JP2008144187A5 - - Google Patents

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Publication number
JP2008144187A5
JP2008144187A5 JP2006328891A JP2006328891A JP2008144187A5 JP 2008144187 A5 JP2008144187 A5 JP 2008144187A5 JP 2006328891 A JP2006328891 A JP 2006328891A JP 2006328891 A JP2006328891 A JP 2006328891A JP 2008144187 A5 JP2008144187 A5 JP 2008144187A5
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JP
Japan
Prior art keywords
amine
amine compounds
compounds
hoc
compound
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Granted
Application number
JP2006328891A
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English (en)
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JP5526458B2 (ja
JP2008144187A (ja
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Priority claimed from JP2006328891A external-priority patent/JP5526458B2/ja
Priority to JP2006328891A priority Critical patent/JP5526458B2/ja
Priority to TW096146102A priority patent/TWI457462B/zh
Priority to US11/987,880 priority patent/US7985285B2/en
Priority to KR1020070126329A priority patent/KR101393478B1/ko
Priority to CN2007103076303A priority patent/CN101319319B/zh
Publication of JP2008144187A publication Critical patent/JP2008144187A/ja
Publication of JP2008144187A5 publication Critical patent/JP2008144187A5/ja
Publication of JP5526458B2 publication Critical patent/JP5526458B2/ja
Application granted granted Critical
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Description

アミン化合物−１：ＨＯＣ2Ｈ4−ＮＨ−Ｃ2Ｈ4−ＮＨ−Ｃ2Ｈ4ＯＨ
アミン化合物−２：Ｃ2Ｈ5−ＮＨ−Ｃ2Ｈ4−ＮＨ−Ｃ2Ｈ4ＯＨ
アミン化合物−３：Ｃ2Ｈ5−ＮＨ−Ｃ2Ｈ4−ＮＨ−Ｃ2Ｈ4−ＮＨ−Ｃ2Ｈ4−ＮＨ−Ｃ2Ｈ4ＯＨ
アミン化合物−４：（ＣＨ3） 2 ＮＣ2Ｈ4−ＮＨ−Ｃ2Ｈ4−ＮＨ−Ｃ2Ｈ4Ｎ（ＣＨ3） 2
JP2006328891A 2006-12-06 2006-12-06 無電解金めっき浴及び無電解金めっき方法 Active JP5526458B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006328891A JP5526458B2 (ja) 2006-12-06 2006-12-06 無電解金めっき浴及び無電解金めっき方法
TW096146102A TWI457462B (zh) 2006-12-06 2007-12-04 無電式鍍金浴，無電式鍍金方法及電子零件
US11/987,880 US7985285B2 (en) 2006-12-06 2007-12-05 Electroless gold plating bath, electroless gold plating method and electronic parts
CN2007103076303A CN101319319B (zh) 2006-12-06 2007-12-06 无电镀金浴、无电镀金方法及电子部件
KR1020070126329A KR101393478B1 (ko) 2006-12-06 2007-12-06 무전해 금도금욕, 무전해 금도금 방법 및 전자 부품

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006328891A JP5526458B2 (ja) 2006-12-06 2006-12-06 無電解金めっき浴及び無電解金めっき方法

Publications (3)

Publication Number Publication Date
JP2008144187A JP2008144187A (ja) 2008-06-26
JP2008144187A5 true JP2008144187A5 (ja) 2010-11-11
JP5526458B2 JP5526458B2 (ja) 2014-06-18

Family

ID=39498391

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006328891A Active JP5526458B2 (ja) 2006-12-06 2006-12-06 無電解金めっき浴及び無電解金めっき方法

Country Status (5)

Country Link
US (1) US7985285B2 (ja)
JP (1) JP5526458B2 (ja)
KR (1) KR101393478B1 (ja)
CN (1) CN101319319B (ja)
TW (1) TWI457462B (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5526459B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526440B2 (ja) * 2007-01-17 2014-06-18 奥野製薬工業株式会社 パラジウム皮膜用還元析出型無電解金めっき液を用いて形成されたプリント配線板
JP5013077B2 (ja) * 2007-04-16 2012-08-29 上村工業株式会社 無電解金めっき方法及び電子部品
JP5371465B2 (ja) * 2009-02-09 2013-12-18 メタローテクノロジーズジャパン株式会社 非シアン無電解金めっき液及び導体パターンのめっき方法
TW201038766A (en) * 2010-07-08 2010-11-01 Rong yi chemical co ltd Method of electroless gold plating over miniature circuits on substrate
KR101444687B1 (ko) 2014-08-06 2014-09-26 (주)엠케이켐앤텍 무전해 금도금액
JP6619563B2 (ja) 2015-04-30 2019-12-11 日本高純度化学株式会社 無電解金めっき液、アルデヒド−アミン付加体補給液及びそれらを用いて形成した金皮膜
JP6722037B2 (ja) * 2016-05-12 2020-07-15 上村工業株式会社 無電解金めっき浴のめっき能維持管理方法
JP6901847B2 (ja) * 2016-05-12 2021-07-14 上村工業株式会社 無電解金めっき浴
JP6329589B2 (ja) * 2016-06-13 2018-05-23 上村工業株式会社 皮膜形成方法
ES2834877T3 (es) * 2018-01-26 2021-06-21 Atotech Deutschland Gmbh Baño de enchapado en oro electrolítico

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2441666A1 (fr) * 1978-11-16 1980-06-13 Prost Tournier Patrick Procede de depot chimique d'or par reduction autocatalytique
SE8302798L (sv) * 1982-06-07 1983-12-08 Occidental Chem Co Vattenhaltigt bad for stromlos utfellning av guld och sett att pa stromlos veg utfella guld med anvendning av badet
JPS60121274A (ja) * 1983-12-06 1985-06-28 Electroplating Eng Of Japan Co 自己触媒型無電解金めっき液
JPS6299477A (ja) * 1985-10-25 1987-05-08 C Uyemura & Co Ltd 無電解金めつき液
EP0265895B1 (en) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Method for electrolessly depositing high quality copper
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
JP2538461B2 (ja) * 1991-02-22 1996-09-25 奥野製薬工業株式会社 無電解金めっき方法
US5910340A (en) * 1995-10-23 1999-06-08 C. Uyemura & Co., Ltd. Electroless nickel plating solution and method
JP3051683B2 (ja) * 1996-12-10 2000-06-12 栄電子工業株式会社 無電解金めっき方法
JP2000017448A (ja) * 1998-07-01 2000-01-18 Nippon Riironaaru Kk 無電解金めっき液及び無電解金めっき方法
JP2003518552A (ja) * 1999-11-05 2003-06-10 シップレーカンパニー エル エル シー 無電解金めっき組成物及びその使用方法
JP4599599B2 (ja) * 2001-02-01 2010-12-15 奥野製薬工業株式会社 無電解金めっき液
JP3892730B2 (ja) * 2002-01-30 2007-03-14 関東化学株式会社 無電解金めっき液
JP3831842B2 (ja) * 2002-03-25 2006-10-11 奥野製薬工業株式会社 無電解金めっき液
JP3994279B2 (ja) * 2002-10-21 2007-10-17 奥野製薬工業株式会社 無電解金めっき液
CN100510174C (zh) * 2003-06-10 2009-07-08 日矿金属株式会社 化学镀金液
JP2005054267A (ja) * 2003-07-24 2005-03-03 Electroplating Eng Of Japan Co 無電解金めっき方法
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526459B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5013077B2 (ja) * 2007-04-16 2012-08-29 上村工業株式会社 無電解金めっき方法及び電子部品

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