KR20090099059A - 경화성 실리콘 조성물 - Google Patents

경화성 실리콘 조성물 Download PDF

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Publication number
KR20090099059A
KR20090099059A KR1020097013181A KR20097013181A KR20090099059A KR 20090099059 A KR20090099059 A KR 20090099059A KR 1020097013181 A KR1020097013181 A KR 1020097013181A KR 20097013181 A KR20097013181 A KR 20097013181A KR 20090099059 A KR20090099059 A KR 20090099059A
Authority
KR
South Korea
Prior art keywords
component
curable silicone
silicone composition
sio
groups
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1020097013181A
Other languages
English (en)
Korean (ko)
Inventor
요시쓰구 모리타
도모코 가토
Original Assignee
다우 코닝 도레이 캄파니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다우 코닝 도레이 캄파니 리미티드 filed Critical 다우 코닝 도레이 캄파니 리미티드
Publication of KR20090099059A publication Critical patent/KR20090099059A/ko
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C08K5/1539—Cyclic anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
KR1020097013181A 2006-12-25 2007-12-14 경화성 실리콘 조성물 Abandoned KR20090099059A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-346866 2006-12-25
JP2006346866A JP5248012B2 (ja) 2006-12-25 2006-12-25 硬化性シリコーン組成物

Publications (1)

Publication Number Publication Date
KR20090099059A true KR20090099059A (ko) 2009-09-21

Family

ID=39144607

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097013181A Abandoned KR20090099059A (ko) 2006-12-25 2007-12-14 경화성 실리콘 조성물

Country Status (7)

Country Link
US (1) US8119744B2 (https=)
EP (1) EP2097483B8 (https=)
JP (1) JP5248012B2 (https=)
KR (1) KR20090099059A (https=)
CN (1) CN101616994B (https=)
MY (1) MY148272A (https=)
WO (1) WO2008078662A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4931366B2 (ja) * 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5207591B2 (ja) * 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP5285846B2 (ja) * 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5547369B2 (ja) * 2007-09-28 2014-07-09 東レ・ダウコーニング株式会社 硬化性液状エポキシ樹脂組成物およびその硬化物
JP5422109B2 (ja) 2007-10-16 2014-02-19 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
JP2010031149A (ja) * 2008-07-29 2010-02-12 Shin-Etsu Chemical Co Ltd 光半導体素子封止用樹脂組成物
US9040164B2 (en) * 2008-12-05 2015-05-26 Axalta Coating Systems Ip Co., Llc Self-assembled silica condensates
CN101831180A (zh) * 2010-05-21 2010-09-15 浙江三元电子科技有限公司 一种导热绝缘硅橡胶复合片材的制备方法
WO2012058657A2 (en) * 2010-10-29 2012-05-03 Hardcoat Surfaces Llc High hardness low surface energy coating
JP2012149131A (ja) * 2011-01-17 2012-08-09 Shin-Etsu Chemical Co Ltd シリコーン樹脂組成物及び当該組成物を使用した光半導体装置
JP6046395B2 (ja) * 2012-06-29 2016-12-14 東レ・ダウコーニング株式会社 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
JP5987221B2 (ja) * 2012-07-27 2016-09-07 エルジー・ケム・リミテッド 硬化性組成物
KR101560046B1 (ko) * 2012-07-27 2015-10-15 주식회사 엘지화학 경화성 조성물
US11028269B2 (en) * 2017-05-19 2021-06-08 Shin-Etsu Chemical Co., Ltd Silicone-modified epoxy resin composition and semiconductor device
US10449422B2 (en) 2017-06-16 2019-10-22 Sumitomo Rubber Industries, Ltd. Couplings for securing golf shaft to golf club head
JP2019085534A (ja) * 2017-11-10 2019-06-06 信越化学工業株式会社 シリコーン変性エポキシ樹脂組成物及び半導体装置
MX2020007498A (es) * 2018-01-16 2020-09-14 Taiyo Mfg Co Ltd Capa de deposito recubierta de silice formada por revestimiento.
JP7215300B2 (ja) * 2019-03-29 2023-01-31 味の素株式会社 硬化性樹脂組成物
EP4534608A1 (en) * 2022-05-31 2025-04-09 Sumitomo Bakelite Co., Ltd. Easily detachable thermosetting resin composition and detaching method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3168405A (en) * 1962-12-28 1965-02-02 Procter & Gamble Culinary composition containing edible acidic lipid anhydrides
JP2511348B2 (ja) 1991-10-17 1996-06-26 東レ・ダウコーニング・シリコーン株式会社 オルガノポリシロキサンおよびその製造方法
JP3251655B2 (ja) 1992-08-05 2002-01-28 東レ・ダウコーニング・シリコーン株式会社 ジオルガノポリシロキサンおよびその製造方法
JP2705519B2 (ja) * 1993-02-26 1998-01-28 松下電工株式会社 液状エポキシ樹脂組成物
US6117953A (en) * 1998-01-22 2000-09-12 Shin-Etsu Chemical Co., Ltd. Liquid epoxy resin composition for ball grid array package
US6512031B1 (en) * 1999-04-15 2003-01-28 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition, laminate film using the same, and semiconductor device
JP3796648B2 (ja) * 1999-04-15 2006-07-12 信越化学工業株式会社 エポキシ樹脂組成物並びにこのエポキシ樹脂組成物を用いた積層フィルム及び半導体装置
US6632892B2 (en) * 2001-08-21 2003-10-14 General Electric Company Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst
US20050267286A1 (en) * 2003-10-20 2005-12-01 Shinya Nakamura Curing accelerator for curing resin, curing resin composition, electronic component device and method for producing phosphine derivative
TWI345576B (en) * 2003-11-07 2011-07-21 Dow Corning Toray Silicone Curable silicone composition and cured product thereof
CN1737072B (zh) * 2004-08-18 2011-06-08 播磨化成株式会社 导电粘合剂及使用该导电粘合剂制造物件的方法
JP5166677B2 (ja) * 2005-03-15 2013-03-21 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5004433B2 (ja) * 2005-04-27 2012-08-22 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
JP4931366B2 (ja) * 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
EP2017488A1 (en) * 2007-07-20 2009-01-21 Visiocorp Patents S.à.r.l. Compact clutch assembly method and apparatus

Also Published As

Publication number Publication date
MY148272A (en) 2013-03-29
EP2097483A1 (en) 2009-09-09
US8119744B2 (en) 2012-02-21
WO2008078662A1 (en) 2008-07-03
EP2097483B8 (en) 2014-10-08
CN101616994B (zh) 2012-05-16
JP2008156475A (ja) 2008-07-10
EP2097483B1 (en) 2014-08-20
US20100140537A1 (en) 2010-06-10
CN101616994A (zh) 2009-12-30
JP5248012B2 (ja) 2013-07-31

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Patent event date: 20090624

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