JP4776033B2 - スパッタリングによる樹脂導電化を利用した装飾めっき品の製造方法 - Google Patents

スパッタリングによる樹脂導電化を利用した装飾めっき品の製造方法 Download PDF

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JP4776033B2
JP4776033B2 JP2007175071A JP2007175071A JP4776033B2 JP 4776033 B2 JP4776033 B2 JP 4776033B2 JP 2007175071 A JP2007175071 A JP 2007175071A JP 2007175071 A JP2007175071 A JP 2007175071A JP 4776033 B2 JP4776033 B2 JP 4776033B2
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resin
plating
sputtering
molded product
resin molded
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JP2008031555A5 (enExample
JP2008031555A (ja
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邦博 柿原
義則 野田
貴史 王路
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柿原工業株式会社
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JP2007175071A 2006-07-05 2007-07-03 スパッタリングによる樹脂導電化を利用した装飾めっき品の製造方法 Active JP4776033B2 (ja)

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JP2007175071A JP4776033B2 (ja) 2006-07-05 2007-07-03 スパッタリングによる樹脂導電化を利用した装飾めっき品の製造方法

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JP5070767B2 (ja) * 2006-08-28 2012-11-14 トヨタ自動車株式会社 めっき処理方法及びファインピッチ配線基板の製造方法
JP5256680B2 (ja) * 2007-10-04 2013-08-07 秀和 三村 電鋳法における形状転写導電層の形成方法
US20110284347A1 (en) * 2009-01-12 2011-11-24 Laitram, L.L.C. Metal-fused plastic conveyor belt components and methods of making
WO2010092622A1 (en) 2009-02-13 2010-08-19 Nissan Motor Co., Ltd. Chrome-plated part and manufacturing method of the same
WO2010113502A1 (ja) 2009-03-31 2010-10-07 新日本製鐵株式会社 非水電解質を用いた二次電池の金属外装ケース用素材及び金属外装ケース、二次電池、金属外装ケース用素材の製造方法
JP5851232B2 (ja) * 2011-12-22 2016-02-03 日本圧着端子製造株式会社 部品
JP5851231B2 (ja) * 2011-12-22 2016-02-03 日本圧着端子製造株式会社 部品
CN104513980A (zh) * 2014-11-12 2015-04-15 惠州建邦精密塑胶有限公司 一种塑胶表面形成的金属层结构及其表面处理工艺
CN105177655A (zh) * 2015-08-20 2015-12-23 深圳市港鸿信电子有限公司 一种透明abs水电镀生产工艺方法
KR101589631B1 (ko) * 2015-09-11 2016-02-12 주식회사 삼한산업 금속 또는 무니켈 합금의 금도금 방법
JP2019049019A (ja) 2017-09-07 2019-03-28 小島プレス工業株式会社 金属被覆樹脂製品の製造方法及び金属被覆樹脂基材
EP3851553A4 (en) * 2018-09-11 2021-11-03 Mitsubishi Engineering-Plastics Corporation METAL-COATED MOLDED ARTICLES OF RESIN AND METHOD FOR THEIR MANUFACTURING
JP6732263B2 (ja) * 2019-01-10 2020-07-29 石川金属工業株式会社 樹脂成形部材のめっき処理方法
CN114075657B (zh) * 2021-11-04 2023-01-24 核工业西南物理研究院 一种提升树脂基复合材料成型构件气密性的方法

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JPH07111000B2 (ja) * 1990-04-09 1995-11-29 荏原ユージライト株式会社 高耐食ニッケルめっき方法
JP2678834B2 (ja) * 1991-06-04 1997-11-19 関東自動車工業株式会社 樹脂成品のクロムメッキ方法
JPH06212405A (ja) * 1991-10-31 1994-08-02 Hoechst Celanese Corp ポリフェニレンサルファイド支持体上に銅をめっきする方法
JPH07243038A (ja) * 1994-03-09 1995-09-19 Sony Corp 磁気抵抗効果膜の製造方法
JPH08296039A (ja) * 1995-04-25 1996-11-12 Nippon Steel Corp 表面にAl薄膜をコーティングしたFe−Ni合金薄板の製造方法
JP2781362B2 (ja) * 1995-07-12 1998-07-30 マルイ工業株式会社 クロムめっき製品の製造方法
US20030116427A1 (en) * 2001-08-30 2003-06-26 Applied Materials, Inc. Self-ionized and inductively-coupled plasma for sputtering and resputtering
JP2002020861A (ja) * 2000-07-04 2002-01-23 Canon Inc 成膜方法及び成膜装置
JP3885493B2 (ja) * 2000-12-25 2007-02-21 松下電工株式会社 金属被覆成形体及びその製造方法
JP2004082444A (ja) * 2002-08-26 2004-03-18 Dainippon Printing Co Ltd 金属層付き樹脂体および配線体
JP2004124186A (ja) * 2002-10-03 2004-04-22 Canon Inc イオン化スパッタ法
JP2004311545A (ja) * 2003-04-03 2004-11-04 Matsushita Electric Ind Co Ltd 半導体装置の製造方法及び高融点金属膜の堆積装置
JP4341023B2 (ja) * 2004-04-13 2009-10-07 住友金属鉱山株式会社 金属被覆液晶ポリマーフィルムの製造方法
JP4535250B2 (ja) * 2004-07-08 2010-09-01 三菱マテリアル株式会社 高硬度鋼の高速切削加工で硬質被覆層がすぐれた耐摩耗性を発揮する表面被覆超硬合金製切削工具の製造方法

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