JP2008138931A5 - - Google Patents

Download PDF

Info

Publication number
JP2008138931A5
JP2008138931A5 JP2006325487A JP2006325487A JP2008138931A5 JP 2008138931 A5 JP2008138931 A5 JP 2008138931A5 JP 2006325487 A JP2006325487 A JP 2006325487A JP 2006325487 A JP2006325487 A JP 2006325487A JP 2008138931 A5 JP2008138931 A5 JP 2008138931A5
Authority
JP
Japan
Prior art keywords
electrode
chip capacitor
semiconductor device
rewiring
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2006325487A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008138931A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006325487A priority Critical patent/JP2008138931A/ja
Priority claimed from JP2006325487A external-priority patent/JP2008138931A/ja
Publication of JP2008138931A publication Critical patent/JP2008138931A/ja
Publication of JP2008138931A5 publication Critical patent/JP2008138931A5/ja
Ceased legal-status Critical Current

Links

JP2006325487A 2006-12-01 2006-12-01 半導体装置 Ceased JP2008138931A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006325487A JP2008138931A (ja) 2006-12-01 2006-12-01 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006325487A JP2008138931A (ja) 2006-12-01 2006-12-01 半導体装置

Publications (2)

Publication Number Publication Date
JP2008138931A JP2008138931A (ja) 2008-06-19
JP2008138931A5 true JP2008138931A5 (enExample) 2010-01-21

Family

ID=39600587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006325487A Ceased JP2008138931A (ja) 2006-12-01 2006-12-01 半導体装置

Country Status (1)

Country Link
JP (1) JP2008138931A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4914193B2 (ja) * 2006-12-01 2012-04-11 日本化薬株式会社 スクイブならびにエアバッグ用ガス発生装置およびシートベルトプリテンショナー用ガス発生装置
JP5958915B2 (ja) * 2013-03-29 2016-08-02 昭和金属工業株式会社 点火ユニットの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2190730B (en) * 1986-05-22 1990-10-24 Detonix Close Corp Detonator firing element
DE59805824D1 (de) * 1997-07-09 2002-11-07 Siemens Ag Anzünder
FR2784176B1 (fr) * 1998-10-06 2004-11-26 Livbag Snc Systeme d'initiation electro-pyrotechnique protege contre les decharges electrostatiques
US6166452A (en) * 1999-01-20 2000-12-26 Breed Automotive Technology, Inc. Igniter
JP4811975B2 (ja) * 2001-06-06 2011-11-09 日本化薬株式会社 着火薬組成物、及びその着火薬組成物を用いた点火具
JP2003205823A (ja) * 2002-01-16 2003-07-22 Showa Kinzoku Kogyo Kk ガス発生器
JP3987781B2 (ja) * 2002-09-30 2007-10-10 日本特殊陶業株式会社 配線基板の製造方法
JP4513302B2 (ja) * 2003-10-07 2010-07-28 カシオ計算機株式会社 半導体装置
JP4397731B2 (ja) * 2004-05-12 2010-01-13 日本化薬株式会社 点火装置
JPWO2006061879A1 (ja) * 2004-12-06 2008-06-05 株式会社ルネサステクノロジ 点火装置、半導体装置及びその製造方法

Similar Documents

Publication Publication Date Title
JP2007149977A5 (enExample)
JP2003174120A5 (enExample)
JP2005520342A5 (enExample)
JP2006093189A5 (enExample)
JP2009540606A5 (enExample)
TWI230992B (en) Semiconductor device
TWI523160B (zh) 晶片封裝
CN203721707U (zh) 芯片封装结构
CN106206017A (zh) 电子部件
CN103021989B (zh) 一种多组件的芯片封装结构
JP2009176978A5 (enExample)
JP2005347369A5 (enExample)
JP2015537393A5 (enExample)
US20090079074A1 (en) Semiconductor device having decoupling capacitor formed on substrate where semiconductor chip is mounted
JP2011129729A5 (enExample)
JP2012044042A (ja) 半導体集積回路および半導体集積回路装置
CN105575927A (zh) 一种焊垫结构及其制作方法
JP2008138931A5 (enExample)
JP2010206021A (ja) 電子部品実装構造体、およびその製造方法
JP2010016062A (ja) 半導体装置
JP2011003764A5 (ja) 半導体装置
JP2007235009A5 (enExample)
JP2011071547A5 (ja) 半導体集積回路装置
JP2007115922A (ja) 半導体装置
JP2009111062A (ja) 半導体装置及びその製造方法