin composition, electronic component device and method for producing phosphine derivative
CN1737072B (zh) * 2004-08-18 2011-06-08 播磨化成株式会社 导电粘合剂及使用该导电粘合剂制造物件的方法
JP5004433B2 (ja) * 2005-04-27 2012-08-22 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
JP4931366B2 (ja) * 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
EP2017488A1 (en) * 2007-07-20 2009-01-21 Visiocorp Patents S.à.r.l. Compact clutch assembly method and apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6512031B1 (en) * 1999-04-15 2003-01-28 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition, laminate film using the same, and semiconductor device
CN1875071A (zh) * 2003-11-07 2006-12-06 陶氏康宁东丽株式会社 可固化的硅氧烷组合物及其固化产物
WO2006098493A1 (en) * 2005-03-15 2006-09-21 Dow Corning Toray Co., Ltd. Curable silicone composition and electronic device produced therefrom

Also Published As

Publication number Publication date
MY148272A (en) 2013-03-29
EP2097483A1 (en) 2009-09-09
US8119744B2 (en) 2012-02-21
WO2008078662A1 (en) 2008-07-03
EP2097483B8 (en) 2014-10-08
JP2008156475A (ja) 2008-07-10
EP2097483B1 (en) 2014-08-20
US20100140537A1 (en) 2010-06-10
CN101616994A (zh) 2009-12-30
JP5248012B2 (ja) 2013-07-31
KR20090099059A (ko) 2009-09-21

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