JP2008140886A - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

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Publication number
JP2008140886A
JP2008140886A JP2006324126A JP2006324126A JP2008140886A JP 2008140886 A JP2008140886 A JP 2008140886A JP 2006324126 A JP2006324126 A JP 2006324126A JP 2006324126 A JP2006324126 A JP 2006324126A JP 2008140886 A JP2008140886 A JP 2008140886A
Authority
JP
Japan
Prior art keywords
layer
wiring
pad
uppermost
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006324126A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008140886A5 (cg-RX-API-DMAC7.html
Inventor
Shigeji Muramatsu
茂次 村松
Yasuhiko Kusama
泰彦 草間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2006324126A priority Critical patent/JP2008140886A/ja
Priority to KR1020070118269A priority patent/KR20080049626A/ko
Priority to US11/946,360 priority patent/US8037596B2/en
Priority to TW096145329A priority patent/TW200833200A/zh
Priority to EP07023248A priority patent/EP1928220A3/en
Publication of JP2008140886A publication Critical patent/JP2008140886A/ja
Publication of JP2008140886A5 publication Critical patent/JP2008140886A5/ja
Priority to US13/150,691 priority patent/US8222532B2/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP2006324126A 2006-11-30 2006-11-30 配線基板及びその製造方法 Withdrawn JP2008140886A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2006324126A JP2008140886A (ja) 2006-11-30 2006-11-30 配線基板及びその製造方法
KR1020070118269A KR20080049626A (ko) 2006-11-30 2007-11-20 배선 기판 및 그 제조 방법
US11/946,360 US8037596B2 (en) 2006-11-30 2007-11-28 Method for manufacturing a wiring board
TW096145329A TW200833200A (en) 2006-11-30 2007-11-29 Wiring board and method of manufacturing the same
EP07023248A EP1928220A3 (en) 2006-11-30 2007-11-30 Wiring board and method of manufacturing the same
US13/150,691 US8222532B2 (en) 2006-11-30 2011-06-01 Method for manufacturing a wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006324126A JP2008140886A (ja) 2006-11-30 2006-11-30 配線基板及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011148993A Division JP2011249819A (ja) 2011-07-05 2011-07-05 配線基板及びその製造方法

Publications (2)

Publication Number Publication Date
JP2008140886A true JP2008140886A (ja) 2008-06-19
JP2008140886A5 JP2008140886A5 (cg-RX-API-DMAC7.html) 2009-09-24

Family

ID=39186976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006324126A Withdrawn JP2008140886A (ja) 2006-11-30 2006-11-30 配線基板及びその製造方法

Country Status (5)

Country Link
US (2) US8037596B2 (cg-RX-API-DMAC7.html)
EP (1) EP1928220A3 (cg-RX-API-DMAC7.html)
JP (1) JP2008140886A (cg-RX-API-DMAC7.html)
KR (1) KR20080049626A (cg-RX-API-DMAC7.html)
TW (1) TW200833200A (cg-RX-API-DMAC7.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010287871A (ja) * 2009-05-14 2010-12-24 Sharp Corp 発光装置
JP2012004399A (ja) * 2010-06-18 2012-01-05 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
WO2013014838A1 (ja) * 2011-07-25 2013-01-31 日本特殊陶業株式会社 配線基板
US8575495B2 (en) 2010-09-28 2013-11-05 Shinko Electric Industries Co., Ltd. Wiring substrate, semiconductor device, and method for manufacturing wiring substrate
WO2013171964A1 (ja) * 2012-05-16 2013-11-21 日本特殊陶業株式会社 配線基板

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009037738A1 (ja) * 2007-09-18 2009-03-26 Fujitsu Limited 引出し配線方法、引出し配線プログラムおよび引出し配線装置
SG154342A1 (en) * 2008-01-08 2009-08-28 Opulent Electronics Internat P Insulated metal substrate fabrication
JP5113114B2 (ja) * 2009-04-06 2013-01-09 新光電気工業株式会社 配線基板の製造方法及び配線基板
JP5479233B2 (ja) * 2010-06-04 2014-04-23 新光電気工業株式会社 配線基板及びその製造方法
TWI495051B (zh) * 2011-07-08 2015-08-01 欣興電子股份有限公司 無核心層之封裝基板及其製法
KR20130097481A (ko) * 2012-02-24 2013-09-03 삼성전자주식회사 인쇄회로기판(ｐｃｂ) 및 그 ｐｃｂ를 포함한 메모리 모듈
CN103582304B (zh) * 2012-07-30 2016-08-03 富葵精密组件(深圳)有限公司 透明印刷电路板及其制作方法
JP2015090894A (ja) * 2013-11-05 2015-05-11 イビデン株式会社 プリント配線板
US12452999B2 (en) 2020-10-22 2025-10-21 Lg Innotek Co., Ltd. Circuit board

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10107446A (ja) * 1996-09-27 1998-04-24 Tokyo Ohka Kogyo Co Ltd 多層配線板の製造方法
JPH10284835A (ja) * 1997-04-01 1998-10-23 Ibiden Co Ltd プリント配線板の製造方法
JP2001109162A (ja) * 1997-04-01 2001-04-20 Ibiden Co Ltd プリント配線板の製造方法
JP2003234578A (ja) * 2003-01-20 2003-08-22 Ibiden Co Ltd プリント配線板の製造方法
JP2005045163A (ja) * 2003-07-25 2005-02-17 Toppan Printing Co Ltd 多層回路板の製造方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2059020C (en) * 1991-01-09 1998-08-18 Kohji Kimbara Polyimide multilayer wiring board and method of producing same
JP2587548B2 (ja) 1991-05-27 1997-03-05 富山日本電気株式会社 印刷配線板の製造方法
US5305519A (en) * 1991-10-24 1994-04-26 Kawasaki Steel Corporation Multilevel interconnect structure and method of manufacturing the same
US5436062A (en) * 1992-06-15 1995-07-25 Dyconex Patente Ag Process for the production of printed circuit boards with extremely dense wiring using a metal-clad laminate
US5486492A (en) * 1992-10-30 1996-01-23 Kawasaki Steel Corporation Method of forming multilayered wiring structure in semiconductor device
US5906042A (en) * 1995-10-04 1999-05-25 Prolinx Labs Corporation Method and structure to interconnect traces of two conductive layers in a printed circuit board
EP0793406B1 (en) * 1996-02-29 2005-12-28 Tokyo Ohka Kogyo Co., Ltd. Process for producing multilayer wiring boards
US5872338A (en) * 1996-04-10 1999-02-16 Prolinx Labs Corporation Multilayer board having insulating isolation rings
JP2000286362A (ja) 1999-03-30 2000-10-13 Mitsubishi Gas Chem Co Inc 極薄ｂｇａタイプ半導体プラスチックパッケージ用プリント配線板
JP4260275B2 (ja) * 1999-03-18 2009-04-30 富士通マイクロエレクトロニクス株式会社 半導体装置及びその製造方法
JP2000294678A (ja) 1999-04-05 2000-10-20 Mitsubishi Gas Chem Co Inc 高熱放散型ボールグリッドアレイタイプ半導体プラスチックパッケージ用プリント配線板
JP3592129B2 (ja) * 1999-04-15 2004-11-24 新光電気工業株式会社 多層配線基板の製造方法
JP2001007240A (ja) 1999-06-17 2001-01-12 Mitsubishi Gas Chem Co Inc 高熱放散型ボールグリッドアレイタイプ半導体プラスチックパッケージ用プリント配線板
JP3606769B2 (ja) * 1999-07-13 2005-01-05 新光電気工業株式会社 半導体装置
US6316351B1 (en) * 2000-05-31 2001-11-13 Taiwan Semiconductor Manufacturing Company Inter-metal dielectric film composition for dual damascene process
JP4509437B2 (ja) * 2000-09-11 2010-07-21 Ｈｏｙａ株式会社 多層配線基板の製造方法
TWI278962B (en) * 2002-04-12 2007-04-11 Hitachi Ltd Semiconductor device
US20030204949A1 (en) 2002-05-01 2003-11-06 Ultratera Corporation Method of forming connections on a conductor pattern of a printed circuit board
KR100520961B1 (ko) 2003-05-30 2005-10-17 엘지전자 주식회사 인쇄회로기판의 제조방법
JP3999720B2 (ja) 2003-09-16 2007-10-31 沖電気工業株式会社 半導体装置およびその製造方法
US20060226202A1 (en) 2005-04-11 2006-10-12 Ho-Ching Yang PCB solder masking process
JP5032001B2 (ja) 2005-05-19 2012-09-26 株式会社東芝 燃料電池
JP4769022B2 (ja) 2005-06-07 2011-09-07 京セラＳｌｃテクノロジー株式会社 配線基板およびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10107446A (ja) * 1996-09-27 1998-04-24 Tokyo Ohka Kogyo Co Ltd 多層配線板の製造方法
JPH10284835A (ja) * 1997-04-01 1998-10-23 Ibiden Co Ltd プリント配線板の製造方法
JP2001109162A (ja) * 1997-04-01 2001-04-20 Ibiden Co Ltd プリント配線板の製造方法
JP2003234578A (ja) * 2003-01-20 2003-08-22 Ibiden Co Ltd プリント配線板の製造方法
JP2005045163A (ja) * 2003-07-25 2005-02-17 Toppan Printing Co Ltd 多層回路板の製造方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010287871A (ja) * 2009-05-14 2010-12-24 Sharp Corp 発光装置
JP2012004399A (ja) * 2010-06-18 2012-01-05 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
US8575495B2 (en) 2010-09-28 2013-11-05 Shinko Electric Industries Co., Ltd. Wiring substrate, semiconductor device, and method for manufacturing wiring substrate
WO2013014838A1 (ja) * 2011-07-25 2013-01-31 日本特殊陶業株式会社 配線基板
KR101296996B1 (ko) 2011-07-25 2013-08-14 니혼도꾸슈도교 가부시키가이샤 배선기판
JP5415632B2 (ja) * 2011-07-25 2014-02-12 日本特殊陶業株式会社 配線基板
US9485853B2 (en) 2011-07-25 2016-11-01 Ngk Spark Plug Co., Ltd. Wiring substrate having a plurality of connection terminals and a filling member provided therebetween
WO2013171964A1 (ja) * 2012-05-16 2013-11-21 日本特殊陶業株式会社 配線基板
JP2013239603A (ja) * 2012-05-16 2013-11-28 Ngk Spark Plug Co Ltd 配線基板
KR101555460B1 (ko) 2012-05-16 2015-09-23 니혼도꾸슈도교 가부시키가이샤 배선기판
US9560739B2 (en) 2012-05-16 2017-01-31 Ngk Spark Plug Co., Ltd. Wiring board

Also Published As

Publication number Publication date
US8037596B2 (en) 2011-10-18
US20110253422A1 (en) 2011-10-20
EP1928220A3 (en) 2009-09-30
US20080251279A1 (en) 2008-10-16
KR20080049626A (ko) 2008-06-04
EP1928220A2 (en) 2008-06-04
US8222532B2 (en) 2012-07-17
TW200833200A (en) 2008-08-01

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