JP4776033B2 - スパッタリングによる樹脂導電化を利用した装飾めっき品の製造方法 - Google Patents
スパッタリングによる樹脂導電化を利用した装飾めっき品の製造方法 Download PDFInfo
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- JP4776033B2 JP4776033B2 JP2007175071A JP2007175071A JP4776033B2 JP 4776033 B2 JP4776033 B2 JP 4776033B2 JP 2007175071 A JP2007175071 A JP 2007175071A JP 2007175071 A JP2007175071 A JP 2007175071A JP 4776033 B2 JP4776033 B2 JP 4776033B2
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- resin
- plating
- sputtering
- molded product
- resin molded
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- Electroplating Methods And Accessories (AREA)
- Physical Vapour Deposition (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007175071A JP4776033B2 (ja) | 2006-07-05 | 2007-07-03 | スパッタリングによる樹脂導電化を利用した装飾めっき品の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006185652 | 2006-07-05 | ||
| JP2006185652 | 2006-07-05 | ||
| JP2007175071A JP4776033B2 (ja) | 2006-07-05 | 2007-07-03 | スパッタリングによる樹脂導電化を利用した装飾めっき品の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008031555A JP2008031555A (ja) | 2008-02-14 |
| JP2008031555A5 JP2008031555A5 (enExample) | 2008-09-25 |
| JP4776033B2 true JP4776033B2 (ja) | 2011-09-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007175071A Active JP4776033B2 (ja) | 2006-07-05 | 2007-07-03 | スパッタリングによる樹脂導電化を利用した装飾めっき品の製造方法 |
Country Status (1)
| Country | Link |
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| JP (1) | JP4776033B2 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5070767B2 (ja) * | 2006-08-28 | 2012-11-14 | トヨタ自動車株式会社 | めっき処理方法及びファインピッチ配線基板の製造方法 |
| JP5256680B2 (ja) * | 2007-10-04 | 2013-08-07 | 秀和 三村 | 電鋳法における形状転写導電層の形成方法 |
| US20110284347A1 (en) * | 2009-01-12 | 2011-11-24 | Laitram, L.L.C. | Metal-fused plastic conveyor belt components and methods of making |
| WO2010092622A1 (en) | 2009-02-13 | 2010-08-19 | Nissan Motor Co., Ltd. | Chrome-plated part and manufacturing method of the same |
| WO2010113502A1 (ja) | 2009-03-31 | 2010-10-07 | 新日本製鐵株式会社 | 非水電解質を用いた二次電池の金属外装ケース用素材及び金属外装ケース、二次電池、金属外装ケース用素材の製造方法 |
| JP5851232B2 (ja) * | 2011-12-22 | 2016-02-03 | 日本圧着端子製造株式会社 | 部品 |
| JP5851231B2 (ja) * | 2011-12-22 | 2016-02-03 | 日本圧着端子製造株式会社 | 部品 |
| CN104513980A (zh) * | 2014-11-12 | 2015-04-15 | 惠州建邦精密塑胶有限公司 | 一种塑胶表面形成的金属层结构及其表面处理工艺 |
| CN105177655A (zh) * | 2015-08-20 | 2015-12-23 | 深圳市港鸿信电子有限公司 | 一种透明abs水电镀生产工艺方法 |
| KR101589631B1 (ko) * | 2015-09-11 | 2016-02-12 | 주식회사 삼한산업 | 금속 또는 무니켈 합금의 금도금 방법 |
| JP2019049019A (ja) | 2017-09-07 | 2019-03-28 | 小島プレス工業株式会社 | 金属被覆樹脂製品の製造方法及び金属被覆樹脂基材 |
| EP3851553A4 (en) * | 2018-09-11 | 2021-11-03 | Mitsubishi Engineering-Plastics Corporation | METAL-COATED MOLDED ARTICLES OF RESIN AND METHOD FOR THEIR MANUFACTURING |
| JP6732263B2 (ja) * | 2019-01-10 | 2020-07-29 | 石川金属工業株式会社 | 樹脂成形部材のめっき処理方法 |
| CN114075657B (zh) * | 2021-11-04 | 2023-01-24 | 核工业西南物理研究院 | 一种提升树脂基复合材料成型构件气密性的方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07111000B2 (ja) * | 1990-04-09 | 1995-11-29 | 荏原ユージライト株式会社 | 高耐食ニッケルめっき方法 |
| JP2678834B2 (ja) * | 1991-06-04 | 1997-11-19 | 関東自動車工業株式会社 | 樹脂成品のクロムメッキ方法 |
| JPH06212405A (ja) * | 1991-10-31 | 1994-08-02 | Hoechst Celanese Corp | ポリフェニレンサルファイド支持体上に銅をめっきする方法 |
| JPH07243038A (ja) * | 1994-03-09 | 1995-09-19 | Sony Corp | 磁気抵抗効果膜の製造方法 |
| JPH08296039A (ja) * | 1995-04-25 | 1996-11-12 | Nippon Steel Corp | 表面にAl薄膜をコーティングしたFe−Ni合金薄板の製造方法 |
| JP2781362B2 (ja) * | 1995-07-12 | 1998-07-30 | マルイ工業株式会社 | クロムめっき製品の製造方法 |
| US20030116427A1 (en) * | 2001-08-30 | 2003-06-26 | Applied Materials, Inc. | Self-ionized and inductively-coupled plasma for sputtering and resputtering |
| JP2002020861A (ja) * | 2000-07-04 | 2002-01-23 | Canon Inc | 成膜方法及び成膜装置 |
| JP3885493B2 (ja) * | 2000-12-25 | 2007-02-21 | 松下電工株式会社 | 金属被覆成形体及びその製造方法 |
| JP2004082444A (ja) * | 2002-08-26 | 2004-03-18 | Dainippon Printing Co Ltd | 金属層付き樹脂体および配線体 |
| JP2004124186A (ja) * | 2002-10-03 | 2004-04-22 | Canon Inc | イオン化スパッタ法 |
| JP2004311545A (ja) * | 2003-04-03 | 2004-11-04 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法及び高融点金属膜の堆積装置 |
| JP4341023B2 (ja) * | 2004-04-13 | 2009-10-07 | 住友金属鉱山株式会社 | 金属被覆液晶ポリマーフィルムの製造方法 |
| JP4535250B2 (ja) * | 2004-07-08 | 2010-09-01 | 三菱マテリアル株式会社 | 高硬度鋼の高速切削加工で硬質被覆層がすぐれた耐摩耗性を発揮する表面被覆超硬合金製切削工具の製造方法 |
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2007
- 2007-07-03 JP JP2007175071A patent/JP4776033B2/ja active Active
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| Publication number | Publication date |
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| JP2008031555A (ja) | 2008-02-14 |
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