JP2007500455A5 - - Google Patents

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Publication number
JP2007500455A5
JP2007500455A5 JP2006533192A JP2006533192A JP2007500455A5 JP 2007500455 A5 JP2007500455 A5 JP 2007500455A5 JP 2006533192 A JP2006533192 A JP 2006533192A JP 2006533192 A JP2006533192 A JP 2006533192A JP 2007500455 A5 JP2007500455 A5 JP 2007500455A5
Authority
JP
Japan
Prior art keywords
encapsulant
underfill encapsulant
underfill
solder bumps
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006533192A
Other languages
English (en)
Japanese (ja)
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JP2007500455A (ja
Filing date
Publication date
Priority claimed from US10/444,398 external-priority patent/US7047633B2/en
Application filed filed Critical
Publication of JP2007500455A publication Critical patent/JP2007500455A/ja
Publication of JP2007500455A5 publication Critical patent/JP2007500455A5/ja
Pending legal-status Critical Current

Links

JP2006533192A 2003-05-23 2004-05-18 予備適用アンダーフィル封入剤の使用方法 Pending JP2007500455A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/444,398 US7047633B2 (en) 2003-05-23 2003-05-23 Method of using pre-applied underfill encapsulant
PCT/US2004/015560 WO2004114374A2 (en) 2003-05-23 2004-05-18 Method of using pre-applied underfill encapsulant

Publications (2)

Publication Number Publication Date
JP2007500455A JP2007500455A (ja) 2007-01-11
JP2007500455A5 true JP2007500455A5 (https=) 2007-07-26

Family

ID=33450648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006533192A Pending JP2007500455A (ja) 2003-05-23 2004-05-18 予備適用アンダーフィル封入剤の使用方法

Country Status (6)

Country Link
US (2) US7047633B2 (https=)
EP (2) EP1627424A2 (https=)
JP (1) JP2007500455A (https=)
KR (1) KR20060009954A (https=)
CN (1) CN100414677C (https=)
WO (1) WO2004114374A2 (https=)

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US9441070B2 (en) 2013-09-11 2016-09-13 Rohm And Haas Electronic Materials Llc Divinylarene dioxide compositions having reduced volatility
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