JP2008097804A - 電圧制御装置および電圧制御方法 - Google Patents

電圧制御装置および電圧制御方法 Download PDF

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Publication number
JP2008097804A
JP2008097804A JP2007214164A JP2007214164A JP2008097804A JP 2008097804 A JP2008097804 A JP 2008097804A JP 2007214164 A JP2007214164 A JP 2007214164A JP 2007214164 A JP2007214164 A JP 2007214164A JP 2008097804 A JP2008097804 A JP 2008097804A
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JP
Japan
Prior art keywords
signal
voltage
burn
active
response
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007214164A
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English (en)
Japanese (ja)
Other versions
JP2008097804A5 (enExample
Inventor
Shunki Sai
俊 基 崔
Yoon Jae Shin
允 宰 愼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
Hynix Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hynix Semiconductor Inc filed Critical Hynix Semiconductor Inc
Publication of JP2008097804A publication Critical patent/JP2008097804A/ja
Publication of JP2008097804A5 publication Critical patent/JP2008097804A5/ja
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/408Address circuits
    • G11C11/4085Word line control circuits, e.g. word line drivers, - boosters, - pull-up, - pull-down, - precharge
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/08Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/12Group selection circuits, e.g. for memory block selection, chip selection, array selection
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/4074Power supply or voltage generation circuits, e.g. bias voltage generators, substrate voltage generators, back-up power, power control circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C2029/1202Word line control

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Dram (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2007214164A 2006-10-13 2007-08-20 電圧制御装置および電圧制御方法 Pending JP2008097804A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060099652A KR100845774B1 (ko) 2006-10-13 2006-10-13 반도체 메모리 장치 및 이를 이용한 전압 제어 방법

Publications (2)

Publication Number Publication Date
JP2008097804A true JP2008097804A (ja) 2008-04-24
JP2008097804A5 JP2008097804A5 (enExample) 2010-09-24

Family

ID=39302947

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007214164A Pending JP2008097804A (ja) 2006-10-13 2007-08-20 電圧制御装置および電圧制御方法

Country Status (3)

Country Link
US (2) US7502268B2 (enExample)
JP (1) JP2008097804A (enExample)
KR (1) KR100845774B1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009268058A (ja) * 2008-04-28 2009-11-12 Hynix Semiconductor Inc センシング遅延回路及びこれを用いた半導体メモリー装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100845776B1 (ko) * 2006-11-23 2008-07-14 주식회사 하이닉스반도체 반도체 메모리 장치의 센스앰프 제어회로 및 방법
KR101539402B1 (ko) * 2008-10-23 2015-07-27 삼성전자주식회사 반도체 패키지
KR101047003B1 (ko) * 2009-06-26 2011-07-06 주식회사 하이닉스반도체 프리차지신호 생성회로 및 반도체 메모리 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61265792A (ja) * 1985-05-20 1986-11-25 Fujitsu Ltd 半導体記憶回路
JPH01162296A (ja) * 1987-12-19 1989-06-26 Sony Corp Dram
JPH0855497A (ja) * 1994-06-08 1996-02-27 Samsung Electron Co Ltd 半導体メモリ装置のバーンインテスト回路

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JPS62228177A (ja) * 1986-03-29 1987-10-07 Toshiba Corp 半導体集積回路用許容入力電圧検査回路
US5402375A (en) * 1987-11-24 1995-03-28 Hitachi, Ltd Voltage converter arrangement for a semiconductor memory
JP2737293B2 (ja) * 1989-08-30 1998-04-08 日本電気株式会社 Mos型半導体記憶装置
JP2821278B2 (ja) * 1991-04-15 1998-11-05 日本電気アイシーマイコンシステム株式会社 半導体集積回路
US5901105A (en) * 1995-04-05 1999-05-04 Ong; Adrian E Dynamic random access memory having decoding circuitry for partial memory blocks
JP3607760B2 (ja) 1995-10-13 2005-01-05 富士通株式会社 半導体集積回路装置
JPH10106257A (ja) * 1996-09-06 1998-04-24 Texas Instr Inc <Ti> 集積回路のメモリ装置及びプリチャージ動作を与える方法
JP3742191B2 (ja) * 1997-06-06 2006-02-01 株式会社東芝 半導体集積回路装置
JP4090570B2 (ja) * 1998-06-02 2008-05-28 株式会社ルネサステクノロジ 半導体装置、データ処理システム及び不揮発性メモリセルの閾値変更方法
KR100281693B1 (ko) * 1998-09-02 2001-02-15 윤종용 고속 삼상 부스터 회로
JP3863313B2 (ja) * 1999-03-19 2006-12-27 富士通株式会社 半導体記憶装置
JP4555416B2 (ja) * 1999-09-22 2010-09-29 富士通セミコンダクター株式会社 半導体集積回路およびその制御方法
US6563746B2 (en) * 1999-11-09 2003-05-13 Fujitsu Limited Circuit for entering/exiting semiconductor memory device into/from low power consumption mode and method of controlling internal circuit at low power consumption mode
KR100333710B1 (ko) * 1999-12-28 2002-04-22 박종섭 안정적인 리드 동작을 위한 디디알 에스디램
JP3856424B2 (ja) * 2000-12-25 2006-12-13 株式会社東芝 半導体記憶装置
JP2002231000A (ja) * 2001-02-05 2002-08-16 Mitsubishi Electric Corp 半導体記憶装置
KR100505702B1 (ko) * 2003-08-20 2005-08-02 삼성전자주식회사 웨이퍼 테스트와 포스트 패키지 테스트에서 선택적으로프로그램 가능한 반도체 메모리 장치의 리페어 장치 및 그리페어 방법
KR100586555B1 (ko) * 2005-01-17 2006-06-08 주식회사 하이닉스반도체 내부전압 생성 제어회로 및 이를 이용한 내부전압 생성회로

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61265792A (ja) * 1985-05-20 1986-11-25 Fujitsu Ltd 半導体記憶回路
JPH01162296A (ja) * 1987-12-19 1989-06-26 Sony Corp Dram
JPH0855497A (ja) * 1994-06-08 1996-02-27 Samsung Electron Co Ltd 半導体メモリ装置のバーンインテスト回路

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009268058A (ja) * 2008-04-28 2009-11-12 Hynix Semiconductor Inc センシング遅延回路及びこれを用いた半導体メモリー装置

Also Published As

Publication number Publication date
KR20080033683A (ko) 2008-04-17
US7502268B2 (en) 2009-03-10
US20090141572A1 (en) 2009-06-04
US20080089148A1 (en) 2008-04-17
US7916566B2 (en) 2011-03-29
KR100845774B1 (ko) 2008-07-14

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