JP2008031555A5 - - Google Patents
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- Publication number
- JP2008031555A5 JP2008031555A5 JP2007175071A JP2007175071A JP2008031555A5 JP 2008031555 A5 JP2008031555 A5 JP 2008031555A5 JP 2007175071 A JP2007175071 A JP 2007175071A JP 2007175071 A JP2007175071 A JP 2007175071A JP 2008031555 A5 JP2008031555 A5 JP 2008031555A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- plating
- sputtering
- molded product
- resin molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims description 257
- 239000011347 resin Substances 0.000 claims description 257
- 238000007747 plating Methods 0.000 claims description 153
- 229910052751 metal Inorganic materials 0.000 claims description 108
- 239000002184 metal Substances 0.000 claims description 108
- 238000000034 method Methods 0.000 claims description 102
- 239000010408 film Substances 0.000 claims description 98
- 238000004544 sputter deposition Methods 0.000 claims description 96
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 68
- 238000011282 treatment Methods 0.000 claims description 46
- 239000010409 thin film Substances 0.000 claims description 41
- 238000009713 electroplating Methods 0.000 claims description 39
- 238000001994 activation Methods 0.000 claims description 36
- 238000004519 manufacturing process Methods 0.000 claims description 31
- 230000004913 activation Effects 0.000 claims description 29
- 229910052759 nickel Inorganic materials 0.000 claims description 29
- 239000011651 chromium Substances 0.000 claims description 26
- 238000004140 cleaning Methods 0.000 claims description 25
- 238000009832 plasma treatment Methods 0.000 claims description 25
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 18
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 18
- 229910052804 chromium Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 239000012298 atmosphere Substances 0.000 claims description 16
- 230000015572 biosynthetic process Effects 0.000 claims description 16
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 15
- 239000001301 oxygen Substances 0.000 claims description 15
- 229910052760 oxygen Inorganic materials 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 238000012986 modification Methods 0.000 claims description 12
- 230000004048 modification Effects 0.000 claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 229910052786 argon Inorganic materials 0.000 claims description 9
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 6
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 5
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 3
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052707 ruthenium Inorganic materials 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 1
- 238000002425 crystallisation Methods 0.000 claims 1
- 230000008025 crystallization Effects 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 description 25
- 238000005530 etching Methods 0.000 description 23
- 239000000463 material Substances 0.000 description 23
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 18
- 238000005259 measurement Methods 0.000 description 13
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 12
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 12
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- 239000002253 acid Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 description 10
- 239000005020 polyethylene terephthalate Substances 0.000 description 10
- 238000007772 electroless plating Methods 0.000 description 9
- 238000000465 moulding Methods 0.000 description 9
- 239000002994 raw material Substances 0.000 description 9
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 238000002474 experimental method Methods 0.000 description 8
- 229910018487 Ni—Cr Inorganic materials 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 238000001755 magnetron sputter deposition Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229920001707 polybutylene terephthalate Polymers 0.000 description 5
- -1 polyethylene terephthalate Polymers 0.000 description 5
- 238000002203 pretreatment Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 4
- 239000004677 Nylon Substances 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 229920001778 nylon Polymers 0.000 description 4
- 238000010422 painting Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 3
- 229920001955 polyphenylene ether Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000000427 thin-film deposition Methods 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229910000599 Cr alloy Inorganic materials 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 239000012789 electroconductive film Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 2
- 238000007591 painting process Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000000711 cancerogenic effect Effects 0.000 description 1
- 231100000315 carcinogenic Toxicity 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 235000021189 garnishes Nutrition 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- CVMIVKAWUQZOBP-UHFFFAOYSA-L manganic acid Chemical compound O[Mn](O)(=O)=O CVMIVKAWUQZOBP-UHFFFAOYSA-L 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007175071A JP4776033B2 (ja) | 2006-07-05 | 2007-07-03 | スパッタリングによる樹脂導電化を利用した装飾めっき品の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006185652 | 2006-07-05 | ||
| JP2006185652 | 2006-07-05 | ||
| JP2007175071A JP4776033B2 (ja) | 2006-07-05 | 2007-07-03 | スパッタリングによる樹脂導電化を利用した装飾めっき品の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008031555A JP2008031555A (ja) | 2008-02-14 |
| JP2008031555A5 true JP2008031555A5 (enExample) | 2008-09-25 |
| JP4776033B2 JP4776033B2 (ja) | 2011-09-21 |
Family
ID=39121294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007175071A Active JP4776033B2 (ja) | 2006-07-05 | 2007-07-03 | スパッタリングによる樹脂導電化を利用した装飾めっき品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4776033B2 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5070767B2 (ja) * | 2006-08-28 | 2012-11-14 | トヨタ自動車株式会社 | めっき処理方法及びファインピッチ配線基板の製造方法 |
| JP5256680B2 (ja) * | 2007-10-04 | 2013-08-07 | 秀和 三村 | 電鋳法における形状転写導電層の形成方法 |
| CN102272023A (zh) * | 2009-01-12 | 2011-12-07 | 莱特拉姆有限责任公司 | 熔合金属的塑料传送带组件和制造方法 |
| CN102317504B (zh) | 2009-02-13 | 2014-01-15 | 日产自动车株式会社 | 镀铬部件及其制造方法 |
| CN102365771A (zh) | 2009-03-31 | 2012-02-29 | 新日本制铁株式会社 | 使用了非水电解质的二次电池的金属外装壳体用原材料及金属外装壳体、二次电池、金属外装壳体用原材料的制造方法 |
| JP5851232B2 (ja) * | 2011-12-22 | 2016-02-03 | 日本圧着端子製造株式会社 | 部品 |
| JP5851231B2 (ja) * | 2011-12-22 | 2016-02-03 | 日本圧着端子製造株式会社 | 部品 |
| CN104513980A (zh) * | 2014-11-12 | 2015-04-15 | 惠州建邦精密塑胶有限公司 | 一种塑胶表面形成的金属层结构及其表面处理工艺 |
| CN105177655A (zh) * | 2015-08-20 | 2015-12-23 | 深圳市港鸿信电子有限公司 | 一种透明abs水电镀生产工艺方法 |
| KR101589631B1 (ko) * | 2015-09-11 | 2016-02-12 | 주식회사 삼한산업 | 금속 또는 무니켈 합금의 금도금 방법 |
| JP2019049019A (ja) | 2017-09-07 | 2019-03-28 | 小島プレス工業株式会社 | 金属被覆樹脂製品の製造方法及び金属被覆樹脂基材 |
| US20210340346A1 (en) * | 2018-09-11 | 2021-11-04 | Mitsubishi Engineering-Plastics Corporation | Metal film-coated molded resin articles and production method therefor |
| JP6732263B2 (ja) * | 2019-01-10 | 2020-07-29 | 石川金属工業株式会社 | 樹脂成形部材のめっき処理方法 |
| CN114075657B (zh) * | 2021-11-04 | 2023-01-24 | 核工业西南物理研究院 | 一种提升树脂基复合材料成型构件气密性的方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07111000B2 (ja) * | 1990-04-09 | 1995-11-29 | 荏原ユージライト株式会社 | 高耐食ニッケルめっき方法 |
| JP2678834B2 (ja) * | 1991-06-04 | 1997-11-19 | 関東自動車工業株式会社 | 樹脂成品のクロムメッキ方法 |
| JPH06212405A (ja) * | 1991-10-31 | 1994-08-02 | Hoechst Celanese Corp | ポリフェニレンサルファイド支持体上に銅をめっきする方法 |
| JPH07243038A (ja) * | 1994-03-09 | 1995-09-19 | Sony Corp | 磁気抵抗効果膜の製造方法 |
| JPH08296039A (ja) * | 1995-04-25 | 1996-11-12 | Nippon Steel Corp | 表面にＡｌ薄膜をコーティングしたＦｅ−Ｎｉ合金薄板の製造方法 |
| JP2781362B2 (ja) * | 1995-07-12 | 1998-07-30 | マルイ工業株式会社 | クロムめっき製品の製造方法 |
| US20030116427A1 (en) * | 2001-08-30 | 2003-06-26 | Applied Materials, Inc. | Self-ionized and inductively-coupled plasma for sputtering and resputtering |
| JP2002020861A (ja) * | 2000-07-04 | 2002-01-23 | Canon Inc | 成膜方法及び成膜装置 |
| JP3885493B2 (ja) * | 2000-12-25 | 2007-02-21 | 松下電工株式会社 | 金属被覆成形体及びその製造方法 |
| JP2004082444A (ja) * | 2002-08-26 | 2004-03-18 | Dainippon Printing Co Ltd | 金属層付き樹脂体および配線体 |
| JP2004124186A (ja) * | 2002-10-03 | 2004-04-22 | Canon Inc | イオン化スパッタ法 |
| JP2004311545A (ja) * | 2003-04-03 | 2004-11-04 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法及び高融点金属膜の堆積装置 |
| JP4341023B2 (ja) * | 2004-04-13 | 2009-10-07 | 住友金属鉱山株式会社 | 金属被覆液晶ポリマーフィルムの製造方法 |
| JP4535250B2 (ja) * | 2004-07-08 | 2010-09-01 | 三菱マテリアル株式会社 | 高硬度鋼の高速切削加工で硬質被覆層がすぐれた耐摩耗性を発揮する表面被覆超硬合金製切削工具の製造方法 |
-
2007
- 2007-07-03 JP JP2007175071A patent/JP4776033B2/ja active Active
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