JP2008141026A - 電子機器及びその製造方法、並びに、発光ダイオード表示装置及びその製造方法 - Google Patents

電子機器及びその製造方法、並びに、発光ダイオード表示装置及びその製造方法 Download PDF

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Publication number
JP2008141026A
JP2008141026A JP2006326488A JP2006326488A JP2008141026A JP 2008141026 A JP2008141026 A JP 2008141026A JP 2006326488 A JP2006326488 A JP 2006326488A JP 2006326488 A JP2006326488 A JP 2006326488A JP 2008141026 A JP2008141026 A JP 2008141026A
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JP
Japan
Prior art keywords
substrate
wiring
film
emitting diode
light emitting
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Pending
Application number
JP2006326488A
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English (en)
Japanese (ja)
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JP2008141026A5 (zh
Inventor
Katsuhiro Tomota
勝寛 友田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
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Sony Corp
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Filing date
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Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2006326488A priority Critical patent/JP2008141026A/ja
Priority to TW096139328A priority patent/TW200837819A/zh
Priority to US11/877,492 priority patent/US7763901B2/en
Priority to KR1020070108944A priority patent/KR101382354B1/ko
Priority to CN2007101875674A priority patent/CN101197355B/zh
Publication of JP2008141026A publication Critical patent/JP2008141026A/ja
Publication of JP2008141026A5 publication Critical patent/JP2008141026A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Devices (AREA)
JP2006326488A 2006-12-04 2006-12-04 電子機器及びその製造方法、並びに、発光ダイオード表示装置及びその製造方法 Pending JP2008141026A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006326488A JP2008141026A (ja) 2006-12-04 2006-12-04 電子機器及びその製造方法、並びに、発光ダイオード表示装置及びその製造方法
TW096139328A TW200837819A (en) 2006-12-04 2007-10-19 Electronic device, method of producing the same, light-emitting diode display unit, and method of producing the same
US11/877,492 US7763901B2 (en) 2006-12-04 2007-10-23 Electronic device, method of producing the same, light-emitting diode display unit, and method of producing the same
KR1020070108944A KR101382354B1 (ko) 2006-12-04 2007-10-29 전자기기 및 그 제조 방법과, 발광 다이오드 표시 장치 및그 제조 방법
CN2007101875674A CN101197355B (zh) 2006-12-04 2007-12-03 电子器件及其制造方法、发光二极管显示单元及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006326488A JP2008141026A (ja) 2006-12-04 2006-12-04 電子機器及びその製造方法、並びに、発光ダイオード表示装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2008141026A true JP2008141026A (ja) 2008-06-19
JP2008141026A5 JP2008141026A5 (zh) 2009-12-24

Family

ID=39547629

Family Applications (1)

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JP2006326488A Pending JP2008141026A (ja) 2006-12-04 2006-12-04 電子機器及びその製造方法、並びに、発光ダイオード表示装置及びその製造方法

Country Status (5)

Country Link
US (1) US7763901B2 (zh)
JP (1) JP2008141026A (zh)
KR (1) KR101382354B1 (zh)
CN (1) CN101197355B (zh)
TW (1) TW200837819A (zh)

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JP2011129646A (ja) * 2009-12-16 2011-06-30 Panasonic Corp Ｌｅｄモジュール用配線基板、ｌｅｄモジュール及びｌｅｄモジュール用配線基板の製造方法
JP2011134926A (ja) * 2009-12-25 2011-07-07 Nichia Corp 半導体発光装置及びその製造方法
WO2012014332A1 (ja) 2010-07-30 2012-02-02 株式会社 東芝 出力配分制御装置
WO2015015915A1 (ja) * 2013-08-02 2015-02-05 富士フイルム株式会社 発光装置およびその製造方法
WO2015015897A1 (ja) * 2013-08-02 2015-02-05 富士フイルム株式会社 発光装置の製造方法
JP2015029130A (ja) * 2013-03-28 2015-02-12 東芝ホクト電子株式会社 発光装置、その製造方法、および発光装置使用装置
JP2016184772A (ja) * 2013-03-28 2016-10-20 東芝ホクト電子株式会社 発光装置
JP2017076729A (ja) * 2015-10-16 2017-04-20 スタンレー電気株式会社 半導体発光装置、及び、半導体発光装置の製造方法
JP2017117814A (ja) * 2015-12-21 2017-06-29 スタンレー電気株式会社 半導体発光装置、及び、半導体発光装置の製造方法
JP2017531915A (ja) * 2014-09-25 2017-10-26 エックス−セレプリント リミテッドＸ−Ｃｅｌｅｐｒｉｎｔ Ｌｉｍｉｔｅｄ 複合マイクロアセンブリのストラテジおよびデバイス
JP2018170212A (ja) * 2017-03-30 2018-11-01 富士フイルム株式会社 有機ｅｌ画像表示装置の製造方法
JP2019145801A (ja) * 2013-11-07 2019-08-29 東芝ホクト電子株式会社 発光装置
WO2020075431A1 (ja) * 2018-10-09 2020-04-16 ソニー株式会社 表示装置
CN111357121A (zh) * 2017-12-04 2020-06-30 东旭集团有限公司 微型led器件用上基板、微型led器件以及微型led显示装置

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US9419179B2 (en) 2007-05-31 2016-08-16 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9534772B2 (en) 2007-05-31 2017-01-03 Nthdegree Technologies Worldwide Inc Apparatus with light emitting diodes
US9018833B2 (en) 2007-05-31 2015-04-28 Nthdegree Technologies Worldwide Inc Apparatus with light emitting or absorbing diodes
US8877101B2 (en) 2007-05-31 2014-11-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, power generating or other electronic apparatus
US8852467B2 (en) 2007-05-31 2014-10-07 Nthdegree Technologies Worldwide Inc Method of manufacturing a printable composition of a liquid or gel suspension of diodes
US9343593B2 (en) 2007-05-31 2016-05-17 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
CN101599442A (zh) * 2008-06-04 2009-12-09 富准精密工业(深圳)有限公司 发光二极管的制造方法
JP2010107935A (ja) * 2008-10-28 2010-05-13 Samsung Mobile Display Co Ltd 平板表示装置及びその製造方法
CN103582962B (zh) * 2010-09-01 2017-03-22 无限科技全球公司 发光或动力生成装置
US9899329B2 (en) 2010-11-23 2018-02-20 X-Celeprint Limited Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
US8889485B2 (en) 2011-06-08 2014-11-18 Semprius, Inc. Methods for surface attachment of flipped active componenets
CN102903804B (zh) * 2011-07-25 2015-12-16 财团法人工业技术研究院 发光元件的转移方法以及发光元件阵列
US9306117B2 (en) 2011-07-25 2016-04-05 Industrial Technology Research Institute Transfer-bonding method for light emitting devices
US20120175667A1 (en) * 2011-10-03 2012-07-12 Golle Aaron J Led light disposed on a flexible substrate and connected with a printed 3d conductor
TWI450476B (zh) * 2011-11-18 2014-08-21 Hongkong Dongshan Prec Union Opoelectronic Co Ltd Padding method
CN106716003B (zh) * 2014-09-02 2020-03-10 飞利浦照明控股有限公司 将照明布置应用于表面的方法和照明表面
US9799719B2 (en) 2014-09-25 2017-10-24 X-Celeprint Limited Active-matrix touchscreen
US10381332B2 (en) 2014-10-31 2019-08-13 eLux Inc. Fabrication method for emissive display with light management system
US10319878B2 (en) 2014-10-31 2019-06-11 eLux, Inc. Stratified quantum dot phosphor structure
US10446728B2 (en) 2014-10-31 2019-10-15 eLux, Inc. Pick-and remove system and method for emissive display repair
US10381335B2 (en) 2014-10-31 2019-08-13 ehux, Inc. Hybrid display using inorganic micro light emitting diodes (uLEDs) and organic LEDs (OLEDs)
US10242977B2 (en) 2014-10-31 2019-03-26 eLux, Inc. Fluid-suspended microcomponent harvest, distribution, and reclamation
US10535640B2 (en) 2014-10-31 2020-01-14 eLux Inc. System and method for the fluidic assembly of micro-LEDs utilizing negative pressure
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US10418527B2 (en) 2014-10-31 2019-09-17 eLux, Inc. System and method for the fluidic assembly of emissive displays
US10520769B2 (en) 2014-10-31 2019-12-31 eLux, Inc. Emissive display with printed light modification structures
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US10395966B2 (en) 2016-11-15 2019-08-27 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
WO2018091459A1 (en) 2016-11-15 2018-05-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
US10600671B2 (en) 2016-11-15 2020-03-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
US11024608B2 (en) 2017-03-28 2021-06-01 X Display Company Technology Limited Structures and methods for electrical connection of micro-devices and substrates
EP3462489B1 (en) * 2017-09-29 2021-05-26 Facebook Technologies, LLC Mesa shaped micro light emitting diode with bottom n-contact
US10418510B1 (en) 2017-12-22 2019-09-17 Facebook Technologies, Llc Mesa shaped micro light emitting diode with electroless plated N-contact
KR20210106606A (ko) * 2020-02-20 2021-08-31 삼성디스플레이 주식회사 표시 장치
KR102437208B1 (ko) * 2021-03-03 2022-08-30 웨이브로드 주식회사 반도체 발광소자를 지지 기판으로 이전하는 방법

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Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011129646A (ja) * 2009-12-16 2011-06-30 Panasonic Corp Ｌｅｄモジュール用配線基板、ｌｅｄモジュール及びｌｅｄモジュール用配線基板の製造方法
JP2011134926A (ja) * 2009-12-25 2011-07-07 Nichia Corp 半導体発光装置及びその製造方法
WO2012014332A1 (ja) 2010-07-30 2012-02-02 株式会社 東芝 出力配分制御装置
JP2016184772A (ja) * 2013-03-28 2016-10-20 東芝ホクト電子株式会社 発光装置
JP2015029130A (ja) * 2013-03-28 2015-02-12 東芝ホクト電子株式会社 発光装置、その製造方法、および発光装置使用装置
JP2019071471A (ja) * 2013-03-28 2019-05-09 東芝ホクト電子株式会社 発光装置の製造方法
WO2015015897A1 (ja) * 2013-08-02 2015-02-05 富士フイルム株式会社 発光装置の製造方法
JP2015032483A (ja) * 2013-08-02 2015-02-16 富士フイルム株式会社 発光装置およびその製造方法
JP2015032703A (ja) * 2013-08-02 2015-02-16 富士フイルム株式会社 発光装置の製造方法
WO2015015915A1 (ja) * 2013-08-02 2015-02-05 富士フイルム株式会社 発光装置およびその製造方法
JP2019145801A (ja) * 2013-11-07 2019-08-29 東芝ホクト電子株式会社 発光装置
JP2020073995A (ja) * 2014-09-25 2020-05-14 エックス−セレプリント リミテッドＸ−Ｃｅｌｅｐｒｉｎｔ Ｌｉｍｉｔｅｄ 複合マイクロアセンブリのストラテジおよびデバイス
JP2017531915A (ja) * 2014-09-25 2017-10-26 エックス−セレプリント リミテッドＸ−Ｃｅｌｅｐｒｉｎｔ Ｌｉｍｉｔｅｄ 複合マイクロアセンブリのストラテジおよびデバイス
JP7041661B2 (ja) 2014-09-25 2022-03-24 エックス ディスプレイ カンパニー テクノロジー リミテッド 複合マイクロアセンブリのストラテジおよびデバイス
JP2017076729A (ja) * 2015-10-16 2017-04-20 スタンレー電気株式会社 半導体発光装置、及び、半導体発光装置の製造方法
JP2017117814A (ja) * 2015-12-21 2017-06-29 スタンレー電気株式会社 半導体発光装置、及び、半導体発光装置の製造方法
JP2018170212A (ja) * 2017-03-30 2018-11-01 富士フイルム株式会社 有機ｅｌ画像表示装置の製造方法
CN111357121A (zh) * 2017-12-04 2020-06-30 东旭集团有限公司 微型led器件用上基板、微型led器件以及微型led显示装置
KR20200089753A (ko) * 2017-12-04 2020-07-27 퉁수 그룹 컴퍼니 리미티드 초소형 led 컴포넌트용 상부 기판, 초소형 led 컴포넌트, 및 초소형 led 디스플레이 장치
JP2021506108A (ja) * 2017-12-04 2021-02-18 トンシュー グループ カンパニー リミテッドＴｕｎｇｈｓｕ Ｇｒｏｕｐ Ｃｏ．， Ｌｔｄ． マイクロｌｅｄデバイス用上部基板、マイクロｌｅｄデバイス及びマイクロｌｅｄ表示装置
KR102349395B1 (ko) 2017-12-04 2022-01-07 퉁수 그룹 컴퍼니 리미티드 초소형 led 컴포넌트용 상부 기판, 초소형 led 컴포넌트, 및 초소형 led 디스플레이 장치
US11545607B2 (en) 2017-12-04 2023-01-03 Tunghsu Group Co., Ltd. Upper substrate for miniature LED component, miniature LED component, and miniature LED display device
WO2020075431A1 (ja) * 2018-10-09 2020-04-16 ソニー株式会社 表示装置
US12002910B2 (en) 2018-10-09 2024-06-04 Sony Corporation Display device

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TWI375262B (zh) 2012-10-21
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