JP2005347369A5 - - Google Patents

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Publication number
JP2005347369A5
JP2005347369A5 JP2004162854A JP2004162854A JP2005347369A5 JP 2005347369 A5 JP2005347369 A5 JP 2005347369A5 JP 2004162854 A JP2004162854 A JP 2004162854A JP 2004162854 A JP2004162854 A JP 2004162854A JP 2005347369 A5 JP2005347369 A5 JP 2005347369A5
Authority
JP
Japan
Prior art keywords
leads
semiconductor device
chip
semiconductor
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004162854A
Other languages
English (en)
Japanese (ja)
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JP2005347369A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004162854A priority Critical patent/JP2005347369A/ja
Priority claimed from JP2004162854A external-priority patent/JP2005347369A/ja
Priority to US11/140,394 priority patent/US20050263863A1/en
Publication of JP2005347369A publication Critical patent/JP2005347369A/ja
Publication of JP2005347369A5 publication Critical patent/JP2005347369A5/ja
Pending legal-status Critical Current

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JP2004162854A 2004-06-01 2004-06-01 半導体装置およびその製造方法 Pending JP2005347369A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004162854A JP2005347369A (ja) 2004-06-01 2004-06-01 半導体装置およびその製造方法
US11/140,394 US20050263863A1 (en) 2004-06-01 2005-05-31 Semiconductor device and a method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004162854A JP2005347369A (ja) 2004-06-01 2004-06-01 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2005347369A JP2005347369A (ja) 2005-12-15
JP2005347369A5 true JP2005347369A5 (enExample) 2007-07-12

Family

ID=35424258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004162854A Pending JP2005347369A (ja) 2004-06-01 2004-06-01 半導体装置およびその製造方法

Country Status (2)

Country Link
US (1) US20050263863A1 (enExample)
JP (1) JP2005347369A (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060220191A1 (en) * 2005-04-01 2006-10-05 Honeywell International Inc. Electronic package with a stepped-pitch leadframe
JP4936103B2 (ja) * 2005-12-26 2012-05-23 日立金属株式会社 Ｄｃ−ｄｃコンバータ
MY145348A (en) * 2007-03-15 2012-01-31 Semiconductor Components Ind Circuit component and method of manufacture
US8824165B2 (en) * 2008-02-18 2014-09-02 Cyntec Co. Ltd Electronic package structure
KR100954981B1 (ko) * 2008-03-31 2010-04-29 권구만 다양한 지형선택이 가능한 골프연습기구
US7847391B2 (en) * 2008-07-01 2010-12-07 Texas Instruments Incorporated Manufacturing method for integrating a shunt resistor into a semiconductor package
US8241965B2 (en) * 2009-10-01 2012-08-14 Stats Chippac Ltd. Integrated circuit packaging system with pad connection and method of manufacture thereof
JP5341717B2 (ja) 2009-11-10 2013-11-13 ルネサスエレクトロニクス株式会社 半導体パッケージ及びシステム
JP2013110314A (ja) * 2011-11-22 2013-06-06 Elpida Memory Inc 半導体装置
JP7172617B2 (ja) * 2019-01-11 2022-11-16 株式会社デンソー 電子装置およびその製造方法
US11342260B2 (en) * 2019-10-15 2022-05-24 Win Semiconductors Corp. Power flat no-lead package
US11380631B2 (en) * 2019-11-27 2022-07-05 Texas Instruments Incorporated Lead frame for multi-chip modules with integrated surge protection
JP7779690B2 (ja) * 2021-09-24 2025-12-03 ローム株式会社 半導体装置、及び半導体モジュール
DE102021125489A1 (de) * 2021-10-01 2023-04-06 Tdk-Micronas Gmbh Integriertes Zwei-Chip Schaltkreissystem in einem integrierten Schaltkreisgehäuse mit zwei separaten Versorgungsgebieten
DE102022200892A1 (de) 2022-01-27 2023-07-27 Robert Bosch Gesellschaft mit beschränkter Haftung Spannungswandler und Spannungswandlermodul

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4705917A (en) * 1985-08-27 1987-11-10 Hughes Aircraft Company Microelectronic package
US5089878A (en) * 1989-06-09 1992-02-18 Lee Jaesup N Low impedance packaging
JP3137749B2 (ja) * 1992-06-30 2001-02-26 株式会社日立製作所 半導体集積回路装置
US5457340A (en) * 1992-12-07 1995-10-10 Integrated Device Technology, Inc. Leadframe with power and ground planes
JPH06283650A (ja) * 1993-03-26 1994-10-07 Ibiden Co Ltd 半導体装置
US5343074A (en) * 1993-10-04 1994-08-30 Motorola, Inc. Semiconductor device having voltage distribution ring(s) and method for making the same
US6462404B1 (en) * 1997-02-28 2002-10-08 Micron Technology, Inc. Multilevel leadframe for a packaged integrated circuit
US6476486B1 (en) * 1997-10-30 2002-11-05 Agilent Technologies, Inc. Ball grid array package with supplemental electronic component
TW488054B (en) * 2001-06-22 2002-05-21 Advanced Semiconductor Eng Semiconductor package for integrating surface mount devices
JP4010792B2 (ja) * 2001-10-19 2007-11-21 株式会社ルネサステクノロジ 半導体装置
US7002249B2 (en) * 2002-11-12 2006-02-21 Primarion, Inc. Microelectronic component with reduced parasitic inductance and method of fabricating
US6903448B1 (en) * 2002-11-12 2005-06-07 Marvell International Ltd. High performance leadframe in electronic package
US7253506B2 (en) * 2003-06-23 2007-08-07 Power-One, Inc. Micro lead frame package

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